Inventor · disambiguated record
Sung-Fei Wang
Also filed as: WANG SUNG FEI
15 granted patents·11 pending applications·408 citations·filing 1999–2012
94Inventor score
Top patents by PatentIndex Score
26 records- 0191US6861761B2Multi-chip stack flip-chip packageADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Mar 1, 2005·74 cites·17 claims
- 0290US6365966B1Stacked chip scale packageADVANCED SEMICONDUCTOR ENG·Filed 2000·Granted Apr 2, 2002·66 cites·23 claims
- 0385US6936930B2Thermal enhance MCM packageADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Aug 30, 2005·34 cites·18 claims
- 0484US7015577B2Flip chip package capable of measuring bond line thickness of thermal interface materialADVANCED SEMICONDUCTOR ENG·Filed 2004·Granted Mar 21, 2006·39 cites·17 claims
- 0583US7268418B2Multi-chips stacked packageADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Sep 11, 2007·36 cites·26 claims
- 0678US7026719B2Semiconductor package with a heat spreaderADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Apr 11, 2006·26 cites·8 claims
- 0776US6879031B2Multi-chips packageADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Apr 12, 2005·24 cites·18 claims
- 0874US7291924B2Flip chip stacked packageADVANCED SEMICONDUCTOR ENG·Filed 2004·Granted Nov 6, 2007·23 cites·21 claims
- 0971US7215016B2Multi-chips stacked packageADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted May 8, 2007·15 cites·6 claims
- 1065US7025848B2Heat sink for chip package and bonding method thereofADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Apr 11, 2006·13 cites·7 claims
- 1163US7023079B2Stacked semiconductor chip packageADVANCED SEMICONDUCTOR ENG·Filed 2002·Granted Apr 4, 2006·12 cites·6 claims
- 1262US6161753AMethod of making a low-profile wire connection for stacked diesADVANCED SEMICONDUCTOR ENG·Filed 1999·Granted Dec 19, 2000·28 cites·4 claims
- 1358US7473989B2Flip-chip packageADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Jan 6, 2009·9 cites·14 claims
- 1453US6949826B2High density semiconductor packageADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Sep 27, 2005·4 cites·7 claims
- 1552US7002255B2Multi-chips stacked packageADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Feb 21, 2006·5 cites·11 claims
- 1648US2007176278A1Multi-chips stacked packageADVANCED SEMICONDUCTOR ENG·Filed 2007·Application pending·0 cites
- 1745US2007152330A1Package structure and manufacturing method thereofADVANCED SEMICONDUCTOR ENG·Filed 2006·Application pending·0 cites
- 1843US2008036077A1Package structure and heat sink module thereofADVANCED SEMICONDUCTOR ENG·Filed 2006·Application pending·0 cites
- 1938US2004227252A1Flip chip package with reinforced bumpsADVANCED SEMICONDUCTOR ENG·Filed 2004·Application pending·0 cites
- 2038US2004183180A1Multi-chips stacked packageADVANCED SEMICONDUCTOR ENG·Filed 2003·Application pending·0 cites
- 2138US2004188818A1Multi-chips module packageADVANCED SEMICONDUCTOR ENG·Filed 2004·Application pending·0 cites
- 2237US2004183190A1Multi-chips stacked packageADVANCED SEMICONDUCTOR ENG·Filed 2003·Application pending·0 cites
- 2337US2004212066A1Multi-chips stacked packageADVANCED SEMICONDUCTOR ENG·Filed 2003·Application pending·0 cites
- 2436US2004173903A1Thin type ball grid array packageADVANCED SEMICONDUCTOR ENG·Filed 2003·Application pending·0 cites
- 2534US2002140073A1Multichip moduleADVANCED SEMICONDUCTOR ENG·Filed 2001·Application pending·0 cites
- 2627US2012210035A1Device for a multi-boot system with network switchesHIR WAY-DIR·Filed 2012·Application pending·0 cites
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