Inventor · disambiguated record
Min-Tih Lai
Also filed as: LAI MIN-TIH · LAI MIN-TIH TED
14 granted patents·5 pending applications·34 citations·filing 2015–2024
88Inventor score
Top patents by PatentIndex Score
19 records- 0194US10032707B2Post-grind die backside power deliveryINTEL CORP·Filed 2016·Granted Jul 24, 2018·12 cites·25 claims
- 0292US12052206B1Systems and methods for improving interactions with artificial intelligence modelsPractical Creativity LLC·Filed 2024·Granted Jul 30, 2024·12 cites·20 claims
- 0384US10304799B2Land grid array package extensionINTEL CORP·Filed 2016·Granted May 28, 2019·4 cites·15 claims
- 0477US10748873B2Substrates, assembles, and techniques to enable multi-chip flip chip packagesINTEL CORP·Filed 2015·Granted Aug 18, 2020·3 cites·25 claims
- 0574US10122836B2Magnetic convection cooling for handheld deviceINTEL CORP·Filed 2016·Granted Nov 6, 2018·2 cites·14 claims
- 0669US12068283B2Die stack with cascade and vertical connectionsINTEL CORP·Filed 2021·Granted Aug 20, 2024·0 cites·15 claims
- 0769US2024380711A1Systems and methods for improving interactions with artificial intelligence modelsPractical Creativity LLC·Filed 2024·Application pending·0 cites
- 0864US10847450B2Compact wirebonding in stacked-chip system in package, and methods of making sameINTEL CORP·Filed 2016·Granted Nov 24, 2020·1 cites·9 claims
- 0962US10910301B2Post-grind die backside power deliveryINTEL CORP·Filed 2019·Granted Feb 2, 2021·0 cites·25 claims
- 1057US10573575B2Semiconductor package with thermal finsINTEL CORP·Filed 2017·Granted Feb 25, 2020·0 cites·24 claims
- 1157US10483198B2Post-grind die backside power deliveryINTEL CORP·Filed 2018·Granted Nov 19, 2019·0 cites·20 claims
- 1253US10872880B2Land grid array package extensionINTEL CORP·Filed 2019·Granted Dec 22, 2020·0 cites·14 claims
- 1350US11652031B2Shrinkable package assemblyINTEL CORP·Filed 2018·Granted May 16, 2023·0 cites·17 claims
- 1450US11171114B2Die stack with cascade and vertical connectionsINTEL CORP·Filed 2015·Granted Nov 9, 2021·0 cites·7 claims
- 1537US2019215970A1Surface mounted contact fingersINTEL CORP·Filed 2016·Application pending·0 cites
- 1637US2018088628A1Leadframe for surface mounted contact fingersINTEL CORP·Filed 2016·Application pending·0 cites
- 1736US2019279954A1Microelectronic device stack having a ground shielding layerINTEL CORP·Filed 2016·Application pending·0 cites
- 1834US10770429B2Microelectronic device stacks having interior window wirebondingINTEL CORP·Filed 2016·Granted Sep 8, 2020·0 cites·15 claims
- 1933US2019035720A1Stress distribution interposer for mitigating substrate crackingINTEL CORP·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →