Inventor · disambiguated record
Yoshitaka Takezawa
Also filed as: TAKEZAWA YOSHITAKA
46 granted patents·34 pending applications·289 citations·filing 1991–2025
97Inventor score
Files withHITACHI CHEMICAL CO LTD29HITACHI LTD15SHOWA DENKO MATERIALS CO LTD15RESONAC CORP4TANAKA SHINYA3
Top patents by PatentIndex Score
80 records- 0196US7504720B2Semiconductor unit, and power conversion system and on-vehicle electrical system using the sameHITACHI LTD·Filed 2006·Granted Mar 17, 2009·38 cites·18 claims
- 0296US7455901B2Fiber-reinforced composite material, method for manufacturing the same and applications thereofUNIV KYOTO·Filed 2006·Granted Nov 25, 2008·36 cites·16 claims
- 0391US11208525B2Epoxy resin, epoxy resin composition, inorganic filler-containing epoxy resin composition, resin sheet, cured product, and epoxy compoundHITACHI CHEMICAL CO LTD·Filed 2019·Granted Dec 28, 2021·2 cites·12 claims
- 0491US11015020B2Epoxy resin, epoxy resin composition, epoxy resin cured product and composite materialSHOWA DENKO MATERIALS CO LTD·Filed 2016·Granted May 25, 2021·3 cites·8 claims
- 0591US10920010B2Epoxy resin, epoxy resin composition, epoxy resin cured product, and composite materialSHOWA DENKO MATERIALS CO LTD·Filed 2017·Granted Feb 16, 2021·3 cites·9 claims
- 0691US10662279B2Epoxy resin composition, semi-cured epoxy resin composition, cured epoxy resin composition, molded article, and cured molded articleHITACHI CHEMICAL CO LTD·Filed 2016·Granted May 26, 2020·4 cites·18 claims
- 0791US10597485B2Production methods for glassy liquid-crystalline epoxy resin and glassy liquid-crystalline epoxy resin composition, storage methods for liquid-crystalline epoxy resin and liquid-crystalline epoxy resin composition, glassy liquid-crystalline epoxy resin and glassy liquid-crystalline epoxy resin composition, liquid-crystalline epoxy resin and liquid-crystalline epoxy resin composition, and production method for cured epoxy resinHITACHI CHEMICAL CO LTD·Filed 2017·Granted Mar 24, 2020·5 cites·15 claims
- 0888US11466119B2Epoxy resin, epoxy resin composition, epoxy resin cured product, and composite materialSHOWA DENKO MATERIALS CO LTD·Filed 2018·Granted Oct 11, 2022·2 cites·14 claims
- 0988US10800872B2Epoxy resin, epoxy resin composition, epoxy resin cured product, and composite materialHITACHI CHEMICAL CO LTD·Filed 2017·Granted Oct 13, 2020·2 cites·10 claims
- 1088US2024417509A1Epoxy resin, epoxy resin composition, epoxy resin cured product and method of producing epoxy resin cured product, composite material, insulating member, electronic appliance, structural material, and vehicleRESONAC CORP·Filed 2024·Application pending·0 cites
- 1187US12104009B2Epoxy resin, epoxy resin composition, epoxy resin cured product and method of producing epoxy resin cured product, composite material, insulating member, electronic appliance, structural material, and vehicleRESONAC CORP·Filed 2018·Granted Oct 1, 2024·1 cites·7 claims
- 1287US11440990B2Epoxy resin, epoxy resin composition, epoxy resin cured product, and composite materialSHOWA DENKO MATERIALS CO LTD·Filed 2017·Granted Sep 13, 2022·2 cites·13 claims
- 1386US7816786B2Semiconductor unit, and power conversion system and on-vehicle electrical system using the sameHITACHI LTD·Filed 2009·Granted Oct 19, 2010·12 cites·8 claims
- 1485US11840619B2Epoxy resin composition, thermally-conductive material precursor, B-stage sheet, prepreg, heat dissipation material, laminate, metal substrate, and printed circuit boardHITACHI CHEMICAL CO LTD·Filed 2020·Granted Dec 12, 2023·1 cites·21 claims
- 1585US10988585B2Resin sheet and cured product of resin sheetHITACHI CHEMICAL CO LTD·Filed 2016·Granted Apr 27, 2021·2 cites·10 claims
- 1685US6261481B1Insulating compositionHITACHI LTD·Filed 1999·Granted Jul 17, 2001·83 cites·16 claims
- 1783US7691473B2Fiber-reinforced composite material, method for manufacturing the same, and applications thereofROHM CO LTD·Filed 2008·Granted Apr 6, 2010·4 cites·18 claims
- 1882US12116451B2Epoxy resin, epoxy resin composition, epoxy resin cured product and composite materialSHOWA DENKO MATERIALS CO LTD·Filed 2019·Granted Oct 15, 2024·1 cites·11 claims
- 1981US9249293B2Composite particle, method for producing the same, and resin compositionTAKEZAWA YOSHITAKA·Filed 2011·Granted Feb 2, 2016·4 cites·7 claims
- 2078US11814568B2Anisotropic thermal conductive resin member and manufacturing method thereofHITACHI CHEMICAL CO LTD·Filed 2019·Granted Nov 14, 2023·2 cites·2 claims
- 2178US10584228B2Epoxy resin composition, thermally-conductive material precursor, B-stage sheet, prepreg, heat dissipation material, laminate, metal substrate, and printed circuit boardHITACHI CHEMICAL CO LTD·Filed 2016·Granted Mar 10, 2020·1 cites·21 claims
- 2274US7167247B2Paper quality discriminating machineHITACHI LTD·Filed 2003·Granted Jan 23, 2007·14 cites·4 claims
- 2371US10851200B2Resin composition and method of producing laminateHITACHI CHEMICAL CO LTD·Filed 2019·Granted Dec 1, 2020·0 cites·6 claims
- 2469US7538166B2Epoxy compounds and cured epoxy resins obtained by curing the compoundsSUMITOMO CHEMICAL CO·Filed 2004·Granted May 26, 2009·7 cites·10 claims
- 2568US2025197557A1Epoxy resin b-stage film, epoxy resin cured film and method of producing epoxy resin cured filmRESONAC CORP·Filed 2025·Application pending·0 cites
- 2666US12049538B2Epoxy resin, epoxy resin composition, epoxy resin cured product and composite materialSHOWA DENKO MATERIALS CO LTD·Filed 2018·Granted Jul 30, 2024·0 cites·12 claims
- 2766US2018009979A1Resin composition, resin sheet, and cured resin material and method for producing the sameHITACHI CHEMICAL CO LTD·Filed 2017·Application pending·0 cites
- 2864US10590232B2Resin composition and method of producing laminateHITACHI CHEMICAL CO LTD·Filed 2017·Granted Mar 17, 2020·0 cites·10 claims
- 2963US10934387B2Epoxy resin, epoxy resin composition, inorganic filler-containing epoxy resin composition, resin sheet, cured product, and epoxy compoundHITACHI CHEMICAL CO LTD·Filed 2015·Granted Mar 2, 2021·0 cites·5 claims
- 3062US6730911B2Method and apparatus for paper material discrimination with two near-infrared lightsHITACHI LTD·Filed 2002·Granted May 4, 2004·4 cites·23 claims
- 3162US2020216324A1Complex of lamellar inorganic compound and organic compound and method of producing thereof, delaminated lamellar inorganic compound and method of producing thereof, insulating resin composition, resin sheet, insulator, resin sheet cured product, and heat dissipating memberHITACHI CHEMICAL CO LTD·Filed 2020·Application pending·0 cites
- 3261US5093888AOptical transmitting system, optical members and polymer for same, and usage of sameHITACHI LTD·Filed 1991·Granted Mar 3, 1992·13 cites·12 claims
- 3361US2022025107A1Epoxy resin b-stage film, epoxy resin cured film and method of producing epoxy resin cured filmSHOWA DENKO MATERIALS CO LTD·Filed 2018·Application pending·0 cites
- 3461US2014283972A1Resin composition, resin sheet, and cured resin material and method for producing the sameHITACHI CHEMICAL CO LTD·Filed 2014·Application pending·0 cites
- 3559US11352562B2Epoxy resin, epoxy resin composition, epoxy resin cured product and composite materialSHOWA DENKO MATERIALS CO LTD·Filed 2019·Granted Jun 7, 2022·0 cites·7 claims
- 3658US11149109B2Epoxy resin composition, cured product and composite materialHITACHI CHEMICAL CO LTD·Filed 2017·Granted Oct 19, 2021·0 cites·9 claims
- 3758US6061139ANondestructive diagnostic method and nondestructive diagnostic apparatusHITACHI LTD·Filed 1997·Granted May 9, 2000·23 cites·17 claims
- 3857US6765043B2Epoxy resin, epoxy resin composition, cured epoxy resin, and manufacturing method thereofHITACHI LTD·Filed 2002·Granted Jul 20, 2004·3 cites·2 claims
- 3956US2010160555A1Resin compositionTANAKA SHINYA·Filed 2008·Application pending·0 cites
- 4055US11919995B2Epoxy resin, epoxy resin composition, epoxy resin cured product, and composite materialRESONAC CORP·Filed 2019·Granted Mar 5, 2024·0 cites·14 claims
- 4154US12071714B2Anisotropic thermal conductive resin fiber, anisotropic thermal conductive resin member, and manufacturing method of theseHITACHI CHEMICAL CO LTD·Filed 2019·Granted Aug 27, 2024·0 cites·12 claims
- 4254US2010063182A1Epoxy compositionTANAKA SHINYA·Filed 2008·Application pending·0 cites
- 4354US2021332281A1Heat radiation material, method for producing heat radiation material, heat radiation material kit, and heat generatorSHOWA DENKO MATERIALS CO LTD·Filed 2019·Application pending·0 cites
- 4454US2021345518A1Device and heat radiation methodSHOWA DENKO MATERIALS CO LTD·Filed 2019·Application pending·0 cites
- 4553US2023183415A1Primer, substrate equipped with primer layer, method for producing substrate equipped with primer layer, semiconductor device, and method for producing semiconductor deviceSHOWA DENKO MATERIALS CO LTD·Filed 2021·Application pending·0 cites
- 4653US2010144926A1Epoxy resin compositionTANAKA SHINYA·Filed 2008·Application pending·0 cites
- 4753US2018044191A1Complex of lamellar inorganic compound and organic compound and method of producing thereof, delaminated lamellar inorganic compound and method of producing thereof, insulating resin composition, resin sheet, insulator, resin sheet cured product, and heat dissipating memberHITACHI CHEMICAL CO LTD·Filed 2016·Application pending·0 cites
- 4852US11840600B2Cured epoxy resin material, epoxy resin composition, molded article, and composite materialHITACHI CHEMICAL CO LTD·Filed 2017·Granted Dec 12, 2023·0 cites·7 claims
- 4952US11560476B2Epoxy resin, epoxy resin composition, epoxy resin cured product, and composite materialSHOWA DENKO MATERIALS CO LTD·Filed 2017·Granted Jan 24, 2023·0 cites·6 claims
- 5051US10373727B2Prepreg mica tape and coil using sameHITACHI CHEMICAL CO LTD·Filed 2014·Granted Aug 6, 2019·0 cites·15 claims
Showing the top 50 of 80 patent records by PatentIndex Score.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →