Inventor · disambiguated record
Jean Brun
Also filed as: BRUN JEAN · BRUN JEAN-CLAUDE
33 granted patents·8 pending applications·373 citations·filing 1974–2022
97Inventor score
Top patents by PatentIndex Score
41 records- 0197US9093289B2Method for assembling at least one chip using a fabric, and fabric including a chip deviceVICARD DOMINIQUE·Filed 2011·Granted Jul 28, 2015·64 cites·16 claims
- 0296US8258044B2Method for fabricating chip elements provided with wire insertion groovesBRUN JEAN·Filed 2011·Granted Sep 4, 2012·34 cites·5 claims
- 0394US8782880B2Apparatus for assembling chip devices on wiresVICARD DOMINIQUE·Filed 2011·Granted Jul 22, 2014·22 cites·20 claims
- 0493US8093617B2Bare microelectronic chip provided with a recess forming a housing for a wire element constituting a flexible mechanical support, fabrication process and microstructureVICARD DOMINIQUE·Filed 2007·Granted Jan 10, 2012·30 cites·17 claims
- 0592US8814054B2Inclusion of chip elements in a sheathed wireBRUN JEAN·Filed 2011·Granted Aug 26, 2014·32 cites·9 claims
- 0691US8471773B2Assembly of radiofrequency chipsVICARD DOMINIQUE·Filed 2008·Granted Jun 25, 2013·30 cites·15 claims
- 0790US8723312B2Assembly of a wire element with a microelectronic chip with a groove comprising at least one bump securing the wire elementBRUN JEAN·Filed 2008·Granted May 13, 2014·20 cites·24 claims
- 0890US8258011B2Method for producing a set of chips mechanically interconnected by means of a flexible connectionBRUN JEAN·Filed 2008·Granted Sep 4, 2012·16 cites·9 claims
- 0982US3962064AElectrolyzer and a method for the production of readily oxydizable metals in a state of high purityCOMMISSARIAT ENERGIE ATOMIQUE·Filed 1974·Granted Jun 8, 1976·31 cites·5 claims
- 1080US9112079B2Photovoltaic cell, method for assembling plurality of cells and assembly of a plurality of photovoltaic cellsVICARD DOMINIQUE·Filed 2009·Granted Aug 18, 2015·4 cites·24 claims
- 1180US7563703B2Microelectronic interconnect device comprising localised conductive pinsCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2005·Granted Jul 21, 2009·14 cites·15 claims
- 1277US10763468B2Sealing cell and method for encapsulating a microelectronic component with such a sealing cellCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2018·Granted Sep 1, 2020·1 cites·14 claims
- 1376US9179586B2Method for assembling a chip in a flexible substrateBRUN JEAN·Filed 2011·Granted Nov 3, 2015·3 cites·19 claims
- 1475US8012795B2Method and device for fabricating an assembly of at least two microelectronic chipsCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2009·Granted Sep 6, 2011·4 cites·11 claims
- 1568US9888573B2Cap for a chip device having a groove, device provided with said cap, assembly consisting of the device and a wire element, and manufacturing method thereofCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2013·Granted Feb 6, 2018·2 cites·22 claims
- 1666US9953953B2Method for assembling a microelectronic chip element on a wire element, and installation enabling assembly to be performedCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2013·Granted Apr 24, 2018·2 cites·13 claims
- 1766US8112882B2Method for producing a structureBAILLIN XAVIER·Filed 2008·Granted Feb 14, 2012·4 cites·13 claims
- 1865US8445328B2Method for producing chip elements equipped with wire insertion groovesBRUN JEAN·Filed 2011·Granted May 21, 2013·3 cites·4 claims
- 1964US2023115626A1Solid electrolyte batteryCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2022·Application pending·0 cites
- 2063US7026239B2Method for making an anisotropic conductive polymer film on a semiconductor waferCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2003·Granted Apr 11, 2006·11 cites·6 claims
- 2161US8654540B2Method for assembling at least one chip with a wire element, electronic chip with a deformable link element, fabrication method of a plurality of chips, and assembly of at least one chip with a wire elementBRUN JEAN·Filed 2010·Granted Feb 18, 2014·1 cites·9 claims
- 2257US10707363B2Assembly for housing wire elementsCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2015·Granted Jul 7, 2020·0 cites·9 claims
- 2357US7235112B2Micro-battery fabrication process including formation of an electrode on a metal strip, cold compression and removal of the metal stripCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2002·Granted Jun 26, 2007·7 cites·12 claims
- 2456US8611101B2Assembly of a microelectronic chip having a groove with a wire element in the form of a strand, and method for assemblyBRUN JEAN·Filed 2009·Granted Dec 17, 2013·1 cites·18 claims
- 2552US6029517AMiniaturized accelerometer of the type using spring compensation of the effect of gravity and its production processCOMMISSARIAT ENERGIE ATOMIQUE·Filed 1998·Granted Feb 29, 2000·14 cites·18 claims
- 2651US10640892B2Incorporation of chip elements in a core yarnCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2016·Granted May 5, 2020·0 cites·12 claims
- 2750US8435796B2Use of a fabric comprising a specific material for detecting the presence of a chemical substanceBRUN JEAN·Filed 2010·Granted May 7, 2013·0 cites·18 claims
- 2850US2019372072A1Encapsulated microbattery with improved leak tightness and encapsulation method providing improved leak tightnessCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2019·Application pending·0 cites
- 2946US8860200B2Stacked electronic device and method of making such an electronic deviceBRUN JEAN·Filed 2009·Granted Oct 14, 2014·0 cites·72 claims
- 3045US6032532ASensor, in particular accelerometer, and actuator with electric insulation localised in a substrate plateCOMMISSARIAT ENERGIE ATOMIQUE·Filed 1997·Granted Mar 7, 2000·11 cites·19 claims
- 3145US2021028480A1Assembly mould to manufacture a three-dimensional device comprising several microelectronic componentsCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2020·Application pending·0 cites
- 3244US7510962B2Method for producing an anisotropic conductive film on a substrateCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2004·Granted Mar 31, 2009·1 cites·17 claims
- 3344US2021125957A1Method for fabricating an electronic deviceCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2019·Application pending·0 cites
- 3440US5922955AGravity-compensation type accelerometer and process for producing such an accelerometerCOMMISSARIAT ENERGIE ATOMIQUE·Filed 1996·Granted Jul 13, 1999·10 cites·16 claims
- 3537US9743517B2Process for manufacturing an electrically conductive member for an electronic component comprising an end equipped with a cavityCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2014·Granted Aug 22, 2017·0 cites·18 claims
- 3637US2011143442A1Method for detecting the presence or absence of a chemical substance in a liquid mediumCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2009·Application pending·0 cites
- 3734US2005001214A1Micro- or nano-electronic component comprising a power source and means for protecting the power sourceFiled 2002·Application pending·0 cites
- 3833US2019371716A1Method for fabricating an integrated circuit chip and integrated circuit chipCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2018·Application pending·0 cites
- 3933US2013077281A1Chip elements mounted on wires having an incipient breaking pointBRUN JEAN·Filed 2011·Application pending·0 cites
- 4029US10264682B2Method for assembling a microelectronic chip device in a fabric, chip device, and fabric incorporating a crimped chip deviceBRUN JEAN·Filed 2012·Granted Apr 16, 2019·0 cites·16 claims
- 4123US6833570B1Structure comprising an insulated part in a solid substrate and method for producing sameFiled 1997·Granted Dec 21, 2004·1 cites·7 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →