Inventor · disambiguated record
Jacob Crane
Also filed as: CRANE JACOB · CRANE JACOB AARON
27 granted patents·1 pending application·839 citations·filing 1974–2018
97Inventor score
Top patents by PatentIndex Score
28 records- 0195US4888449ASemiconductor packageOLIN CORP·Filed 1988·Granted Dec 19, 1989·152 cites·47 claims
- 0293US4897508AMetal electronic packageOLIN CORP·Filed 1988·Granted Jan 30, 1990·121 cites·36 claims
- 0392US5137685AMachinable copper alloys having reduced lead contentOLIN CORP·Filed 1991·Granted Aug 11, 1992·56 cites·30 claims
- 0484US5015803AThermal performance package for integrated circuit chipOLIN CORP·Filed 1989·Granted May 14, 1991·55 cites·19 claims
- 0582US5315155AElectronic package with stress relief channelOLIN CORP·Filed 1992·Granted May 24, 1994·74 cites·12 claims
- 0681US5288458AMachinable copper alloys having reduced lead contentOLIN CORP·Filed 1992·Granted Feb 22, 1994·24 cites·18 claims
- 0779US5139891APalladium alloys having utility in electrical applicationsOLIN CORP·Filed 1991·Granted Aug 18, 1992·38 cites·25 claims
- 0876US5504372AAdhesively sealed metal electronic package incorporating a multi-chip moduleOLIN CORP·Filed 1994·Granted Apr 2, 1996·44 cites·10 claims
- 0976US5409552AMachinable copper alloys having reduced lead contentOLIN CORP·Filed 1993·Granted Apr 25, 1995·20 cites·11 claims
- 1075US5236789APalladium alloys having utility in electrical applicationsOLIN CORP·Filed 1992·Granted Aug 17, 1993·35 cites·5 claims
- 1174US5013871AKit for the assembly of a metal electronic packageOLIN CORP·Filed 1990·Granted May 7, 1991·50 cites·15 claims
- 1274US4434016APrecipitation hardenable copper alloy and processOLIN CORP·Filed 1983·Granted Feb 28, 1984·20 cites·15 claims
- 1374US4202688AHigh conductivity high temperature copper alloyOLIN CORP·Filed 1979·Granted May 13, 1980·17 cites·11 claims
- 1469US5939214AThermal performance package for integrated circuit chipADVANCED TECHNOLOGY INTERCONNE·Filed 1992·Granted Aug 17, 1999·34 cites·10 claims
- 1566US4767049ASpecial surfaces for wire bondingOLIN CORP·Filed 1986·Granted Aug 30, 1988·31 cites·5 claims
- 1666US3941620AMethod of processing copper base alloysOLIN CORP·Filed 1974·Granted Mar 2, 1976·10 cites·11 claims
- 1762US3941619AProcess for improving the elongation of grain refined copper base alloys containing zinc and aluminumOLIN CORP·Filed 1975·Granted Mar 2, 1976·9 cites·15 claims
- 1859US3940290AProcess for preparing copper base alloysOLIN CORP·Filed 1974·Granted Feb 24, 1976·8 cites·10 claims
- 1957US4071359ACopper base alloysOLIN CORP·Filed 1976·Granted Jan 31, 1978·10 cites·10 claims
- 2056US3976477AHigh conductivity high temperature copper alloyOLIN CORP·Filed 1974·Granted Aug 24, 1976·6 cites·7 claims
- 2140US4822693ACopper-iron-nickel composite material for electrical and electronic applicationsOLIN CORP·Filed 1987·Granted Apr 18, 1989·9 cites·8 claims
- 2239US10533782B2Reverse defrost system and methodsKEEPRITE REFRIGERATION INC·Filed 2018·Granted Jan 14, 2020·0 cites·15 claims
- 2338US3953249ACopper base alloyOLIN CORP·Filed 1974·Granted Apr 27, 1976·2 cites·7 claims
- 2438US2018259234A1Reverse cycle defrost refrigeration systemKEEPRITE REFRIGERATION INC·Filed 2018·Application pending·0 cites
- 2535US4728363AAcicular magnetic particlesOLIN CORP·Filed 1986·Granted Mar 1, 1988·5 cites·6 claims
- 2633US4698140ATechniques for preparing magnetic particles having utility in recording mediaOLIN CORP·Filed 1986·Granted Oct 6, 1987·4 cites·14 claims
- 2733US4657583AMethod of producing ferromagnetic particlesOLIN CORP·Filed 1985·Granted Apr 14, 1987·4 cites·15 claims
- 2829US5017244AProcess for improving the electrical conductivity of a copper-nickel-iron alloyOLIN CORP·Filed 1988·Granted May 21, 1991·1 cites·4 claims
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