Inventor · disambiguated record
Sidney B. Rigg
Also filed as: RIGG SIDNEY · RIGG SIDNEY B
32 granted patents·1 pending application·969 citations·filing 1999–2013
98Inventor score
Top patents by PatentIndex Score
33 records- 0198US7683458B2Through-wafer interconnects for photoimager and memory wafersMICRON TECHNOLOGY INC·Filed 2007·Granted Mar 23, 2010·54 cites·17 claims
- 0297US7772116B2Methods of forming blind wafer interconnectsMICRON TECHNOLOGY INC·Filed 2005·Granted Aug 10, 2010·48 cites·55 claims
- 0397US7759800B2Microelectronics devices, having vias, and packaged microelectronic devices having viasMICRON TECHNOLOGY INC·Filed 2006·Granted Jul 20, 2010·51 cites·22 claims
- 0497US7531453B2Microelectronic devices and methods for forming interconnects in microelectronic devicesMICRON TECHNOLOGY INC·Filed 2008·Granted May 12, 2009·45 cites·19 claims
- 0597US7300857B2Through-wafer interconnects for photoimager and memory wafersMICRON TECHNOLOGY INC·Filed 2004·Granted Nov 27, 2007·166 cites·32 claims
- 0697US7091124B2Methods for forming vias in microelectronic devices, and methods for packaging microelectronic devicesMICRON TECHNOLOGY INC·Filed 2003·Granted Aug 15, 2006·114 cites·26 claims
- 0796US7829976B2Microelectronic devices and methods for forming interconnects in microelectronic devicesMICRON TECHNOLOGY INC·Filed 2009·Granted Nov 9, 2010·31 cites·22 claims
- 0896US7452743B2Microelectronic imaging units and methods of manufacturing microelectronic imaging units at the wafer levelAPTINA IMAGING CORP·Filed 2005·Granted Nov 18, 2008·52 cites·34 claims
- 0996US7232754B2Microelectronic devices and methods for forming interconnects in microelectronic devicesMICRON TECHNOLOGY INC·Filed 2004·Granted Jun 19, 2007·84 cites·41 claims
- 1095US7956443B2Through-wafer interconnects for photoimager and memory wafersMICRON TECHNOLOGY INC·Filed 2010·Granted Jun 7, 2011·16 cites·17 claims
- 1194US6203404B1Chemical mechanical polishing methodsMICRON TECHNOLOGY INC·Filed 1999·Granted Mar 20, 2001·136 cites·45 claims
- 1292US7989345B2Methods of forming blind wafer interconnects, and related structures and assembliesMICRON TECHNOLOGY INC·Filed 2007·Granted Aug 2, 2011·16 cites·16 claims
- 1391US7413979B2Methods for forming vias in microelectronic devices, and methods for packaging microelectronic devicesMICRON TECHNOLOGY INC·Filed 2006·Granted Aug 19, 2008·16 cites·27 claims
- 1487US8324100B2Methods of forming conductive viasAKRAM SALMAN·Filed 2011·Granted Dec 4, 2012·7 cites·26 claims
- 1586US8669179B2Through-wafer interconnects for photoimager and memory wafersMICRON TECHNOLOGY INC·Filed 2013·Granted Mar 11, 2014·5 cites·13 claims
- 1685US8502353B2Through-wafer interconnects for photoimager and memory wafersAKRAM SALMAN·Filed 2011·Granted Aug 6, 2013·5 cites·11 claims
- 1785US7892972B2Methods for fabricating and filling conductive vias and conductive vias so formedMICRON TECHNOLOGY INC·Filed 2006·Granted Feb 22, 2011·10 cites·30 claims
- 1884US7419841B2Microelectronic imagers and methods of packaging microelectronic imagersMICRON TECHNOLOGY INC·Filed 2006·Granted Sep 2, 2008·10 cites·25 claims
- 1983US7265330B2Microelectronic imagers with optical devices and methods of manufacturing such microelectronic imagersMICRON TECHNOLOGY INC·Filed 2006·Granted Sep 4, 2007·8 cites·28 claims
- 2081US7253390B2Methods for packaging microelectronic imagersMICRON TECHNOLOGY INC·Filed 2006·Granted Aug 7, 2007·8 cites·19 claims
- 2181US7199439B2Microelectronic imagers and methods of packaging microelectronic imagersMICRON TECHNOLOGY INC·Filed 2004·Granted Apr 3, 2007·24 cites·31 claims
- 2280US7262405B2Prefabricated housings for microelectronic imagersMICRON TECHNOLOGY INC·Filed 2004·Granted Aug 28, 2007·24 cites·32 claims
- 2378US8324101B2Semiconductor dice including at least one blind hole, wafers including such semiconductor dice, and intermediate products made while forming at least one blind hole in a substrateAKRAM SALMAN·Filed 2011·Granted Dec 4, 2012·3 cites·20 claims
- 2475US7329943B2Microelectronic devices and methods for forming interconnects in microelectronic devicesMICRON TECHNOLOGY INC·Filed 2006·Granted Feb 12, 2008·4 cites·14 claims
- 2573US7189954B2Microelectronic imagers with optical devices and methods of manufacturing such microelectronic imagersMICRON TECHNOLOGY INC·Filed 2004·Granted Mar 13, 2007·13 cites·15 claims
- 2667US7709776B2Microelectronic imagers with optical devices and methods of manufacturing such microelectronic imagersAPTINA IMAGING CORP·Filed 2009·Granted May 4, 2010·2 cites·22 claims
- 2763US7504615B2Microelectronic imagers with optical devices and methods of manufacturing such microelectronic imagersAPTINA IMAGING CORP·Filed 2007·Granted Mar 17, 2009·1 cites·15 claims
- 2859US6595832B2Chemical mechanical polishing methodsMICRON TECHNOLOGY INC·Filed 2001·Granted Jul 22, 2003·5 cites·52 claims
- 2955US8637962B2Semiconductor dice including at least one blind hole, wafers including such semiconductor dice, and intermediate products made while forming at least one blind hole in a substrateAKRAM SALMAN·Filed 2012·Granted Jan 28, 2014·0 cites·16 claims
- 3051US8294273B2Methods for fabricating and filling conductive vias and conductive vias so formedAKRAM SALMAN·Filed 2011·Granted Oct 23, 2012·0 cites·27 claims
- 3151US7713841B2Methods for thinning semiconductor substrates that employ support structures formed on the substratesMICRON TECHNOLOGY INC·Filed 2003·Granted May 11, 2010·10 cites·16 claims
- 3249US7960829B2Support structure for use in thinning semiconductor substrates and for supporting thinned semiconductor substratesMICRON TECHNOLOGY INC·Filed 2005·Granted Jun 14, 2011·1 cites·19 claims
- 3341US2006177999A1Microelectronic workpieces and methods for forming interconnects in microelectronic workpiecesMICRON TECHNOLOGY INC·Filed 2005·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →