Inventor · disambiguated record
Sung Je Kim
Also filed as: KIM SUNG · KIM SUNG JE
22 granted patents·4 pending applications·308 citations·filing 1996–2025
94Inventor score
Files withLAM RES CORP8APPLIED MATERIALS INC5HYPERTHERM INC5SEMES CO LTD3SAMSUNG ELECTRONICS CO LTD2
Top patents by PatentIndex Score
26 records- 0198US9885117B2Conditioned semiconductor system partsAPPLIED MATERIALS INC·Filed 2015·Granted Feb 6, 2018·108 cites·14 claims
- 0296US10655224B2Conical wafer centering and holding device for semiconductor processingLAM RES CORP·Filed 2016·Granted May 19, 2020·8 cites·20 claims
- 0396US9903020B2Generation of compact alumina passivation layers on aluminum plasma equipment componentsAPPLIED MATERIALS INC·Filed 2014·Granted Feb 27, 2018·108 cites·5 claims
- 0494US9967964B2Cooling plasma cutting system consumables and related systems and methodsHYPERTHERM INC·Filed 2015·Granted May 8, 2018·14 cites·11 claims
- 0593US9460898B2Plasma generation chamber with smooth plasma resistant coatingAPPLIED MATERIALS INC·Filed 2015·Granted Oct 4, 2016·10 cites·20 claims
- 0679US12368025B2Edge seal for lower electrode assemblyLAM RES CORP·Filed 2023·Granted Jul 22, 2025·0 cites·20 claims
- 0779US10622243B2Planar substrate edge contact with open volume equalization pathways and side containmentLAM RES CORP·Filed 2017·Granted Apr 14, 2020·2 cites·19 claims
- 0878US8884179B2Torch flow regulation using nozzle featuresROBERTS JESSE·Filed 2010·Granted Nov 11, 2014·7 cites·35 claims
- 0976US11622440B2Cooling plasma cutting system consumables and related systems and methodsHYPERTHERM INC·Filed 2019·Granted Apr 4, 2023·2 cites·18 claims
- 1076US9908195B2Plasma cutting system with efficient componentsHYPERTHERM INC·Filed 2015·Granted Mar 6, 2018·3 cites·22 claims
- 1174US10351953B2Systems and methods for flow monitoring in a precursor vapor supply system of a substrate processing systemLAM RES CORP·Filed 2017·Granted Jul 16, 2019·2 cites·11 claims
- 1271US11781650B2Edge seal for lower electrode assemblyLAM RES CORP·Filed 2017·Granted Oct 10, 2023·1 cites·13 claims
- 1364US11255017B2Systems and methods for flow monitoring in a precursor vapor supply system of a substrate processing systemLAM RES CORP·Filed 2019·Granted Feb 22, 2022·0 cites·11 claims
- 1463US11443975B2Planar substrate edge contact with open volume equalization pathways and side containmentLAM RES CORP·Filed 2020·Granted Sep 13, 2022·0 cites·24 claims
- 1563US2025166977A1Substrate treating apparatus and substrate support unitSEMES CO LTD·Filed 2025·Application pending·0 cites
- 1661US12249491B2Substrate treating apparatus and substrate support unitSEMES CO LTD·Filed 2021·Granted Mar 11, 2025·0 cites·9 claims
- 1759US10827600B2Cooling plasma cutting system consumables and related systems and methodsHYPERTHERM INC·Filed 2018·Granted Nov 3, 2020·0 cites·30 claims
- 1857US12456606B2Support unit and apparatus for treating substrateSEMES CO LTD·Filed 2021·Granted Oct 28, 2025·0 cites·19 claims
- 1957US10542614B2Apparatus and method for securing a plasma torch electrodeHYPERTHERM INC·Filed 2013·Granted Jan 21, 2020·1 cites·11 claims
- 2050US5799372ASystem for supporting a monitorTOSHIBA AMERICA INF SYST·Filed 1996·Granted Sep 1, 1998·23 cites·14 claims
- 2145US6211855B1Technique for controlling screen size of monitor adapted to GUI environmentSAMSUNG ELECTRONICS CO LTD·Filed 1997·Granted Apr 3, 2001·11 cites·8 claims
- 2243US2015311043A1Chamber component with fluorinated thin film coatingAPPLIED MATERIALS INC·Filed 2015·Application pending·0 cites
- 2340US2021343509A9Conditioned semiconductor system partsAPPLIED MATERIALS INC·Filed 2018·Application pending·0 cites
- 2439US6130659ASignal management apparatus for use in display monitor of a multimedia computer system and method using on screen displaySAMSUNG ELECTRONICS CO LTD·Filed 1998·Granted Oct 10, 2000·8 cites·10 claims
- 2538US10626303B2Adhesive sheet having barrier applied thereto and method of manufacturing the sameSMART CO LTD·Filed 2017·Granted Apr 21, 2020·0 cites·10 claims
- 2638US2018334746A1Wafer Edge Contact Hardware and Methods to Eliminate Deposition at Wafer Backside Edge and NotchLAM RES CORP·Filed 2017·Application pending·0 cites
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