Inventor · disambiguated record
Johannes Lodermeyer
Also filed as: LODERMEYER JOHANNES
12 granted patents·2 pending applications·77 citations·filing 2007–2018
86Inventor score
Top patents by PatentIndex Score
14 records- 0198US9331060B2Device including two power semiconductor chips and manufacturing thereofINFINEON TECHNOLOGIES AG·Filed 2015·Granted May 3, 2016·48 cites·8 claims
- 0295US8975711B2Device including two power semiconductor chips and manufacturing thereofOTREMBA RALF·Filed 2011·Granted Mar 10, 2015·22 cites·26 claims
- 0388US10549985B2Semiconductor package with a through port for sensor applicationsINFINEON TECHNOLOGIES AG·Filed 2017·Granted Feb 4, 2020·4 cites·15 claims
- 0473US9437516B2Chip-embedded packages with backside die connectionINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2014·Granted Sep 6, 2016·3 cites·20 claims
- 0563US7909978B2Method of making an integrated circuit including electrodeposition of metallic chromiumINFINEON TECHNOLOGIES AG·Filed 2007·Granted Mar 22, 2011·0 cites·16 claims
- 0653US2008257744A1Method of making an integrated circuit including electrodeposition of aluminiumINFINEON TECHNOLOGIES AG·Filed 2007·Application pending·0 cites
- 0746US11387533B2Semiconductor package with plastic waveguideINFINEON TECHNOLOGIES AG·Filed 2018·Granted Jul 12, 2022·0 cites·24 claims
- 0846US7989930B2Semiconductor packageINFINEON TECHNOLOGIES AG·Filed 2007·Granted Aug 2, 2011·0 cites·22 claims
- 0944US12368111B2Semiconductor apparatuses with radio-frequency line elements, and associated manufacturing methodsINFINEON TECHNOLOGIES AG·Filed 2018·Granted Jul 22, 2025·0 cites·20 claims
- 1044US10734352B2Metallic interconnect, a method of manufacturing a metallic interconnect, a semiconductor arrangement and a method of manufacturing a semiconductor arrangementINFINEON TECHNOLOGIES AG·Filed 2018·Granted Aug 4, 2020·0 cites·21 claims
- 1144US8603864B2Method of fabricating a semiconductor deviceRIEDL EDMUND·Filed 2008·Granted Dec 10, 2013·0 cites·5 claims
- 1240US10923364B2Methods for producing packaged semiconductor devicesINFINEON TECHNOLOGIES AG·Filed 2018·Granted Feb 16, 2021·0 cites·20 claims
- 1340US10571682B2Tilted chip assembly for optical devicesINFINEON TECHNOLOGIES AG·Filed 2017·Granted Feb 25, 2020·0 cites·16 claims
- 1436US2017283247A1Semiconductor device including a mems dieINFINEON TECHNOLOGIES AG·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →