Inventor · disambiguated record
Mao Takeda
Also filed as: TAKEDA MAO
1 granted patent·5 pending applications·0 citations·filing 2021–2023
6Inventor score
Files withNIPPON KAYAKU KK6
Top patents by PatentIndex Score
6 records- 0152US2025270372A1Bismaleimide compound, resin composition including same, cured object therefrom, semiconductor element and dry film resistNIPPON KAYAKU KK·Filed 2022·Application pending·0 cites
- 0250US2024174809A1Resin composition, resin sheet, multilayered printed wiring board, and semiconductor deviceNIPPON KAYAKU KK·Filed 2021·Application pending·0 cites
- 0345US2024182644A1Curable resin composition and cured object obtained therefromNIPPON KAYAKU KK·Filed 2022·Application pending·0 cites
- 0444US2025326879A1Resin composition for optical waveguides, resin composition for substrate with optical waveguide, resin film, cured object, and optical circuit boardNIPPON KAYAKU KK·Filed 2023·Application pending·0 cites
- 0540US12486371B2Thermally curable resin composition, cured object, resin sheet, prepreg, metal-clad laminate, multilayered printed wiring board, sealing material, fiber-reinforced composite material, adhesive, and semiconductor deviceNIPPON KAYAKU KK·Filed 2021·Granted Dec 2, 2025·0 cites·15 claims
- 0636US2024191030A1Resin composition, cured object, resin sheet, prepreg, metal-clad laminate, multilayered printed wiring board, sealing material, fiber-reinforced composite material, adhesive, and semiconductor deviceNIPPON KAYAKU KK·Filed 2021·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →