Inventor · disambiguated record
Sin Nee Song
Also filed as: SONG SIN NEE
1 granted patent·2 pending applications·1 citations·filing 2005–2008
17Inventor score
Technology areasH10W
Top patents by PatentIndex Score
3 records- 0146US7678610B2Semiconductor chip package and method of manufactureUTAC UNITED TEST AND ASSEMBLY·Filed 2005·Granted Mar 16, 2010·1 cites·10 claims
- 0238US2008251938A1Semiconductor chip package and method of manufactureUTAC UNITED TEST AND ASSEMBLY·Filed 2008·Application pending·0 cites
- 0333US2007132081A1Multiple stacked die window csp package and method of manufactureUNITED TEST & ASSEMBLY CT LTD·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →