Inventor · disambiguated record
Jan Richter
Also filed as: RICHTER JAN · RICHTER JAN PETER
62 granted patents·18 pending applications·554 citations·filing 1991–2023
98Inventor score
Top patents by PatentIndex Score
80 records- 0197US11527441B2Method for producing a detachment area in a solid bodySILTECTRA GMBH·Filed 2021·Granted Dec 13, 2022·3 cites·11 claims
- 0297US9659502B1Drone range extension via host vehiclesIBM·Filed 2015·Granted May 23, 2017·58 cites·14 claims
- 0397US5256340AMethod of making a three-dimensional object by stereolithography3D SYSTEMS INC·Filed 1992·Granted Oct 26, 1993·172 cites·30 claims
- 0497US5182055AMethod of making a three-dimensional object by stereolithography3D SYSTEMS INC·Filed 1991·Granted Jan 26, 1993·172 cites·18 claims
- 0592US10593590B2Combined wafer production method with laser treatment and temperature-induced stressesSILTECTRA GMBH·Filed 2019·Granted Mar 17, 2020·2 cites·15 claims
- 0691US11004723B2Wafer production methodSILTECTRA GMBH·Filed 2020·Granted May 11, 2021·2 cites·20 claims
- 0789US10978311B2Method for thinning solid body layers provided with componentsSILTECTRA GMBH·Filed 2017·Granted Apr 13, 2021·5 cites·20 claims
- 0883US6264873B1Method of making a three-dimensional object by stereolithography3D SYSTEMS INC·Filed 1999·Granted Jul 24, 2001·45 cites·34 claims
- 0982US12151314B2Device and method for applying pressure to stress-producing layers for improved guidance of a separation crackSILTECTRA GMBH·Filed 2018·Granted Nov 26, 2024·3 cites·18 claims
- 1082US10312135B2Combined wafer production method with laser treatment and temperature-induced stressesSILTECTRA GMBH·Filed 2014·Granted Jun 4, 2019·3 cites·15 claims
- 1182US2023307286A1Method for Producing a Layer of Solid MaterialSILTECTRA GMBH·Filed 2023·Application pending·0 cites
- 1280US8756261B2Method and system for handling binary large objectsPFEIFLE MARTIN·Filed 2010·Granted Jun 17, 2014·6 cites·16 claims
- 1379US11869810B2Method for reducing the thickness of solid-state layers provided with componentsSILTECTRA GMBH·Filed 2018·Granted Jan 9, 2024·2 cites·18 claims
- 1479US10994442B2Method for forming a crack in the edge region of a donor substrate, using an inclined laser beamSILTECTRA GMBH·Filed 2016·Granted May 4, 2021·3 cites·8 claims
- 1578US10289636B2Virtual table generator for analyzing geographic databasesPFEIFLE MARTIN·Filed 2011·Granted May 14, 2019·6 cites·19 claims
- 1678US10141219B2Combined production method for separating a number of thin layers of solid material from a thick solid bodySilectra GmbH·Filed 2014·Granted Nov 27, 2018·4 cites·6 claims
- 1777US12030216B2Method for separating wafers from donor substratesSILTECTRA GMBH·Filed 2023·Granted Jul 9, 2024·0 cites·18 claims
- 1877US11996331B2Method for separating a solid bodySILTECTRA GMBH·Filed 2022·Granted May 28, 2024·0 cites·7 claims
- 1977US11772201B2Method for separating solid body layers from composite structures made of SiC and a metallic coating or electrical componentsSILTECTRA GMBH·Filed 2019·Granted Oct 3, 2023·2 cites·19 claims
- 2077US10843380B2Method for the material-saving production of wafers and processing of wafersSILTECTRA GMBH·Filed 2016·Granted Nov 24, 2020·2 cites·9 claims
- 2177US10664996B2Method and apparatus for the start-up operation of a multi-axis systemSIEMENS AG·Filed 2017·Granted May 26, 2020·2 cites·11 claims
- 2276US9402189B2Method and apparatus for providing activity-based map jobHERE GLOBAL BV·Filed 2014·Granted Jul 26, 2016·7 cites·17 claims
- 2376US9195534B2Method for storing and propagating error information in computer programsSIEMENS AG·Filed 2013·Granted Nov 24, 2015·4 cites·12 claims
- 2476US9075822B2Incremental testing of a navigation databaseRICHTER JAN·Filed 2011·Granted Jul 7, 2015·5 cites·20 claims
- 2576US2024058899A1Method for Producing a Detachment Region in a Solid-state BodySILTECTRA GMBH·Filed 2023·Application pending·0 cites
- 2675US11699616B2Method for producing a layer of solid materialSILTECTRA GMBH·Filed 2021·Granted Jul 11, 2023·0 cites·20 claims
- 2772US12159805B2Method for producing wafers with modification lines of defined orientationSILTECTRA GMBH·Filed 2018·Granted Dec 3, 2024·1 cites·21 claims
- 2871US11309191B2Method for modifying substrates based on crystal lattice dislocation densitySILTECTRA GMBH·Filed 2019·Granted Apr 19, 2022·1 cites·25 claims
- 2970US11518066B2Method of treating a solid layer bonded to a carrier substrateSILTECTRA GMBH·Filed 2020·Granted Dec 6, 2022·0 cites·16 claims
- 3070US10676386B2Method for guiding a crack in the peripheral region of a donor substrateSILTECTRA GMBH·Filed 2019·Granted Jun 9, 2020·0 cites·17 claims
- 3170US8566346B2Page server for navigation dataRICHTER JAN·Filed 2011·Granted Oct 22, 2013·3 cites·20 claims
- 3269US11407066B2Splitting of a solid using conversion of materialSILTECTRA GMBH·Filed 2015·Granted Aug 9, 2022·1 cites·23 claims
- 3368US10280107B2Method for guiding a crack in the peripheral region of a donor substrateSILTECTRA GMBH·Filed 2016·Granted May 7, 2019·1 cites·16 claims
- 3467US12211702B2Solid body and multi-component arrangementSILTECTRA GMBH·Filed 2021·Granted Jan 28, 2025·0 cites·16 claims
- 3567US9722628B2Method in a computer system, computer program and data processing systemSIEMENS AG·Filed 2016·Granted Aug 1, 2017·2 cites·17 claims
- 3667US2023330769A1Parent Substrate, Wafer Composite and Methods of Manufacturing Crystalline Substrates and Semiconductor DevicesINFINEON TECHNOLOGIES AG·Filed 2023·Application pending·0 cites
- 3766US10467888B2System and method for dynamically adjusting an emergency coordination simulation systemIBM·Filed 2015·Granted Nov 5, 2019·2 cites·17 claims
- 3865US12097641B2Method for forming a crack in an edge region of a donor substrateSILTECTRA GMBH·Filed 2021·Granted Sep 24, 2024·0 cites·19 claims
- 3965US6036911AMethod of making a three-dimensional object by stereolithography3D SYSTEMS INC·Filed 1998·Granted Mar 14, 2000·33 cites·32 claims
- 4064US11201081B2Method for separating thin layers of solid material from a solid bodySILTECTRA GMBH·Filed 2019·Granted Dec 14, 2021·0 cites·18 claims
- 4164US10079171B2Combined method for producing solids, involving laser treatment and temperature-induced stresses to generate three-dimensional solidsSILTECTRA GMBH·Filed 2014·Granted Sep 18, 2018·1 cites·7 claims
- 4263US11712749B2Parent substrate, wafer composite and methods of manufacturing crystalline substrates and semiconductor devicesINFINEON TECHNOLOGIES AG·Filed 2020·Granted Aug 1, 2023·0 cites·26 claims
- 4361US9160817B2Page server for navigation dataNAVTEQ BV·Filed 2013·Granted Oct 13, 2015·1 cites·18 claims
- 4461US2021299910A1Method for separating a solid-state layer from a solid-state materialSILTECTRA GMBH·Filed 2021·Application pending·0 cites
- 4559US11833617B2Splitting of a solid using conversion of materialSILTECTRA GMBH·Filed 2018·Granted Dec 5, 2023·0 cites·20 claims
- 4659US11787083B2Production facility for separating wafers from donor substratesSILTECTRA GMBH·Filed 2018·Granted Oct 17, 2023·0 cites·21 claims
- 4758US2015324871A1Contextualized fair ranking of citizen sensor reportsIBM·Filed 2014·Application pending·0 cites
- 4858US2015379170A1Modelling and planning population movement scenariosIBM·Filed 2014·Application pending·0 cites
- 4957US2019096746A1Combined production mehtod for separating a number of thin layers of solid material from a thick solid bodySILTECTRA GMBH·Filed 2018·Application pending·0 cites
- 5054US10930560B2Laser-based separation methodSILTECTRA GMBH·Filed 2015·Granted Feb 23, 2021·0 cites·21 claims
Showing the top 50 of 80 patent records by PatentIndex Score.
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