Inventor · disambiguated record
Mete Erturk
Also filed as: ERTURK METE
23 granted patents·7 pending applications·140 citations·filing 2005–2021
95Inventor score
Top patents by PatentIndex Score
30 records- 0195US7563714B2Low resistance and inductance backside through vias and methods of fabricating sameIBM·Filed 2006·Granted Jul 21, 2009·35 cites·10 claims
- 0291US9496213B2Integrated device package comprising a magnetic core inductor with protective ring embedded in a package substrateQUALCOMM INC·Filed 2015·Granted Nov 15, 2016·11 cites·30 claims
- 0390US7851923B2Low resistance and inductance backside through vias and methods of fabricating sameIBM·Filed 2009·Granted Dec 14, 2010·16 cites·15 claims
- 0488US8169050B2BEOL wiring structures that include an on-chip inductor and an on-chip capacitor, and design structures for a radiofrequency integrated circuitDALEY DOUGLAS M·Filed 2008·Granted May 1, 2012·21 cites·27 claims
- 0585US7501690B2Semiconductor ground shield methodIBM·Filed 2005·Granted Mar 10, 2009·11 cites·11 claims
- 0682US7811919B2Methods of fabricating a BEOL wiring structure containing an on-chip inductor and an on-chip capacitorIBM·Filed 2008·Granted Oct 12, 2010·11 cites·25 claims
- 0780US8237243B2On-chip capacitors with a variable capacitance for a radiofrequency integrated circuitDALEY DOUGLAS M·Filed 2009·Granted Aug 7, 2012·8 cites·16 claims
- 0875US8645898B2Structure and design structure for high-Q value inductor and method of manufacturing the sameDING HANYI·Filed 2012·Granted Feb 4, 2014·3 cites·20 claims
- 0975US8232173B2Structure and design structure for high-Q value inductor and method of manufacturing the sameDING HANYI·Filed 2010·Granted Jul 31, 2012·3 cites·10 claims
- 1074US8809144B2On-chip capacitors with a variable capacitance for a radiofrequency integrated circuitDALEY DOUGLAS M·Filed 2012·Granted Aug 19, 2014·3 cites·14 claims
- 1171US10545549B2AC/DC power adapter with accessible internal memorySILANNA ASIA PTE LTD·Filed 2017·Granted Jan 28, 2020·1 cites·32 claims
- 1271US7399696B2Method for high performance inductor fabrication using a triple damascene process with copper BEOLIBM·Filed 2005·Granted Jul 15, 2008·5 cites·20 claims
- 1366US11106258B2AC/DC power adapter with multi-winding feedback converterAPPULSE POWER INC·Filed 2020·Granted Aug 31, 2021·0 cites·20 claims
- 1465US8700199B2Passive resonator, a system incorporating the passive resonator for real-time intra-process monitoring and control and an associated methodERTURK METE·Filed 2011·Granted Apr 15, 2014·2 cites·12 claims
- 1564US9171673B2On-chip capacitors with a variable capacitance for a radiofrequency integrated circuitIBM·Filed 2014·Granted Oct 27, 2015·1 cites·3 claims
- 1663US8239811B2System and method for wireless and dynamic intra-process measurement of integrated circuit parametersANEMIKOS THEODOROS E·Filed 2008·Granted Aug 7, 2012·2 cites·20 claims
- 1763US8130298B2Wide dynamic range image sensor utilizing switch current source at pre-determined switch voltage per pixelCORSON PHILLIP L·Filed 2008·Granted Mar 6, 2012·3 cites·20 claims
- 1863US2021384292A1Integration of inductors with advanced-node system-on-chip (soc) using glass wafer with inductors and wafer-to-wafer joiningQUALCOMM INC·Filed 2021·Application pending·0 cites
- 1962US10470309B2Inductor and capacitor integrated on a substrateQUALCOMM INC·Filed 2015·Granted Nov 5, 2019·1 cites·18 claims
- 2058US9230725B2Methods of designing an inductor having opening enclosed within conductive lineERTURK METE·Filed 2012·Granted Jan 5, 2016·1 cites·8 claims
- 2157US7739636B2Design structure incorporating semiconductor device structures that shield a bond pad from electrical noiseIBM·Filed 2007·Granted Jun 15, 2010·1 cites·7 claims
- 2255US8193893B2Inductor having opening enclosed within conductive line and related methodERTURK METE·Filed 2008·Granted Jun 5, 2012·1 cites·18 claims
- 2355US7659598B2Semiconductor ground shieldIBM·Filed 2009·Granted Feb 9, 2010·0 cites·19 claims
- 2446US2017062398A1Integration of inductors with advanced-node system-on-chip (soc) using glass wafer with inductors and wafer-to-wafer joiningQUALCOMM INC·Filed 2015·Application pending·0 cites
- 2545US2010022063A1Method of forming on-chip passive elementERTURK METE·Filed 2008·Application pending·0 cites
- 2645US2015311271A1Landside embedded inductor for fanout packagingQUALCOMM INC·Filed 2014·Application pending·0 cites
- 2745US2010019346A1Ic having flip chip passive element and design structureERTURK METE·Filed 2008·Application pending·0 cites
- 2844US2009020856A1Semiconductor device structures and methods for shielding a bond pad from electrical noiseIBM·Filed 2007·Application pending·0 cites
- 2943US2008116541A1Structure for integrating an rf shield structure in a carrier substrateIBM·Filed 2006·Application pending·0 cites
- 3042US10199152B2Embedded thin film magnetic carrier for integrated voltage regulatorQUALCOMM INC·Filed 2015·Granted Feb 5, 2019·0 cites·12 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →