Inventor · disambiguated record
Hao-Chun Cheng
Also filed as: CHENG HAO · CHENG HAO-CHUN
31 granted patents·7 pending applications·343 citations·filing 2006–2017
97Inventor score
Files withSEMILEDS OPTOELECTRONICS CO11CHU CHEN-FU8FAN FENG-HSU4SEMILEDS OPTOELECTRONICS CO LT4DOAN TRUNG TRI3
Top patents by PatentIndex Score
38 records- 0197US8871547B2Method for fabricating vertical light emitting diode (VLED) structure using a laser pulse to remove a carrier substrateSEMILEDS OPTOELECTRONICS CO·Filed 2014·Granted Oct 28, 2014·23 cites·17 claims
- 0297US7723718B1Epitaxial structure for metal devicesSEMILEDS OPTOELECTRONICS CO LT·Filed 2006·Granted May 25, 2010·29 cites·33 claims
- 0396US7897420B2Light emitting diodes (LEDs) with improved light extraction by rougheningSEMILEDS OPTOELECTRONICS CO·Filed 2007·Granted Mar 1, 2011·35 cites·16 claims
- 0496US7687322B1Method for removing semiconductor street materialSEMILEDS OPTOELECTRONICS CO LT·Filed 2006·Granted Mar 30, 2010·22 cites·25 claims
- 0596US7524686B2Method of making light emitting diodes (LEDs) with improved light extraction by rougheningSEMILEDS CORP·Filed 2007·Granted Apr 28, 2009·48 cites·19 claims
- 0695US7563625B2Method of making light-emitting diodes (LEDs) with improved light extraction by rougheningSEMILEDS OPTOELECTRONICS CO LT·Filed 2006·Granted Jul 21, 2009·36 cites·20 claims
- 0793US7759670B2Vertical LED with current guiding structureSEMILEDS OPTOELECTRONICS CO LT·Filed 2008·Granted Jul 20, 2010·24 cites·16 claims
- 0892US8685764B2Method to make low resistance contactCHU CHEN-FU·Filed 2007·Granted Apr 1, 2014·24 cites·12 claims
- 0992US8507302B1Wall structures for a semiconductor waferCHU CHEN-FU·Filed 2006·Granted Aug 13, 2013·11 cites·34 claims
- 1091US7452739B2Method of separating semiconductor diesSEMI PHOTONICS CO LTD·Filed 2007·Granted Nov 18, 2008·23 cites·39 claims
- 1190US8003994B2Vertical LED with current guiding structureSEMILEDS OPTOELECTRONICS CO·Filed 2010·Granted Aug 23, 2011·10 cites·27 claims
- 1289US8143112B1Method for removing semiconductor street materialDOAN TRUNG TRI·Filed 2010·Granted Mar 27, 2012·6 cites·25 claims
- 1386US8124454B1Die separationCHU CHEN-FU·Filed 2006·Granted Feb 28, 2012·6 cites·20 claims
- 1485US8778780B1Method for defining semiconductor devicesDOAN TRUNG-TRI·Filed 2006·Granted Jul 15, 2014·8 cites·24 claims
- 1577US7968379B2Method of separating semiconductor diesSEMILEDS OPTOELECTRONICS CO·Filed 2008·Granted Jun 28, 2011·5 cites·51 claims
- 1675US8283652B2Vertical light emitting diode (VLED) die having electrode frame and method of fabricationCHU CHEN-FU·Filed 2010·Granted Oct 9, 2012·2 cites·23 claims
- 1774US8546818B2Vertical LED with current-guiding structureLIU WEN-HUANG·Filed 2012·Granted Oct 1, 2013·3 cites·9 claims
- 1870US8802469B2Method of fabricating semiconductor die using handling layerCHU CHEN-FU·Filed 2011·Granted Aug 12, 2014·1 cites·37 claims
- 1970US8716041B2Method for fabricating side by side light emitting diode (LED) having separate electrical and heat transfer pathsSEMILEDS OPTOELECTRONICS CO·Filed 2013·Granted May 6, 2014·2 cites·19 claims
- 2069US8723160B2Light emitting diode (LED) die having peripheral electrode frame and method of fabricationSEMILEDS OPTOELECTRONICS CO·Filed 2012·Granted May 13, 2014·1 cites·20 claims
- 2167US8614449B1Protection for the epitaxial structure of metal devicesFAN FENG-HSU·Filed 2006·Granted Dec 24, 2013·2 cites·29 claims
- 2263US8703515B2Method for guiding current in a light emitting diode (LED) deviceSEMILEDS OPTOELECTRONICS CO·Filed 2013·Granted Apr 22, 2014·1 cites·8 claims
- 2362US8148733B2Vertical LED with current guiding structureLIU WEN-HUANG·Filed 2011·Granted Apr 3, 2012·1 cites·21 claims
- 2461US8552458B2Side by side light emitting diode (LED) having separate electrical and heat transfer pathsDOAN TRUNG TRI·Filed 2010·Granted Oct 8, 2013·1 cites·11 claims
- 2561US2014051197A1Method for fabricating a vertical light emitting diode (vled) die having epitaxial structure with protective layerSEMILEDS OPTOELECTRONICS CO·Filed 2013·Application pending·0 cites
- 2659USD684940SLED chipCHU CHEN-FU·Filed 2012·Granted Jun 25, 2013·10 cites·1 claims
- 2756US8466479B2Light emitting diodes (LEDs) with improved light extraction by rougheningCHU CHEN-FU·Filed 2011·Granted Jun 18, 2013·0 cites·20 claims
- 2852US10446299B2Varistor having multilayer coating and fabrication methodDONGGUAN LITTELFUSE ELECTRONICS CO LTD·Filed 2015·Granted Oct 15, 2019·0 cites·17 claims
- 2951US2012074384A1Protection for the epitaxial structure of metal devicesFAN FENG-HSU·Filed 2011·Application pending·0 cites
- 3050US7892891B2Die separationSEMILEDS OPTOELECTRONICS CO·Filed 2006·Granted Feb 22, 2011·0 cites·21 claims
- 3148US8384088B2Vertical light emitting diode having an outwardly disposed electrodeSEMILEDS OPTOELECTRONICS CO·Filed 2010·Granted Feb 26, 2013·0 cites·14 claims
- 3245US2008087875A1Protection for the epitaxial structure of metal devicesFAN FENG-HSU·Filed 2006·Application pending·0 cites
- 3343USD684941SLED chipCHU CHEN-FU·Filed 2012·Granted Jun 25, 2013·4 cites·1 claims
- 3442USD715234SFlip chipSEMILEDS OPTOELECTRONICS CO·Filed 2013·Granted Oct 14, 2014·5 cites·1 claims
- 3538US2020185133A1Electrical transient material and method for making sameDONGGUAN LITTELFUSE ELECTRONICS COMPANY LTD·Filed 2017·Application pending·0 cites
- 3636US2014151630A1Protection for the epitaxial structure of metal devicesFAN FENG-HSU·Filed 2012·Application pending·0 cites
- 3735US2021110953A1Circuit protection apparatus including structurally resilient electrical transient material and method for making sameDONGGUAN LITTELFUSE ELECTRONICS COMPANY LTD·Filed 2017·Application pending·0 cites
- 3835US2012097985A1Light Emitting Diode (LED) Package And Method Of FabricationLIU WEN-HUANG·Filed 2010·Application pending·0 cites
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