Inventor · disambiguated record
Huong Do
Also filed as: DO HUONG · DO HUONG T · DO HUONG THU
16 granted patents·3 pending applications·556 citations·filing 1999–2025
93Inventor score
Files withINTEL CORP19
Top patents by PatentIndex Score
19 records- 0198US6446317B1Hybrid capacitor and method of fabrication thereforINTEL CORP·Filed 2000·Granted Sep 10, 2002·208 cites·16 claims
- 0295US6532143B2Multiple tier array capacitorINTEL CORP·Filed 2000·Granted Mar 11, 2003·101 cites·14 claims
- 0394US6366467B1Dual-socket interposer and method of fabrication thereforINTEL CORP·Filed 2000·Granted Apr 2, 2002·97 cites·12 claims
- 0489US11335620B2Package inductor having thermal solution structuresINTEL CORP·Filed 2018·Granted May 17, 2022·8 cites·16 claims
- 0587US6469908B2Dual-socket interposer and method of fabrication thereforINTEL CORP·Filed 2002·Granted Oct 22, 2002·40 cites·7 claims
- 0686US11690165B2Package substrate inductor having thermal interconnect structuresINTEL CORP·Filed 2022·Granted Jun 27, 2023·1 cites·14 claims
- 0786US6920051B2Hybrid capacitor, circuit, and systemINTEL CORP·Filed 2002·Granted Jul 19, 2005·37 cites·11 claims
- 0882US6483692B2Capacitor with extended surface lands and method of fabrication thereforINTEL CORP·Filed 2000·Granted Nov 19, 2002·33 cites·29 claims
- 0973US11955426B2Package-integrated multi-turn coil embedded in a package magnetic coreINTEL CORP·Filed 2022·Granted Apr 9, 2024·0 cites·15 claims
- 1073US2025294781A1Magnetic core inductors on package substratesINTEL CORP·Filed 2025·Application pending·0 cites
- 1171US11393751B2Package-integrated multi-turn coil embedded in a package magnetic coreINTEL CORP·Filed 2018·Granted Jul 19, 2022·1 cites·15 claims
- 1270US12336196B2Magnetic core inductors on package substratesINTEL CORP·Filed 2018·Granted Jun 17, 2025·1 cites·20 claims
- 1367US11357096B2Package substrate inductor having thermal interconnect structuresINTEL CORP·Filed 2018·Granted Jun 7, 2022·1 cites·18 claims
- 1463US12154710B2Package embedded magnetic power transformers for SMPSINTEL CORP·Filed 2020·Granted Nov 26, 2024·0 cites·8 claims
- 1562US6303871B1Degassing hole design for olga trace impedanceINTEL CORP·Filed 1999·Granted Oct 16, 2001·28 cites·30 claims
- 1660US11676950B2Via-in-via structure for high density package integrated inductorINTEL CORP·Filed 2017·Granted Jun 13, 2023·0 cites·23 claims
- 1759US2025132264A1Glass cores with embedded power delivery componentsINTEL CORP·Filed 2024·Application pending·0 cites
- 1849US11404364B2Multi-layer embedded magnetic inductor coilINTEL CORP·Filed 2018·Granted Aug 2, 2022·0 cites·12 claims
- 1946US2022085143A1Magnetic wires and their applicationsINTEL CORP·Filed 2020·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →