Inventor · disambiguated record
Hem Takiar
Also filed as: TAKIAR HEM · TAKIAR HEM P
199 granted patents·34 pending applications·5,469 citations·filing 1981–2024
99Inventor score
Files withSANDISK CORP73NAT SEMICONDUCTOR CORP55TAKIAR HEM20SANDISK TECHNOLOGIES INC16MICRON TECHNOLOGY INC14
Top patents by PatentIndex Score
233 records- 0199US5495398AStacked multi-chip modules and method of manufacturingNAT SEMICONDUCTOR CORP·Filed 1995·Granted Feb 27, 1996·383 cites·4 claims
- 0299US5422435AStacked multi-chip modules and method of manufacturingNAT SEMICONDUCTOR CORP·Filed 1992·Granted Jun 6, 1995·513 cites·40 claims
- 0398US10381327B2Non-volatile memory system with wide I/O memory dieSANDISK TECHNOLOGIES LLC·Filed 2016·Granted Aug 13, 2019·66 cites·17 claims
- 0498US7364090B2Memory cards having two standard sets of contactsSANDISK CORP·Filed 2006·Granted Apr 29, 2008·93 cites·16 claims
- 0598US6384397B1Low cost die sized module for imaging application having a lens housing assemblyNAT SEMICONDUCTOR CORP·Filed 2000·Granted May 7, 2002·215 cites·17 claims
- 0698US5502289AStacked multi-chip modules and method of manufacturingNAT SEMICONDUCTOR CORP·Filed 1995·Granted Mar 26, 1996·342 cites·4 claims
- 0797US11282811B2Integrated circuit wire bonded to a multi-layer substrate having an open area that exposes wire bond pads at a surface of the inner layerMICRON TECHNOLOGY INC·Filed 2020·Granted Mar 22, 2022·5 cites·20 claims
- 0897US10522489B1Manufacturing process for separating logic and memory arrayWESTERN DIGITAL TECH INC·Filed 2018·Granted Dec 31, 2019·23 cites·21 claims
- 0996US11309281B2Overlapping die stacks for NAND package architectureMICRON TECHNOLOGY INC·Filed 2020·Granted Apr 19, 2022·5 cites·19 claims
- 1096US9899347B1Wire bonded wide I/O semiconductor deviceSANDISK TECHNOLOGIES LLC·Filed 2017·Granted Feb 20, 2018·19 cites·26 claims
- 1196US7355860B2Memory card with two standard sets of contacts and a contact covering mechanismSANDISK CORP·Filed 2006·Granted Apr 8, 2008·38 cites·11 claims
- 1296US7152801B2Memory cards having two standard sets of contactsSANDISK CORP·Filed 2004·Granted Dec 26, 2006·133 cites·36 claims
- 1396USD510935SIC memory cardSANDISK CORP·Filed 2004·Granted Oct 25, 2005·52 cites·1 claims
- 1496US4723197ABonding pad interconnection structureNAT SEMICONDUCTOR CORP·Filed 1985·Granted Feb 2, 1988·182 cites·9 claims
- 1595US7864540B2Peripheral card with sloped edgesSANDISK CORP·Filed 2007·Granted Jan 4, 2011·40 cites·11 claims
- 1695US7550834B2Stacked, interconnected semiconductor packagesSANDISK CORP·Filed 2006·Granted Jun 23, 2009·38 cites·15 claims
- 1795US7340540B2Memory card with contacts, device connector, and a connector covering mechanismSANDISK CORP·Filed 2006·Granted Mar 4, 2008·34 cites·10 claims
- 1895US7310692B2Memory card with integral covered second device connector for use with computing devices without a memory card slotSANDISK CORP·Filed 2005·Granted Dec 18, 2007·34 cites·16 claims
- 1995US7193161B1SiP module with a single sided lidSANDISK CORP·Filed 2006·Granted Mar 20, 2007·41 cites·24 claims
- 2095USD533556SIC memory cardMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2004·Granted Dec 12, 2006·50 cites·1 claims
- 2195US6521970B1Chip scale package with compliant leadsNAT SEMICONDUCTOR CORP·Filed 2000·Granted Feb 18, 2003·97 cites·12 claims
- 2294US6238949B1Method and apparatus for forming a plastic chip on chip package moduleNAT SEMICONDUCTOR CORP·Filed 1999·Granted May 29, 2001·156 cites·15 claims
- 2393US10854573B2Semiconductor die singulation using a sacrificial bonding material layer and an anisotropic channel etchSANDISK TECHNOLOGIES LLC·Filed 2019·Granted Dec 1, 2020·14 cites·17 claims
- 2493USD538286SMemory cardSANDISK CORP·Filed 2004·Granted Mar 13, 2007·38 cites·1 claims
- 2593USD523435SMemory cardSANDISK CORP·Filed 2003·Granted Jun 20, 2006·37 cites·1 claims
- 2692US10242965B2Semiconductor device including interconnected package on packageSANDISK INFORMATION TECH SHANGHAI CO LTD·Filed 2017·Granted Mar 26, 2019·9 cites·10 claims
- 2792US7375415B2Die package with asymmetric leadframe connectionSANDISK CORP·Filed 2005·Granted May 20, 2008·23 cites·30 claims
- 2892USD525623SMemory cardSANDISK CORP·Filed 2005·Granted Jul 25, 2006·39 cites·1 claims
- 2991US8373268B2Semiconductor package including flip chip controller at bottom of die stackSANDISK TECHNOLOGIES INC·Filed 2011·Granted Feb 12, 2013·10 cites·9 claims
- 3091USD535297SMemory card with two sets of contactsSANDISK CORP·Filed 2004·Granted Jan 16, 2007·30 cites·1 claims
- 3191US6245595B1Techniques for wafer level molding of underfill encapsulantNAT SEMICONDUCTOR CORP·Filed 1999·Granted Jun 12, 2001·161 cites·15 claims
- 3291US5718038AElectronic assembly for connecting to an electronic system and method of manufacture thereofNAT SEMICONDUCTOR CORP·Filed 1995·Granted Feb 17, 1998·76 cites·8 claims
- 3390US7336498B2Memory card with push-push connectorSANDISK CORP·Filed 2004·Granted Feb 26, 2008·42 cites·17 claims
- 3490US7307848B2Memory card with raised portionSANDISK CORP·Filed 2004·Granted Dec 11, 2007·51 cites·19 claims
- 3590USD537081SMemory cardSANDISK CORP·Filed 2004·Granted Feb 20, 2007·38 cites·1 claims
- 3690US5428245ALead frame including an inductor or other such magnetic componentNAT SEMICONDUCTOR CORP·Filed 1994·Granted Jun 27, 1995·119 cites·15 claims
- 3789US7485501B2Method of manufacturing flash memory cardsSANDISK CORP·Filed 2005·Granted Feb 3, 2009·18 cites·23 claims
- 3889US7259028B2Test pads on flash memory cardsSANDISK CORP·Filed 2005·Granted Aug 21, 2007·16 cites·17 claims
- 3989USD542797SMemory card with a contact covering lidSANDISK CORP·Filed 2005·Granted May 15, 2007·41 cites·1 claims
- 4088US11929351B2Integrated circuit wire bonded to a multi-layer substrate having an open area that exposes wire bond pads at a surface of the inner layerMICRON TECHNOLOGY INC·Filed 2022·Granted Mar 12, 2024·1 cites·20 claims
- 4188US7094633B2Method for efficiently producing removable peripheral cardsSANDISK CORP·Filed 2003·Granted Aug 22, 2006·43 cites·51 claims
- 4288USD525978SMemory cardSANDISK CORP·Filed 2005·Granted Aug 1, 2006·38 cites·1 claims
- 4388USD507795SIC memory cardSANDISK CORP·Filed 2004·Granted Jul 26, 2005·27 cites·1 claims
- 4488US6448632B1Metal coated markings on integrated circuit devicesNAT SEMICONDUCTOR CORP·Filed 2000·Granted Sep 10, 2002·49 cites·13 claims
- 4587US7816181B1Method of under-filling semiconductor die in a die stack and semiconductor device formed therebySANDISK CORP·Filed 2009·Granted Oct 19, 2010·12 cites·20 claims
- 4687US7795715B2Leadframe based flash memory cardsSANDISK CORP·Filed 2009·Granted Sep 14, 2010·12 cites·13 claims
- 4787US7416132B2Memory card with and without enclosureSANDISK CORP·Filed 2004·Granted Aug 26, 2008·33 cites·23 claims
- 4886US7822883B2Memory card with two standard sets of contacts and a hinged contact covering mechanismSANDISK CORP·Filed 2009·Granted Oct 26, 2010·9 cites·18 claims
- 4986US7554813B2Memory card with two standard sets of contacts and a contact covering mechanismSANDISK CORP·Filed 2007·Granted Jun 30, 2009·17 cites·16 claims
- 5086US5617297AEncapsulation filler technology for molding active electronics components such as IC cards or PCMCIA cardsNAT SEMICONDUCTOR CORP·Filed 1995·Granted Apr 1, 1997·93 cites·29 claims
Showing the top 50 of 233 patent records by PatentIndex Score.
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