Assignee
SILTECTRA GMBH
DE·45 granted patents·10 pending applications·36 citations·filing 2014–2025
Top patents by PatentIndex Score
55 records- 0197US11527441B2Method for producing a detachment area in a solid bodySILTECTRA GMBH·Filed 2021·Granted Dec 13, 2022·3 cites·11 claims
- 0293US11014199B2Method of modifying a solid using laser lightSILTECTRA GMBH·Filed 2020·Granted May 25, 2021·2 cites·26 claims
- 0392US10593590B2Combined wafer production method with laser treatment and temperature-induced stressesSILTECTRA GMBH·Filed 2019·Granted Mar 17, 2020·2 cites·15 claims
- 0491US11004723B2Wafer production methodSILTECTRA GMBH·Filed 2020·Granted May 11, 2021·2 cites·20 claims
- 0591US10661392B2Splitting of a solid using conversion of materialSILTECTRA GMBH·Filed 2019·Granted May 26, 2020·2 cites·18 claims
- 0689US10978311B2Method for thinning solid body layers provided with componentsSILTECTRA GMBH·Filed 2017·Granted Apr 13, 2021·5 cites·20 claims
- 0788USRE50809EMethod of modifying a solid using laser lightSILTECTRA GMBH·Filed 2023·Granted Mar 3, 2026·0 cites·49 claims
- 0882US12151314B2Device and method for applying pressure to stress-producing layers for improved guidance of a separation crackSILTECTRA GMBH·Filed 2018·Granted Nov 26, 2024·3 cites·18 claims
- 0982US10312135B2Combined wafer production method with laser treatment and temperature-induced stressesSILTECTRA GMBH·Filed 2014·Granted Jun 4, 2019·3 cites·15 claims
- 1082US2023307286A1Method for Producing a Layer of Solid MaterialSILTECTRA GMBH·Filed 2023·Application pending·0 cites
- 1181US2026070159A1Method for Producing Short Subcritical Cracks in Solid BodiesSILTECTRA GMBH·Filed 2025·Application pending·0 cites
- 1279US11869810B2Method for reducing the thickness of solid-state layers provided with componentsSILTECTRA GMBH·Filed 2018·Granted Jan 9, 2024·2 cites·18 claims
- 1379US10994442B2Method for forming a crack in the edge region of a donor substrate, using an inclined laser beamSILTECTRA GMBH·Filed 2016·Granted May 4, 2021·3 cites·8 claims
- 1477US12030216B2Method for separating wafers from donor substratesSILTECTRA GMBH·Filed 2023·Granted Jul 9, 2024·0 cites·18 claims
- 1577US11996331B2Method for separating a solid bodySILTECTRA GMBH·Filed 2022·Granted May 28, 2024·0 cites·7 claims
- 1677US11772201B2Method for separating solid body layers from composite structures made of SiC and a metallic coating or electrical componentsSILTECTRA GMBH·Filed 2019·Granted Oct 3, 2023·2 cites·19 claims
- 1777US10843380B2Method for the material-saving production of wafers and processing of wafersSILTECTRA GMBH·Filed 2016·Granted Nov 24, 2020·2 cites·9 claims
- 1876US2024058899A1Method for Producing a Detachment Region in a Solid-state BodySILTECTRA GMBH·Filed 2023·Application pending·0 cites
- 1975US11699616B2Method for producing a layer of solid materialSILTECTRA GMBH·Filed 2021·Granted Jul 11, 2023·0 cites·20 claims
- 2072US12159805B2Method for producing wafers with modification lines of defined orientationSILTECTRA GMBH·Filed 2018·Granted Dec 3, 2024·1 cites·21 claims
- 2171US11309191B2Method for modifying substrates based on crystal lattice dislocation densitySILTECTRA GMBH·Filed 2019·Granted Apr 19, 2022·1 cites·25 claims
- 2270US11518066B2Method of treating a solid layer bonded to a carrier substrateSILTECTRA GMBH·Filed 2020·Granted Dec 6, 2022·0 cites·16 claims
- 2370US10825732B2Method of producing stresses in a semiconductor waferSILTECTRA GMBH·Filed 2020·Granted Nov 3, 2020·0 cites·20 claims
- 2470US10676386B2Method for guiding a crack in the peripheral region of a donor substrateSILTECTRA GMBH·Filed 2019·Granted Jun 9, 2020·0 cites·17 claims
- 2569US11407066B2Splitting of a solid using conversion of materialSILTECTRA GMBH·Filed 2015·Granted Aug 9, 2022·1 cites·23 claims
- 2668US10280107B2Method for guiding a crack in the peripheral region of a donor substrateSILTECTRA GMBH·Filed 2016·Granted May 7, 2019·1 cites·16 claims
- 2767US12211702B2Solid body and multi-component arrangementSILTECTRA GMBH·Filed 2021·Granted Jan 28, 2025·0 cites·16 claims
- 2865US12539565B2Method for producing short subcritical cracks in solid bodiesSILTECTRA GMBH·Filed 2019·Granted Feb 3, 2026·0 cites·11 claims
- 2965US12097641B2Method for forming a crack in an edge region of a donor substrateSILTECTRA GMBH·Filed 2021·Granted Sep 24, 2024·0 cites·19 claims
- 3064US11201081B2Method for separating thin layers of solid material from a solid bodySILTECTRA GMBH·Filed 2019·Granted Dec 14, 2021·0 cites·18 claims
- 3164US10079171B2Combined method for producing solids, involving laser treatment and temperature-induced stresses to generate three-dimensional solidsSILTECTRA GMBH·Filed 2014·Granted Sep 18, 2018·1 cites·7 claims
- 3263US2018133834A1Splitting of a solid using conversion of materialSILTECTRA GMBH·Filed 2015·Application pending·0 cites
- 3362US10580699B1Method and device for the production of wafers with a pre-defined break initiation pointSILTECTRA GMBH·Filed 2019·Granted Mar 3, 2020·0 cites·20 claims
- 3461US10304738B2Method and device for the production of wafers with a pre-defined break initiation pointSILTECTRA GMBH·Filed 2018·Granted May 28, 2019·0 cites·9 claims
- 3561US2021299910A1Method for separating a solid-state layer from a solid-state materialSILTECTRA GMBH·Filed 2021·Application pending·0 cites
- 3659US11833617B2Splitting of a solid using conversion of materialSILTECTRA GMBH·Filed 2018·Granted Dec 5, 2023·0 cites·20 claims
- 3759US11787083B2Production facility for separating wafers from donor substratesSILTECTRA GMBH·Filed 2018·Granted Oct 17, 2023·0 cites·21 claims
- 3857US10269643B2Method and device for the production of wafers with a pre-defined break initiation pointSILTECTRA GMBH·Filed 2014·Granted Apr 23, 2019·0 cites·14 claims
- 3957US2019096746A1Combined production mehtod for separating a number of thin layers of solid material from a thick solid bodySILTECTRA GMBH·Filed 2018·Application pending·0 cites
- 4054US10930560B2Laser-based separation methodSILTECTRA GMBH·Filed 2015·Granted Feb 23, 2021·0 cites·21 claims
- 4151US11059202B2Method and device for producing planar modifications in solid bodiesSILTECTRA GMBH·Filed 2016·Granted Jul 13, 2021·0 cites·10 claims
- 4247US10029277B2Method of producing large-scale layers of solid materialSILTECTRA GMBH·Filed 2014·Granted Jul 24, 2018·0 cites·1 claims
- 4347US2018118562A1Method for the low-loss production of multi-component wafersSILTECTRA GMBH·Filed 2015·Application pending·0 cites
- 4445US10229835B2Splitting method and use of a material in a splitting methodSILTECTRA GMBH·Filed 2015·Granted Mar 12, 2019·0 cites·22 claims
- 4544US11786995B2Nonplanar wafer and method for producing a nonplanar waferSILTECTRA GMBH·Filed 2016·Granted Oct 17, 2023·0 cites·25 claims
- 4643US10858495B2Polymer hybrid material for use in a splitting methodSILTECTRA GMBH·Filed 2017·Granted Dec 8, 2020·0 cites·26 claims
- 4743US9754810B2Method for the production of a wafer with a carrier unitSILTECTRA GMBH·Filed 2014·Granted Sep 5, 2017·0 cites·14 claims
- 4843US2017362697A1Transparent and highly stable screen protectorSILTECTRA GMBH·Filed 2015·Application pending·0 cites
- 4941US11664277B2Method for thinning solid-body layers provided with componentsSILTECTRA GMBH·Filed 2018·Granted May 30, 2023·0 cites·19 claims
- 5041US2018154572A1Apparatus and method for continuous treatment of a solid body by means of laser beamSILTECTRA GMBH·Filed 2016·Application pending·0 cites
Showing the top 50 of 55 patent records by PatentIndex Score.
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