Inventor · disambiguated record
Johanna M. Swan
Also filed as: SWAN JOHANNA · SWAN JOHANNA M · SWAN JOHANNA MARIE
301 granted patents·97 pending applications·1,947 citations·filing 2001–2025
99Inventor score
Top patents by PatentIndex Score
398 records- 0198US12080652B2Microelectronic assemblies with communication networksINTEL CORP·Filed 2023·Granted Sep 3, 2024·3 cites·20 claims
- 0298US11990448B2Direct bonding in microelectronic assembliesINTEL CORP·Filed 2020·Granted May 21, 2024·5 cites·18 claims
- 0398US9368429B2Interposer for hermetic sealing of sensor chips and for their integration with integrated circuit chipsMA QING·Filed 2012·Granted Jun 14, 2016·86 cites·16 claims
- 0498US8227904B2Multi-chip package and method of providing die-to-die interconnects in sameBRAUNISCH HENNING·Filed 2009·Granted Jul 24, 2012·174 cites·3 claims
- 0598US7420273B2Thinned die integrated circuit packageINTEL CORP·Filed 2005·Granted Sep 2, 2008·63 cites·16 claims
- 0698US7345361B2Stackable integrated circuit packagingINTEL CORP·Filed 2003·Granted Mar 18, 2008·307 cites·13 claims
- 0798US6841413B2Thinned die integrated circuit packageINTEL CORP·Filed 2002·Granted Jan 11, 2005·196 cites·30 claims
- 0897US12107060B2Microelectronic assemblies with inductors in direct bonding regionsINTEL CORP·Filed 2020·Granted Oct 1, 2024·5 cites·20 claims
- 0997US12062631B2Microelectronic assemblies with inductors in direct bonding regionsINTEL CORP·Filed 2020·Granted Aug 13, 2024·4 cites·20 claims
- 1097US11652059B2Composite interposer structure and method of providing sameINTEL CORP·Filed 2021·Granted May 16, 2023·5 cites·15 claims
- 1197US11469209B2Microelectronic assembliesINTEL CORP·Filed 2020·Granted Oct 11, 2022·3 cites·28 claims
- 1297US11348895B2Microelectronic assembliesINTEL CORP·Filed 2020·Granted May 31, 2022·3 cites·23 claims
- 1397US11222863B2Techniques for die stacking and associated configurationsINTEL CORP·Filed 2016·Granted Jan 11, 2022·21 cites·16 claims
- 1497US6512861B2Packaging and assembly method for optical couplingINTEL CORP·Filed 2001·Granted Jan 28, 2003·117 cites·43 claims
- 1596US12057402B2Direct bonding in microelectronic assembliesINTEL CORP·Filed 2020·Granted Aug 6, 2024·3 cites·20 claims
- 1696US11967580B2Microelectronic assemblies with communication networksINTEL CORP·Filed 2022·Granted Apr 23, 2024·2 cites·19 claims
- 1796US11791277B2Microelectronic assembliesINTEL CORP·Filed 2022·Granted Oct 17, 2023·2 cites·15 claims
- 1896US11527501B1Sacrificial redistribution layer in microelectronic assemblies having direct bondingINTEL CORP·Filed 2020·Granted Dec 13, 2022·7 cites·11 claims
- 1996US11217535B2Microelectronic assemblies with communication networksINTEL CORP·Filed 2017·Granted Jan 4, 2022·12 cites·20 claims
- 2096US10943851B1Reconstituted wafer assemblyINTEL CORP·Filed 2019·Granted Mar 9, 2021·18 cites·22 claims
- 2196US10319896B2Shielded interconnectsINTEL CORP·Filed 2017·Granted Jun 11, 2019·19 cites·25 claims
- 2296US9735893B1Patch system for in-situ therapeutic treatmentINTEL CORP·Filed 2016·Granted Aug 15, 2017·53 cites·20 claims
- 2395US12176323B2Microelectronic assembliesINTEL CORP·Filed 2022·Granted Dec 24, 2024·2 cites·12 claims
- 2495US12165962B2Hermetic sealing structures in microelectronic assemblies having direct bondingINTEL CORP·Filed 2020·Granted Dec 10, 2024·3 cites·19 claims
- 2595US11335642B2Microelectronic assembliesINTEL CORP·Filed 2017·Granted May 17, 2022·9 cites·19 claims
- 2695US11335663B2Microelectronic assembliesINTEL CORP·Filed 2017·Granted May 17, 2022·8 cites·19 claims
- 2795US10763216B2Multi-chip package and method of providing die-to-die interconnects in sameINTEL CORP·Filed 2019·Granted Sep 1, 2020·7 cites·19 claims
- 2895US10054737B2Optical I/O system using planar light-wave integrated circuitINTEL CORP·Filed 2016·Granted Aug 21, 2018·12 cites·25 claims
- 2995US6848177B2Integrated circuit die and an electronic assembly having a three-dimensional interconnection schemeINTEL CORP·Filed 2002·Granted Feb 1, 2005·86 cites·20 claims
- 3095US6754407B2Flip-chip package integrating optical and electrical devices and coupling to a waveguide on a boardINTEL CORP·Filed 2002·Granted Jun 22, 2004·104 cites·22 claims
- 3194US11469206B2Microelectronic assembliesINTEL CORP·Filed 2018·Granted Oct 11, 2022·10 cites·25 claims
- 3294US10976822B2Systems, methods, and apparatuses for implementing increased human perception of haptic feedback systemsINTEL CORP·Filed 2016·Granted Apr 13, 2021·12 cites·25 claims
- 3394US10314171B1Package assembly with hermetic cavityINTEL CORP·Filed 2017·Granted Jun 4, 2019·10 cites·20 claims
- 3494US9902152B2Piezoelectric package-integrated synthetic jet devicesINTEL CORP·Filed 2016·Granted Feb 27, 2018·5 cites·20 claims
- 3594US8207453B2Glass core substrate for integrated circuit devices and methods of making the sameMA QING·Filed 2009·Granted Jun 26, 2012·28 cites·13 claims
- 3693US12224261B2Mixed hybrid bonding structures and methods of forming the sameINTEL CORP·Filed 2021·Granted Feb 11, 2025·2 cites·15 claims
- 3793US11616047B2Microelectronic assembliesINTEL CORP·Filed 2020·Granted Mar 28, 2023·2 cites·23 claims
- 3893US11581282B2Serializer-deserializer die for high speed signal interconnectINTEL CORP·Filed 2018·Granted Feb 14, 2023·10 cites·8 claims
- 3993US10964178B2Systems, methods and apparatuses for implementing increased human perception of haptic feedback systemsINTEL CORP·Filed 2016·Granted Mar 30, 2021·10 cites·26 claims
- 4093US10951248B1Radio frequency (RF) module with shared inductorINTEL CORP·Filed 2019·Granted Mar 16, 2021·9 cites·10 claims
- 4193US9875969B2Multi-chip package and method of providing die-to-die interconnects in sameBRAUNISCH HENNING·Filed 2012·Granted Jan 23, 2018·12 cites·6 claims
- 4293US9507086B2Optical I/O system using planar light-wave integrated circuitKOBRINSKY MAURO J·Filed 2011·Granted Nov 29, 2016·19 cites·9 claims
- 4392US11476554B2Mmwave waveguide to waveguide connectors for automotive applicationsINTEL CORP·Filed 2017·Granted Oct 18, 2022·9 cites·25 claims
- 4492US11437348B2Microelectronic assemblies with communication networksINTEL CORP·Filed 2020·Granted Sep 6, 2022·2 cites·14 claims
- 4592US11270947B2Composite interposer structure and method of providing sameINTEL CORP·Filed 2019·Granted Mar 8, 2022·5 cites·20 claims
- 4692US11206008B2Hybrid filter architecture with integrated passives, acoustic wave resonators and hermetically sealed cavities between two resonator diesINTEL CORP·Filed 2017·Granted Dec 21, 2021·7 cites·25 claims
- 4792US11049791B1Heat spreading layer integrated within a composite IC die structure and methods of forming the sameINTEL CORP·Filed 2019·Granted Jun 29, 2021·7 cites·22 claims
- 4892US10291283B2Tunable radio frequency systems using piezoelectric package-integrated switching devicesINTEL CORP·Filed 2016·Granted May 14, 2019·6 cites·22 claims
- 4992US9967040B2Patch system for in-situ therapeutic treatmentINTEL CORP·Filed 2017·Granted May 8, 2018·14 cites·20 claims
- 5092US2025349820A1Microelectronic assembliesINTEL CORP·Filed 2025·Application pending·0 cites
Showing the top 50 of 398 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →