Inventor · disambiguated record
Qing Zhang
Also filed as: ZHANG QING · ZHANG QING ZHANG
23 granted patents·1 pending application·180 citations·filing 2007–2020
95Inventor score
Top patents by PatentIndex Score
24 records- 0197US7691747B2Semiconductor device and method for forming passive circuit elements with through silicon vias to backside interconnect structuresSTATS CHIPPAC LTD·Filed 2007·Granted Apr 6, 2010·62 cites·19 claims
- 0294US7790503B2Semiconductor device and method of forming integrated passive device moduleSTATS CHIPPAC LTD·Filed 2007·Granted Sep 7, 2010·32 cites·22 claims
- 0385US8310058B2Semiconductor device and method for forming passive circuit elements with through silicon vias to backside interconnect structuresLIN YAOJIAN·Filed 2010·Granted Nov 13, 2012·6 cites·26 claims
- 0485US8304904B2Semiconductor device with solder bump formed on high topography plated Cu padsLIN YAOJIAN·Filed 2010·Granted Nov 6, 2012·6 cites·18 claims
- 0584US8592311B2Semiconductor device and method for forming passive circuit elements with through silicon vias to backside interconnect structuresLIN YAOJIAN·Filed 2012·Granted Nov 26, 2013·5 cites·24 claims
- 0683US8409970B2Semiconductor device and method of making integrated passive devicesLIN YAOJIAN·Filed 2007·Granted Apr 2, 2013·10 cites·32 claims
- 0781US8124490B2Semiconductor device and method of forming passive devicesLIN YAOJIAN·Filed 2007·Granted Feb 28, 2012·9 cites·32 claims
- 0880US8309452B2Method of forming an inductor on a semiconductor waferLIN YAOJIAN·Filed 2010·Granted Nov 13, 2012·4 cites·24 claims
- 0980US7749814B2Semiconductor device with integrated passive circuit and method of making the same using sacrificial substrateSTATS CHIPPAC LTD·Filed 2008·Granted Jul 6, 2010·9 cites·25 claims
- 1079US7682959B2Method of forming solder bump on high topography plated CuSTATS CHIPPAC LTD·Filed 2007·Granted Mar 23, 2010·7 cites·22 claims
- 1178US9349723B2Semiconductor device and method of forming passive devicesLIN YAOJIAN·Filed 2012·Granted May 24, 2016·4 cites·14 claims
- 1277US11252383B2System, apparatus and method for displaying image dataHUAWEI TECH CO LTD·Filed 2019·Granted Feb 15, 2022·2 cites·14 claims
- 1374US7727876B2Semiconductor device and method of protecting passivation layer in a solder bump processSTATS CHIPPAC LTD·Filed 2007·Granted Jun 1, 2010·5 cites·19 claims
- 1472US7772106B2Method of forming an inductor on a semiconductor waferSTATS CHIPPAC LTD·Filed 2007·Granted Aug 10, 2010·4 cites·20 claims
- 1569US8166997B2Toilet flush water supply deviceFUKUZAWA EIJI·Filed 2008·Granted May 1, 2012·9 cites·13 claims
- 1664US9337141B2Method of forming an inductor on a semiconductor waferSTATS CHIPPAC LTD·Filed 2012·Granted May 10, 2016·1 cites·25 claims
- 1764US8026593B2Integrated circuit package system with protected conductive layers for pads and method of manufacturing thereofSTATS CHIPPAC LTD·Filed 2007·Granted Sep 27, 2011·2 cites·10 claims
- 1863US9449925B2Integrated passive devicesSTATS CHIPPAC LTD·Filed 2013·Granted Sep 20, 2016·1 cites·18 claims
- 1963US8389396B2Method for manufacture of integrated circuit package system with protected conductive layers for padsLIN YAOJIAN·Filed 2011·Granted Mar 5, 2013·1 cites·10 claims
- 2061US8395053B2Circuit system with circuit element and reference planeLIN YAOJIAN·Filed 2007·Granted Mar 12, 2013·1 cites·20 claims
- 2159US11409118B2Device and method for generating a 3D light fieldHUAWEI TECH CO LTD·Filed 2019·Granted Aug 9, 2022·0 cites·18 claims
- 2254US9240384B2Semiconductor device with solder bump formed on high topography plated Cu padsSTATS CHIPPAC LTD·Filed 2012·Granted Jan 19, 2016·0 cites·16 claims
- 2349US11874459B2Display device for head-mounting and display methodHUAWEI TECH CO LTD·Filed 2020·Granted Jan 16, 2024·0 cites·11 claims
- 2445US2012211881A9Semiconductor Device and Method of Protecting Passivation Layer in a Solder Bump ProcessLIN YAOJIAN·Filed 2010·Application pending·0 cites
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