Inventor · disambiguated record

Toshihisa Higashiyama

Also filed as: HIGASHIYAMA TOSHIHISA

2 granted patents·83 citations·filing 1998–1999

67Inventor score

Technology areasH10W

Files withFUJITSU LTD2

Top patents by PatentIndex Score

2 records

0177US6166433AResin molded semiconductor device and method of manufacturing semiconductor packageFUJITSU LTD·Filed 1998·Granted Dec 26, 2000·59 cites·16 claims
0257US6160313ASemiconductor device having an insulating substrateFUJITSU LTD·Filed 1999·Granted Dec 12, 2000·24 cites·12 claims

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →