Inventor · disambiguated record
Hung-Chao Kao
Also filed as: KAO HUNG-CHAO
15 granted patents·2 pending applications·19 citations·filing 2007–2025
88Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD10LIN YU-TSUNG3TSMC SOLID STATE LIGHTING LTD2HSIA SHOULI STEVE1UNITED MICROELECTRONICS CORP1
Top patents by PatentIndex Score
17 records- 0192US11342408B2Metal-insulator-metal structure and methods of fabrication thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 24, 2022·2 cites·20 claims
- 0289US8587018B2LED structure having embedded zener diodeHSIA SHOULI STEVE·Filed 2011·Granted Nov 19, 2013·11 cites·19 claims
- 0386US12477756B2Metal-insulator-metal structure and methods of fabrication thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Nov 18, 2025·0 cites·20 claims
- 0484US10734474B2Metal-insulator-metal structure and methods of fabrication thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Aug 4, 2020·2 cites·19 claims
- 0580US11532695B2Stress reduction structure for metal-insulator-metal capacitorsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Dec 20, 2022·1 cites·20 claims
- 0679US11923405B2Metal-insulator-metal structure and methods of fabrication thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Mar 5, 2024·0 cites·20 claims
- 0775US11222946B2Semiconductor device including a high density MIM capacitor and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jan 11, 2022·2 cites·20 claims
- 0874US2025318158A1Method of forming a stress reduction structure for metal-insulator-metal capacitorsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0967US12389612B2Method of forming a stress reduction structure for metal-insulator-metal capacitorsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Aug 12, 2025·0 cites·20 claims
- 1065US8493661B2Contiguous microlens arrayLIN YU-TSUNG·Filed 2012·Granted Jul 23, 2013·1 cites·12 claims
- 1164US9184334B2LED structureTSMC SOLID STATE LIGHTING LTD·Filed 2014·Granted Nov 10, 2015·0 cites·20 claims
- 1262US8809899B2LED structureTSMC SOLID STATE LIGHTING LTD·Filed 2013·Granted Aug 19, 2014·0 cites·16 claims
- 1358US12310252B2Semiconductor memory structure and method for forming the semiconductor memory structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted May 20, 2025·0 cites·20 claims
- 1457US8379312B2Method of fabricating contiguous microlens arrayUNITED MICROELECTRONICS CORP·Filed 2012·Granted Feb 19, 2013·0 cites·14 claims
- 1551US2024145378A1Via with sacrificial stress barrier ringTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 1649US8519500B2Image sensor with correcting lens and fabrication thereofLIN YU-TSUNG·Filed 2007·Granted Aug 27, 2013·0 cites·21 claims
- 1748US8228606B2Contiguous microlens array and photomask for defining the sameLIN YU-TSUNG·Filed 2008·Granted Jul 24, 2012·0 cites·18 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →