Inventor · disambiguated record
Mark D. Poliks
Also filed as: POLIKS MARK D · POLIKS MARK DAVID
49 granted patents·6 pending applications·1,749 citations·filing 1991–2018
99Inventor score
Files withIBM37ENDICOTT INTERCONNECT TECH INC6DAS RABINDRA N4UNIV NEW YORK STATE RES FOUND4JAPP ROBERT M3
Top patents by PatentIndex Score
55 records- 0198US7301108B2Multi-layered interconnect structure using liquid crystalline polymer dielectricIBM·Filed 2004·Granted Nov 27, 2007·105 cites·10 claims
- 0298US6329603B1Low CTE power and ground planesIBM·Filed 1999·Granted Dec 11, 2001·135 cites·18 claims
- 0397US7025607B1Capacitor material with metal component for use in circuitized substrates, circuitized substrate utilizing same, method of making said circuitized substrate, and information handling system utilizing said circuitized substrateENDICOTT INTERCONNECT TECH INC·Filed 2005·Granted Apr 11, 2006·51 cites·18 claims
- 0497US6465084B1Method and structure for producing Z-axis interconnection assembly of printed wiring board elementsIBM·Filed 2001·Granted Oct 15, 2002·116 cites·12 claims
- 0596US6929900B2Tamper-responding encapsulated enclosure having flexible protective mesh structureIBM·Filed 2003·Granted Aug 16, 2005·127 cites·6 claims
- 0695US9606245B1Autonomous gamma, X-ray, and particle detectorUNIV NEW YORK STATE RES FOUND·Filed 2016·Granted Mar 28, 2017·88 cites·20 claims
- 0795US6686539B2Tamper-responding encapsulated enclosure having flexible protective mesh structureIBM·Filed 2001·Granted Feb 3, 2004·109 cites·17 claims
- 0895US6600224B1Thin film attachment to laminate using a dendritic interconnectionIBM·Filed 2000·Granted Jul 29, 2003·83 cites·19 claims
- 0994US6722031B2Method for making printed circuit board having low coefficient of thermal expansion power/ground planeIBM·Filed 2001·Granted Apr 20, 2004·53 cites·13 claims
- 1094US6452117B2Method for filling high aspect ratio via holes in electronic substrates and the resulting holesIBM·Filed 2001·Granted Sep 17, 2002·76 cites·13 claims
- 1192US8288857B2Anti-tamper microchip package based on thermal nanofluids or fluidsDAS RABINDRA N·Filed 2010·Granted Oct 16, 2012·16 cites·25 claims
- 1292US6826830B2Multi-layered interconnect structure using liquid crystalline polymer dielectricIBM·Filed 2002·Granted Dec 7, 2004·42 cites·15 claims
- 1392US6613413B1Porous power and ground planes for reduced PCB delamination and better reliabilityIBM·Filed 1999·Granted Sep 2, 2003·76 cites·28 claims
- 1492US5194930ADielectric composition and solder interconnection structure for its useIBM·Filed 1991·Granted Mar 16, 1993·143 cites·8 claims
- 1589US7541058B2Method of making circuitized substrate with internal optical pathwayENDICOTT INTERCONNECT TECH INC·Filed 2007·Granted Jun 2, 2009·20 cites·18 claims
- 1688US9835737B1Autonomous gamma, X-ray, and particle detectorUNIV NEW YORK STATE RES FOUND·Filed 2017·Granted Dec 5, 2017·13 cites·20 claims
- 1787US6581280B2Method for filling high aspect ratio via holes in electronic substratesIBM·Filed 2002·Granted Jun 24, 2003·40 cites·18 claims
- 1886US6645607B2Method and structure for producing Z-axis interconnection assembly of printed wiring board elementsIBM·Filed 2002·Granted Nov 11, 2003·24 cites·14 claims
- 1986US6534179B2Halogen free triazines, bismaleimide/epoxy polymers, prepregs made therefrom for circuit boards and resin coated articles, and useIBM·Filed 2001·Granted Mar 18, 2003·25 cites·41 claims
- 2085US6351030B2Electronic package utilizing protective coatingIBM·Filed 1999·Granted Feb 26, 2002·70 cites·9 claims
- 2184US7713767B2Method of making circuitized substrate with internal optical pathway using photolithographyENDICOTT INTERCONNECT TECH INC·Filed 2007·Granted May 11, 2010·13 cites·13 claims
- 2284US7541265B2Capacitor material for use in circuitized substrates, circuitized substrate utilizing same, method of making said circuitized substrate, and information handling system utilizing said circuitized substrateENDICOTT INTERCONNECT TECH INC·Filed 2005·Granted Jun 2, 2009·12 cites·16 claims
- 2383US7646098B2Multilayered circuitized substrate with p-aramid dielectric layers and method of making sameENDICOTT INTERCONNECT TECH INC·Filed 2008·Granted Jan 12, 2010·9 cites·13 claims
- 2483US5888850AMethod for providing a protective coating and electronic package utilizing sameIBM·Filed 1997·Granted Mar 30, 1999·61 cites·30 claims
- 2580US6944946B2Porous power and ground planes for reduced PCB delamination and better reliabilityIBM·Filed 2003·Granted Sep 20, 2005·21 cites·42 claims
- 2680US6254972B1Semiconductor device having a thermoset-containing dielectric material and methods for fabricating the sameIBM·Filed 1999·Granted Jul 3, 2001·29 cites·11 claims
- 2779US6207595B1Laminate and method of manufacture thereofIBM·Filed 1998·Granted Mar 27, 2001·59 cites·8 claims
- 2876US8882983B2Embedded thin filmsCHO JUNGHYUN·Filed 2009·Granted Nov 11, 2014·1 cites·31 claims
- 2976US7981245B2Multi-layered interconnect structure using liquid crystalline polymer dielectricIBM·Filed 2007·Granted Jul 19, 2011·4 cites·11 claims
- 3076US7777136B2Multi-layered interconnect structure using liquid crystalline polymer dielectricIBM·Filed 2007·Granted Aug 17, 2010·5 cites·11 claims
- 3175US6387205B1Dustfree prepreg and method for making an article based thereonIBM·Filed 2000·Granted May 14, 2002·16 cites·12 claims
- 3274US8084863B2Circuitized substrate with continuous thermoplastic support film dielectric layersJAPP ROBERT M·Filed 2008·Granted Dec 27, 2011·5 cites·13 claims
- 3372US6967705B2Lamination of liquid crystal polymer dielectric filmsIBM·Filed 2004·Granted Nov 22, 2005·6 cites·14 claims
- 3468US8211790B2Multilayered circuitized substrate with P-aramid dielectric layers and method of making sameJAPP ROBERT M·Filed 2009·Granted Jul 3, 2012·3 cites·6 claims
- 3564US6819373B2Lamination of liquid crystal polymer dielectric filmsIBM·Filed 2002·Granted Nov 16, 2004·2 cites·10 claims
- 3662US5928970ADustfree prepreg and method for making an article based thereonIBM·Filed 1998·Granted Jul 27, 1999·20 cites·11 claims
- 3761US10064283B2Embedded thin filmsUNIV NEW YORK STATE RES FOUND·Filed 2014·Granted Aug 28, 2018·0 cites·20 claims
- 3861US5756405ATechnique for forming resin-impregnated fiberglass sheetsIBM·Filed 1996·Granted May 26, 1998·19 cites·11 claims
- 3955US7402254B2Method and structure for producing Z-axis interconnection assembly of printed wiring board elementsIBM·Filed 2003·Granted Jul 22, 2008·4 cites·18 claims
- 4055US2010218891A1Multi-layered interconnect structure using liquid crystalline polymer dielectricIBM·Filed 2010·Application pending·0 cites
- 4154US6534160B2Semiconductor device having a thermoset-containing dielectric material and methods for fabricating the sameIBM·Filed 2001·Granted Mar 18, 2003·3 cites·16 claims
- 4254US5800874ATechnique for forming resin-impregnated fiberglass sheetsIBM·Filed 1997·Granted Sep 1, 1998·14 cites·8 claims
- 4351US11331019B2Nanoparticle sensor having a nanofibrous membrane scaffoldUNIV NEW YORK STATE RES FOUND·Filed 2018·Granted May 17, 2022·0 cites·20 claims
- 4451US2009258161A1Circuitized substrate with P-aramid dielectric layers and method of making sameJAPP ROBERT M·Filed 2009·Application pending·0 cites
- 4551US2006154501A1Capacitor material with metal component for use in circuitized substrates, circuitized substrate utilizing same, method of making said circuitized substrate, and information handling system utilizing said circuitized substrateENDICOTT INTERCONNECT TECH INC·Filed 2006·Application pending·0 cites
- 4650US7014731B2Semiconductor device having a thermoset-containing dielectric material and methods for fabricating the sameIBM·Filed 2001·Granted Mar 21, 2006·2 cites·6 claims
- 4747US5773132AProtecting copper dielectric interface from delaminationIBM·Filed 1997·Granted Jun 30, 1998·13 cites·21 claims
- 4844US2012228014A1Circuitized substrate with internal thin film capacitor and method of making sameDAS RABINDRA N·Filed 2011·Application pending·0 cites
- 4943US8685284B2Conducting paste for device level interconnectsDAS RABINDRA N·Filed 2010·Granted Apr 1, 2014·0 cites·9 claims
- 5042US2012257343A1Conductive metal micro-pillars for enhanced electrical interconnectionDAS RABINDRA N·Filed 2011·Application pending·0 cites
Showing the top 50 of 55 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →