Inventor · disambiguated record
Hong-Da Chang
Also filed as: CHANG HONG T · CHANG HONG-DA
21 granted patents·13 pending applications·62 citations·filing 2005–2024
93Inventor score
Files withSILICONWARE PRECISION INDUSTRIES CO LTD17CHANG HONG-DA4LIN HUNG-YI3TOUCH MICRO SYSTEM TECH3CHANG HONG T2
Top patents by PatentIndex Score
34 records- 0190US9502335B2Package structure and method for fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2014·Granted Nov 22, 2016·13 cites·26 claims
- 0289US9659806B2Semiconductor package having conductive pillarsSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2015·Granted May 23, 2017·7 cites·20 claims
- 0388US11398413B2Electronic package with multiple electronic components spaced apart by groovesSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2020·Granted Jul 26, 2022·3 cites·9 claims
- 0485US9133021B2Wafer level package having a pressure sensor and fabrication method thereofCHANG HONG-DA·Filed 2011·Granted Sep 15, 2015·9 cites·8 claims
- 0585US8399940B2Package structure having MEMS elements and fabrication method thereofLIN CHEN-HAN·Filed 2011·Granted Mar 19, 2013·8 cites·24 claims
- 0680US7741772B2White LED package structure having a silicon substrate and method of making the sameTOUCH MICRO SYSTEM TECH·Filed 2007·Granted Jun 22, 2010·8 cites·7 claims
- 0777US9520304B2Semiconductor package and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2013·Granted Dec 13, 2016·4 cites·34 claims
- 0873US12125828B2Carrying substrate, electronic package having the carrying substrate, and methods for manufacturing the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2023·Granted Oct 22, 2024·0 cites·12 claims
- 0972US2025015054A1Carrying substrate, electronic package having the carrying substrate, and methods for manufacturing the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2024·Application pending·0 cites
- 1067US9425119B2Package structure and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2014·Granted Aug 23, 2016·2 cites·30 claims
- 1165US11600571B2Electronic package, packaging substrate, and methods for fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2020·Granted Mar 7, 2023·0 cites·23 claims
- 1265US9487393B2Fabrication method of wafer level package having a pressure sensorSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2015·Granted Nov 8, 2016·1 cites·8 claims
- 1365US8525324B2Semiconductor package and method of fabricating the sameCHANG HONG-DA·Filed 2012·Granted Sep 3, 2013·1 cites·18 claims
- 1464US7510892B2Light emitting diode structure and manufacturing method thereofTOUCH MICRO SYSTEM TECH·Filed 2007·Granted Mar 31, 2009·2 cites·12 claims
- 1563US8172632B2Method of making white LED package structure having a silicon substrateLIN HUNG-YI·Filed 2009·Granted May 8, 2012·2 cites·28 claims
- 1660US7821094B2Light emitting diode structureTOUCH MICRO SYSTEM TECH·Filed 2008·Granted Oct 26, 2010·1 cites·5 claims
- 1755US11676877B2Electronic package with multiple electronic components spaced apart by groovesSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2022·Granted Jun 13, 2023·0 cites·9 claims
- 1855US10903167B2Electronic package, packaging substrate, and methods for fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2019·Granted Jan 26, 2021·0 cites·9 claims
- 1955US8633048B2Method for fabricating package structure having MEMS elementsLIN CHEN-HAN·Filed 2011·Granted Jan 21, 2014·1 cites·16 claims
- 2054US11923337B2Carrying substrate, electronic package having the carrying substrate, and methods for manufacturing the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2019·Granted Mar 5, 2024·0 cites·20 claims
- 2153US2019214372A1Method for fabricating electronic package having a shielding layerSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2019·Application pending·0 cites
- 2248US2018068983A1Electronic package and method for fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2017·Application pending·0 cites
- 2343US2008194054A1Led array package structure having silicon substrate and method of making the sameLIN HUNG-YI·Filed 2007·Application pending·0 cites
- 2443US2008210963A1Light emitting diode package structure and method of making the sameLIN HUNG-YI·Filed 2007·Application pending·0 cites
- 2540US8878356B2Package structure having micro-electro-mechanical system element and method of fabrication the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2012·Granted Nov 4, 2014·0 cites·38 claims
- 2639US2006276006A1Method of segmenting a waferYANG CHEN-HSIUNG·Filed 2005·Application pending·0 cites
- 2739US2020043908A1Package stacked structure, method for fabricating the same, and package structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2018·Application pending·0 cites
- 2838US9607974B2Package structure and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2015·Granted Mar 28, 2017·0 cites·6 claims
- 2938US2008096137A1Method for fabricating flow channel capable of balancing air pressureCHANG HONG-DA·Filed 2007·Application pending·0 cites
- 3033US2013320463A1Package structure having mems element and fabrication method thereofCHANG HONG-DA·Filed 2012·Application pending·0 cites
- 3130US2007246544A1Method for manufacturing memory card structureYANG SHEILA·Filed 2006·Application pending·0 cites
- 3226US2007029655A1Jig structure for manufacturin a stacked memory cardCHANG HONG T·Filed 2005·Application pending·0 cites
- 3325US2006289980A1Stacked memory card and method for manufacturing the sameCHANG HONG T·Filed 2005·Application pending·0 cites
- 3425US2007216037A1Memory card structure and method for manufacturing the samePAI DENNIS·Filed 2006·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →