Inventor · disambiguated record

Steven Yu Feng Yao

Also filed as: YAO STEVEN YU FENG

1 granted patent·1 pending application·1 citations·filing 2005–2008

17Inventor score

Technology areasH10W

Files withUTAC UNITED TEST AND ASSEMBLY2

Top patents by PatentIndex Score

2 records

0146US7678610B2Semiconductor chip package and method of manufactureUTAC UNITED TEST AND ASSEMBLY·Filed 2005·Granted Mar 16, 2010·1 cites·10 claims
0238US2008251938A1Semiconductor chip package and method of manufactureUTAC UNITED TEST AND ASSEMBLY·Filed 2008·Application pending·0 cites

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