Inventor · disambiguated record
Roy Dale Hollaway
Also filed as: HOLLAWAY ROY D · HOLLAWAY ROY DALE
54 granted patents·4,548 citations·filing 1994–2005
99Inventor score
Top patents by PatentIndex Score
54 records- 0199US6686588B1Optical module with lens integral holderAMKOR TECHNOLOGY INC·Filed 2001·Granted Feb 3, 2004·267 cites·41 claims
- 0299US6571466B1Flip chip image sensor package fabrication methodAMKOR TECHNOLOGY INC·Filed 2000·Granted Jun 3, 2003·282 cites·20 claims
- 0398US6962829B2Method of making near chip size integrated circuit packageAMKOR TECHNOLOGY INC·Filed 2002·Granted Nov 8, 2005·148 cites·19 claims
- 0498US6734419B1Method for forming an image sensor package with vision die in lens housingAMKOR TECHNOLOGY INC·Filed 2001·Granted May 11, 2004·209 cites·14 claims
- 0598US6545345B1Mounting for a package containing a chipAMKOR TECHNOLOGY INC·Filed 2001·Granted Apr 8, 2003·199 cites·14 claims
- 0698US6528869B1Semiconductor package with molded substrate and recessed input/output terminalsAMKOR TECHNOLOGY INC·Filed 2001·Granted Mar 4, 2003·131 cites·33 claims
- 0798US6342406B1Flip chip on glass image sensor package fabrication methodAMKOR TECHNOLOGY INC·Filed 2000·Granted Jan 29, 2002·174 cites·18 claims
- 0897US6530515B1Micromachine stacked flip chip package fabrication methodAMKOR TECHNOLOGY INC·Filed 2000·Granted Mar 11, 2003·151 cites·18 claims
- 0997US5981314ANear chip size integrated circuit packageAMKOR TECHNOLOGY INC·Filed 1996·Granted Nov 9, 1999·280 cites·10 claims
- 1096US6455927B1Micromirror device packageAMKOR TECHNOLOGY INC·Filed 2001·Granted Sep 24, 2002·126 cites·29 claims
- 1196US6268654B1Integrated circuit package having adhesive bead supporting planar lid above planar substrateAMKOR TECHNOLOGY INC·Filed 1999·Granted Jul 31, 2001·198 cites·28 claims
- 1296US6117705AMethod of making integrated circuit package having adhesive bead supporting planar lid above planar substrateAMKOR TECHNOLOGY INC·Filed 1998·Granted Sep 12, 2000·202 cites·38 claims
- 1395US6291884B1Chip-size semiconductor packagesAMKOR TECHNOLOGY INC·Filed 1999·Granted Sep 18, 2001·182 cites·22 claims
- 1494US6943429B1Wafer having alignment marks extending from a first to a second surface of the waferAMKOR TECHNOLOGY INC·Filed 2001·Granted Sep 13, 2005·97 cites·30 claims
- 1594US6486545B1Pre-drilled ball grid array packageAMKOR TECHNOLOGY INC·Filed 2001·Granted Nov 26, 2002·92 cites·34 claims
- 1694US6228676B1Near chip size integrated circuit packageAMKOR TECHNOLOGY INC·Filed 1999·Granted May 8, 2001·151 cites·13 claims
- 1793US6849916B1Flip chip on glass sensor packageAMKOR TECHNOLOGY INC·Filed 2000·Granted Feb 1, 2005·64 cites·28 claims
- 1893US6522015B1Micromachine stacked wirebonded packageAMKOR TECHNOLOGY INC·Filed 2000·Granted Feb 18, 2003·70 cites·21 claims
- 1993US6399463B1Method of singulation using laser cuttingAMKOR TECHNOLOGY INC·Filed 2001·Granted Jun 4, 2002·74 cites·8 claims
- 2092US6528875B1Vacuum sealed package for semiconductor chipAMKOR TECHNOLOGY INC·Filed 2001·Granted Mar 4, 2003·75 cites·14 claims
- 2191US6399418B1Method for forming a reduced thickness packaged electronic deviceAMKOR TECHNOLOGY INC·Filed 2001·Granted Jun 4, 2002·65 cites·26 claims
- 2290US7609461B1Optical module having cavity substrateAMKOR TECHNOLOGY INC·Filed 2005·Granted Oct 27, 2009·16 cites·16 claims
- 2390US6580167B1Heat spreader with spring IC packageAMKOR TECHNOLOGY INC·Filed 2001·Granted Jun 17, 2003·61 cites·26 claims
- 2489US7059040B1Optical module with lens integral holder fabrication methodAMKOR TECHNOLOGY INC·Filed 2001·Granted Jun 13, 2006·46 cites·34 claims
- 2589US6765801B1Optical track drain packageAMKOR TECHNOLOGY INC·Filed 2001·Granted Jul 20, 2004·55 cites·20 claims
- 2689US6624921B1Micromirror device package fabrication methodAMKOR TECHNOLOGY INC·Filed 2001·Granted Sep 23, 2003·72 cites·26 claims
- 2789US6586824B1Reduced thickness packaged electronic deviceAMKOR TECHNOLOGY INC·Filed 2001·Granted Jul 1, 2003·56 cites·12 claims
- 2889US6532157B1Angulated semiconductor packagesAMKOR TECHNOLOGY INC·Filed 2000·Granted Mar 11, 2003·49 cites·23 claims
- 2989US6512219B1Fabrication method for integrally connected image sensor packages having a window support in contact with the window and active areaAMKOR TECHNOLOGY INC·Filed 2000·Granted Jan 28, 2003·56 cites·16 claims
- 3088US6686580B1Image sensor package with reflectorAMKOR TECHNOLOGY INC·Filed 2001·Granted Feb 3, 2004·49 cites·21 claims
- 3188US6627864B1Thin image sensor packageAMKOR TECHNOLOGY INC·Filed 1999·Granted Sep 30, 2003·92 cites·20 claims
- 3287US6562655B1Heat spreader with spring IC package fabrication methodAMKOR TECHNOLOGY INC·Filed 2001·Granted May 13, 2003·45 cites·21 claims
- 3387US6420776B1Structure including electronic components singulated using laser cuttingAMKOR TECHNOLOGY INC·Filed 2001·Granted Jul 16, 2002·39 cites·8 claims
- 3486US6869861B1Back-side wafer singulation methodAMKOR TECHNOLOGY INC·Filed 2001·Granted Mar 22, 2005·34 cites·19 claims
- 3586US6816523B1VCSEL package and fabrication methodAMKOR TECHNOLOGY INC·Filed 2001·Granted Nov 9, 2004·42 cites·41 claims
- 3686US5950074AMethod of making an integrated circuit packageAMKOR TECHNOLOGY INC·Filed 1998·Granted Sep 7, 1999·75 cites·36 claims
- 3785US6967395B1Mounting for a package containing a chipAMKOR TECHNOLOGY INC·Filed 2003·Granted Nov 22, 2005·39 cites·15 claims
- 3884US6777789B1Mounting for a package containing a chipAMKOR TECHNOLOGY INC·Filed 2003·Granted Aug 17, 2004·31 cites·17 claims
- 3983US6627987B1Ceramic semiconductor package and method for fabricating the packageAMKOR TECHNOLOGY INC·Filed 2001·Granted Sep 30, 2003·35 cites·19 claims
- 4081US6638789B1Micromachine stacked wirebonded package fabrication methodAMKOR TECHNOLOGY INC·Filed 2000·Granted Oct 28, 2003·29 cites·23 claims
- 4181US6396043B1Thin image sensor package fabrication methodAMKOR TECHNOLOGY INC·Filed 1999·Granted May 28, 2002·59 cites·16 claims
- 4281US6034429AIntegrated circuit packageAMKOR TECHNOLOGY INC·Filed 1997·Granted Mar 7, 2000·55 cites·75 claims
- 4379US6515269B1Integrally connected image sensor packages having a window support in contact with a window and the active areaAMKOR TECHNOLOGY INC·Filed 2000·Granted Feb 4, 2003·28 cites·25 claims
- 4478US5796163ASolder ball jointAMKOR TECHNOLOGY INC·Filed 1997·Granted Aug 18, 1998·53 cites·13 claims
- 4576US5482736AMethod for applying flux to ball grid array packageAMKOR ELECTRONICS INC·Filed 1994·Granted Jan 9, 1996·54 cites·13 claims
- 4675US6661080B1Structure for backside saw cavity protectionAMKOR TECHNOLOGY INC·Filed 2001·Granted Dec 9, 2003·18 cites·6 claims
- 4774US6610167B1Method for fabricating a special-purpose die using a polymerizable tapeAMKOR TECHNOLOGY INC·Filed 2001·Granted Aug 26, 2003·18 cites·23 claims
- 4871US6730536B1Pre-drilled image sensor package fabrication methodAMKOR TECHNOLOGY INC·Filed 2001·Granted May 4, 2004·16 cites·19 claims
- 4971US6572944B1Structure for fabricating a special-purpose die using a polymerizable tapeAMKOR TECHNOLOGY INC·Filed 2001·Granted Jun 3, 2003·13 cites·25 claims
- 5067US6717126B1Method of fabricating and using an image sensor package with reflectorAMKOR TECHNOLOGY INC·Filed 2001·Granted Apr 6, 2004·13 cites·21 claims
Showing the top 50 of 54 patent records by PatentIndex Score.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →