Inventor · disambiguated record
Yong-Tae Bae
Also filed as: BAE YONG-TAE
1 granted patent·1 pending application·12 citations·filing 1997–2005
35Inventor score
Files withSAMSUNG ELECTRONICS CO LTD2
Top patents by PatentIndex Score
2 records- 0136US6004729AMethods of improving photoresist adhesion for integrated circuit fabricationSAMSUNG ELECTRONICS CO LTD·Filed 1997·Granted Dec 21, 1999·12 cites·30 claims
- 0234US2005248011A1Flip chip semiconductor package for testing bump and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →