Inventor · disambiguated record
Eri Yoshizawa
Also filed as: Yoshizawa eri
1 granted patent·2 pending applications·0 citations·filing 2021–2021
6Inventor score
Files withNIPPON KAYAKU KK3
Top patents by PatentIndex Score
3 records- 0150US2024174809A1Resin composition, resin sheet, multilayered printed wiring board, and semiconductor deviceNIPPON KAYAKU KK·Filed 2021·Application pending·0 cites
- 0240US12486371B2Thermally curable resin composition, cured object, resin sheet, prepreg, metal-clad laminate, multilayered printed wiring board, sealing material, fiber-reinforced composite material, adhesive, and semiconductor deviceNIPPON KAYAKU KK·Filed 2021·Granted Dec 2, 2025·0 cites·15 claims
- 0336US2024191030A1Resin composition, cured object, resin sheet, prepreg, metal-clad laminate, multilayered printed wiring board, sealing material, fiber-reinforced composite material, adhesive, and semiconductor deviceNIPPON KAYAKU KK·Filed 2021·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →