Inventor · disambiguated record
Ling Chen
Also filed as: CHEN LING · CHEN LING-FENG
89 granted patents·38 pending applications·7,978 citations·filing 1995–2024
99Inventor score
Top patents by PatentIndex Score
127 records- 0198US7591907B2Apparatus for hybrid chemical processingAPPLIED MATERIALS INC·Filed 2008·Granted Sep 22, 2009·375 cites·20 claims
- 0298US7402210B2Apparatus and method for hybrid chemical processingAPPLIED MATERIALS INC·Filed 2007·Granted Jul 22, 2008·61 cites·13 claims
- 0398US7270709B2Method and apparatus of generating PDMAT precursorAPPLIED MATERIALS INC·Filed 2005·Granted Sep 18, 2007·50 cites·20 claims
- 0498US7204886B2Apparatus and method for hybrid chemical processingAPPLIED MATERIALS INC·Filed 2003·Granted Apr 17, 2007·525 cites·20 claims
- 0598US7186385B2Apparatus for providing gas to a processing chamberAPPLIED MATERIALS INC·Filed 2002·Granted Mar 6, 2007·128 cites·38 claims
- 0698US6916398B2Gas delivery apparatus and method for atomic layer depositionAPPLIED MATERIALS INC·Filed 2001·Granted Jul 12, 2005·646 cites·21 claims
- 0798US6905541B2Method and apparatus of generating PDMAT precursorAPPLIED MATERIALS INC·Filed 2003·Granted Jun 14, 2005·119 cites·32 claims
- 0898US6607976B2Copper interconnect barrier layer structure and formation methodAPPLIED MATERIALS INC·Filed 2001·Granted Aug 19, 2003·289 cites·14 claims
- 0998US6498091B1Method of using a barrier sputter reactor to remove an underlying barrier layerAPPLIED MATERIALS INC·Filed 2000·Granted Dec 24, 2002·626 cites·31 claims
- 1098US6171661B1Deposition of copper with increased adhesionAPPLIED MATERIALS INC·Filed 1998·Granted Jan 9, 2001·362 cites·26 claims
- 1198US6050506APattern of apertures in a showerhead for chemical vapor depositionAPPLIED MATERIALS INC·Filed 1998·Granted Apr 18, 2000·708 cites·14 claims
- 1297US8070879B2Apparatus and method for hybrid chemical processingCHEN LING·Filed 2009·Granted Dec 6, 2011·29 cites·11 claims
- 1397US7228873B2Valve design and configuration for fast delivery systemAPPLIED MATERIALS INC·Filed 2006·Granted Jun 12, 2007·61 cites·45 claims
- 1497US7026238B2Reliability barrier integration for Cu applicationAPPLIED MATERIALS INC·Filed 2002·Granted Apr 11, 2006·99 cites·21 claims
- 1597US6838125B2Method of film deposition using activated precursor gasesAPPLIED MATERIALS INC·Filed 2002·Granted Jan 4, 2005·197 cites·24 claims
- 1697US6784096B2Methods and apparatus for forming barrier layers in high aspect ratio viasAPPLIED MATERIALS INC·Filed 2002·Granted Aug 31, 2004·137 cites·73 claims
- 1797US6772072B2Method and apparatus for monitoring solid precursor deliveryAPPLIED MATERIALS INC·Filed 2002·Granted Aug 3, 2004·127 cites·35 claims
- 1897US6660622B2Process for removing an underlying layer and depositing a barrier layer in one reactorAPPLIED MATERIALS INC·Filed 2002·Granted Dec 9, 2003·120 cites·23 claims
- 1997US6620956B2Nitrogen analogs of copper II β-diketonates as source reagents for semiconductor processingAPPLIED MATERIALS INC·Filed 2002·Granted Sep 16, 2003·69 cites·10 claims
- 2096US8668776B2Gas delivery apparatus and method for atomic layer depositionCHEN LING·Filed 2010·Granted Mar 11, 2014·21 cites·14 claims
- 2196US7699023B2Gas delivery apparatus for atomic layer depositionAPPLIED MATERIALS INC·Filed 2007·Granted Apr 20, 2010·34 cites·20 claims
- 2296US7597758B2Chemical precursor ampoule for vapor deposition processesAPPLIED MATERIALS INC·Filed 2007·Granted Oct 6, 2009·16 cites·20 claims
- 2396US7569191B2Method and apparatus for providing precursor gas to a processing chamberAPPLIED MATERIALS INC·Filed 2008·Granted Aug 4, 2009·15 cites·22 claims
- 2496US7081271B2Cyclical deposition of refractory metal silicon nitrideAPPLIED MATERIALS INC·Filed 2002·Granted Jul 25, 2006·124 cites·57 claims
- 2596US6402806B1Method for unreacted precursor conversion and effluent removalAPPLIED MATERIALS INC·Filed 2000·Granted Jun 11, 2002·436 cites·34 claims
- 2696US6110530ACVD method of depositing copper films by using improved organocopper precursor blendAPPLIED MATERIALS INC·Filed 1999·Granted Aug 29, 2000·272 cites·4 claims
- 2795US7429361B2Method and apparatus for providing precursor gas to a processing chamberAPPLIED MATERIALS INC·Filed 2006·Granted Sep 30, 2008·23 cites·68 claims
- 2895US7066194B2Valve design and configuration for fast delivery systemAPPLIED MATERIALS INC·Filed 2002·Granted Jun 27, 2006·61 cites·21 claims
- 2995US6972267B2Sequential deposition of tantalum nitride using a tantalum-containing precursor and a nitrogen-containing precursorAPPLIED MATERIALS INC·Filed 2003·Granted Dec 6, 2005·63 cites·20 claims
- 3095US6953742B2Tantalum barrier layer for copper metallizationAPPLIED MATERIALS INC·Filed 2003·Granted Oct 11, 2005·79 cites·36 claims
- 3195US6562715B1Barrier layer structure for copper metallization and method of forming the structureAPPLIED MATERIALS INC·Filed 2000·Granted May 13, 2003·112 cites·8 claims
- 3295US6099649AChemical vapor deposition hot-trap for unreacted precursor conversion and effluent removalAPPLIED MATERIALS INC·Filed 1997·Granted Aug 8, 2000·480 cites·18 claims
- 3393US7780785B2Gas delivery apparatus for atomic layer depositionAPPLIED MATERIALS INC·Filed 2002·Granted Aug 24, 2010·61 cites·26 claims
- 3493US7780788B2Gas delivery apparatus for atomic layer depositionAPPLIED MATERIALS INC·Filed 2005·Granted Aug 24, 2010·17 cites·62 claims
- 3593US7507660B2Deposition processes for tungsten-containing barrier layersAPPLIED MATERIALS INC·Filed 2007·Granted Mar 24, 2009·22 cites·31 claims
- 3693US7422637B2Processing chamber configured for uniform gas flowAPPLIED MATERIALS INC·Filed 2006·Granted Sep 9, 2008·14 cites·19 claims
- 3793US6936906B2Integration of barrier layer and seed layerAPPLIED MATERIALS INC·Filed 2001·Granted Aug 30, 2005·56 cites·31 claims
- 3893US6596643B2CVD TiSiN barrier for copper integrationAPPLIED MATERIALS INC·Filed 2001·Granted Jul 22, 2003·60 cites·20 claims
- 3993US6596085B1Methods and apparatus for improved vaporization of deposition material in a substrate processing systemAPPLIED MATERIALS INC·Filed 2000·Granted Jul 22, 2003·71 cites·6 claims
- 4092US7404985B2Noble metal layer formation for copper film depositionAPPLIED MATERIALS INC·Filed 2003·Granted Jul 29, 2008·60 cites·13 claims
- 4192US6974771B2Methods and apparatus for forming barrier layers in high aspect ratio viasAPPLIED MATERIALS INC·Filed 2004·Granted Dec 13, 2005·46 cites·15 claims
- 4292US6955211B2Method and apparatus for gas temperature control in a semiconductor processing systemAPPLIED MATERIALS INC·Filed 2002·Granted Oct 18, 2005·70 cites·19 claims
- 4392US6309713B1Deposition of tungsten nitride by plasma enhanced chemical vapor depositionAPPLIED MATERIALS INC·Filed 1997·Granted Oct 30, 2001·89 cites·16 claims
- 4491US7576002B2Multi-step barrier deposition methodAPPLIED MATERIALS INC·Filed 2005·Granted Aug 18, 2009·13 cites·44 claims
- 4591US6939801B2Selective deposition of a barrier layer on a dielectric materialAPPLIED MATERIALS INC·Filed 2002·Granted Sep 6, 2005·56 cites·43 claims
- 4690US7494908B2Apparatus for integration of barrier layer and seed layerAPPLIED MATERIALS INC·Filed 2007·Granted Feb 24, 2009·12 cites·28 claims
- 4790US5740009AApparatus for improving wafer and chuck edge protectionAPPLIED MATERIALS INC·Filed 1996·Granted Apr 14, 1998·117 cites·24 claims
- 4889US7352048B2Integration of barrier layer and seed layerAPPLIED MATERIALS INC·Filed 2005·Granted Apr 1, 2008·11 cites·24 claims
- 4989US6958296B2CVD TiSiN barrier for copper integrationAPPLIED MATERIALS INC·Filed 2003·Granted Oct 25, 2005·40 cites·4 claims
- 5089US6811814B2Method for growing thin films by catalytic enhancementAPPLIED MATERIALS INC·Filed 2002·Granted Nov 2, 2004·39 cites·19 claims
Showing the top 50 of 127 patent records by PatentIndex Score.
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