Inventor · disambiguated record
Hollie Reed
Also filed as: REED HOLLIE · REED HOLLIE ANNE
5 granted patents·1 pending application·149 citations·filing 2001–2004
84Inventor score
Files withGEORGIA TECH RES INST5
Top patents by PatentIndex Score
6 records- 0189US6610593B2Fabrication of semiconductor device with air gaps for ultra low capacitance interconnections and methods of making sameGEORGIA TECH RES INST·Filed 2001·Granted Aug 26, 2003·56 cites·66 claims
- 0286US6690081B2Compliant wafer-level packaging devices and methods of fabricationGEORGIA TECH RES INST·Filed 2001·Granted Feb 10, 2004·44 cites·54 claims
- 0381US6788867B2Backplane, printed wiring board, and/or multi-chip module-level optical interconnect layer having embedded air-gap technologies and methods of fabricationGEORGIA TECH RES INST·Filed 2003·Granted Sep 7, 2004·21 cites·19 claims
- 0480US6785458B2Guided-wave optical interconnections embedded within a microelectronic wafer-level batch packageGEORGIA TECH RES INST·Filed 2002·Granted Aug 31, 2004·19 cites·13 claims
- 0569US6954576B2Guided-wave optical interconnections embedded within a microelectronic wafer-level batch packageGEORGIA TECH RES INST·Filed 2004·Granted Oct 11, 2005·9 cites·10 claims
- 0639US2003012539A1Backplane, printed wiring board, and/or multi-chip module-level optical interconnect layer having embedded air-gap technologies and methods of fabricationFiled 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →