Inventor · disambiguated record

Desmond Yok Rue Chong

Also filed as: CHONG DESMOND YOK RUE

1 granted patent·1 pending application·13 citations·filing 2004–2004

35Inventor score

Technology areasH10W

Files withUNITED TEST AND ASSEMBLY CT1 XILINX INC1

Top patents by PatentIndex Score

2 records

0163US7361995B2Molded high density electronic packaging structure for high performance applicationsXILINX INC·Filed 2004·Granted Apr 22, 2008·13 cites·24 claims
0234US2008290509A1Chip Scale Package and Method of Assembling the SameUNITED TEST AND ASSEMBLY CT·Filed 2004·Application pending·0 cites

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →