Inventor · disambiguated record
Michael Solomensky
Also filed as: SOLOMENSKY MICHAEL
12 granted patents·8 pending applications·50 citations·filing 2002–2018
89Inventor score
Top patents by PatentIndex Score
20 records- 0193US9653437B2Packaging a substrate with an LED into an interconnect structure only through top side landing pads on the substrateBRIDGELUX INC·Filed 2016·Granted May 16, 2017·7 cites·17 claims
- 0293US8759847B2White LED assembly with LED string and intermediate node substrate terminalsXU TAO·Filed 2011·Granted Jun 24, 2014·15 cites·20 claims
- 0389US8506754B2Cross flow CVD reactorMOSHTAGH VAHID S·Filed 2010·Granted Aug 13, 2013·7 cites·14 claims
- 0488US8652860B2Packaging photon building blocks having only top side connections in a molded interconnect structureWEST R SCOTT·Filed 2012·Granted Feb 18, 2014·6 cites·21 claims
- 0583US9893039B2Packaging a substrate with an LED into an interconnect structure only through top side landing pads on the substrateBRIDGELUX INC·Filed 2017·Granted Feb 13, 2018·2 cites·19 claims
- 0677US7887384B2Transparent ring LED assemblyBRIDGELUX INC·Filed 2008·Granted Feb 15, 2011·8 cites·10 claims
- 0773US9012932B2White LED assembly with LED string and intermediate node substrate terminalsBRIDGELUX INC·Filed 2014·Granted Apr 21, 2015·2 cites·20 claims
- 0864US9252336B2Multi-cup LED assemblySHI WEI·Filed 2008·Granted Feb 2, 2016·3 cites·19 claims
- 0963US10325890B2Packaging a substrate with an LED into an interconnect structure only through top side landing pads on the substrateBRIDGELUX INC·Filed 2018·Granted Jun 18, 2019·0 cites·20 claims
- 1061US9985004B2Packaging a substrate with an LED into an interconnect structure only through top side landing pads on the substrateBRIDGELUX INC·Filed 2017·Granted May 29, 2018·0 cites·15 claims
- 1158US9312465B2Packaging photon building blocks having only top side connections in a molded interconnect structureBRIDGELUX INC·Filed 2015·Granted Apr 12, 2016·0 cites·19 claims
- 1254US2009096349A1Cross flow cvd reactorMOSHTAGH VAHID S·Filed 2008·Application pending·0 cites
- 1351US9331056B2White LED assembly with LED string and intermediate node substrate terminalsBRIDGELUX INC·Filed 2015·Granted May 3, 2016·0 cites·20 claims
- 1450US2006201426A1Reactor for Producing Reactive Intermediates for Transport PolymerizationLEE CHUNG J·Filed 2006·Application pending·0 cites
- 1545US2010046221A1LED Source Adapted for Light Bulbs and the LikePOSSELT JASON LOOMIS·Filed 2008·Application pending·0 cites
- 1644US2010078661A1Machined surface led assemblySHI WEI·Filed 2008·Application pending·0 cites
- 1741US2005047927A1Process modules for transport polymerization of low epsilon thin filmsFiled 2004·Application pending·0 cites
- 1837US2011062482A1Apparatus And Method For Enhancing Connectability In LED Array Using Metal TracesBRIDGELUX INC·Filed 2010·Application pending·0 cites
- 1937US2003198578A1Multi-stage-heating thermal reactor for transport polymerizationDIELECTRIC SYSTEMS INC·Filed 2002·Application pending·0 cites
- 2036US2003196680A1Process modules for transport polymerization of low epsilon thin filmsDIELECTRIC SYSTEMS INC·Filed 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →