Inventor · disambiguated record
Shozo Ochi
Also filed as: OCHI SHOZO
15 granted patents·10 pending applications·236 citations·filing 2001–2022
92Inventor score
Files withMATSUSHITA ELECTRIC INDUSTRIAL CO LTD9PANASONIC CORP6PANASONIC IP MAN CO LTD5OCHI SHOZO4USHIROKAWA KAZUYA1
Top patents by PatentIndex Score
25 records- 0195US6459046B1Printed circuit board and method for producing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Oct 1, 2002·86 cites·9 claims
- 0293US6799369B2Printed circuit board and method for producing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2002·Granted Oct 5, 2004·52 cites·9 claims
- 0391US7775446B2Card type information device and method for manufacturing samePANASONIC CORP·Filed 2007·Granted Aug 17, 2010·31 cites·11 claims
- 0489US6753483B2Printed circuit board and method of manufacturing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Jun 22, 2004·36 cites·11 claims
- 0576US8031127B2Semiconductor memory module incorporating antennaPANASONIC CORP·Filed 2007·Granted Oct 4, 2011·6 cites·17 claims
- 0675US7471260B2Semiconductor memory module having built-in antennaPANASONIC CORP·Filed 2006·Granted Dec 30, 2008·7 cites·11 claims
- 0773US7924228B2Storage medium with built-in antennaPANASONIC CORP·Filed 2006·Granted Apr 12, 2011·8 cites·12 claims
- 0872US11892248B2Cooling unit and method for manufacturing cooling unitPANASONIC IP MAN CO LTD·Filed 2022·Granted Feb 6, 2024·0 cites·5 claims
- 0967US8025237B2Antenna built-in module, card type information device, and methods for manufacturing themPANASONIC CORP·Filed 2006·Granted Sep 27, 2011·5 cites·9 claims
- 1057US7155820B2Method for manufacturing printed circuit boardMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2003·Granted Jan 2, 2007·5 cites·10 claims
- 1153US2008185178A1Circuit board and method for manufacturing the same, semiconductor package, component built-in module and board for electronic equipmentMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2008·Application pending·0 cites
- 1249US2022045027A1Semiconductor device and method of manufacturing the samePANASONIC IP MAN CO LTD·Filed 2021·Application pending·0 cites
- 1348US10365446B2Optical module structurePANASONIC IP MAN CO LTD·Filed 2018·Granted Jul 30, 2019·0 cites·9 claims
- 1448US2009246474A1Electronic component mounted structure and method of manufacturing the samePANASONIC CORP·Filed 2009·Application pending·0 cites
- 1546US10790250B2Method for manufacturing semiconductor devicePANASONIC IP MAN CO LTD·Filed 2018·Granted Sep 29, 2020·0 cites·13 claims
- 1644US2005124197A1Circuit board and method for manufacturing the same, semiconductor package, component built-in module and board for electronic equipmentMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2004·Application pending·0 cites
- 1742US2009032285A1Multi-layer circuit substrate manufacturing method and multi-layer circuit substrateMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2005·Application pending·0 cites
- 1841US2009051606A1Electronic circuit module with built-in antenna and method for manufacturing the sameOCHI SHOZO·Filed 2007·Application pending·0 cites
- 1941US2005014035A1Prepreg for printed wiring board, printed wiring board using the prepreg and method for manufacturing the printed wiring board, and multilayer printed wiring board and method for manufacturing the multilayer printed wiring boardMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2004·Application pending·0 cites
- 2040US11381767B2Solid-state imaging device having electronic components mounted between a main substrate and an imaging elementPANASONIC IP MAN CO LTD·Filed 2020·Granted Jul 5, 2022·0 cites·8 claims
- 2140US2009286173A1Electronic component forming apparatus, electronic component formed with it and forming method thereofUSHIROKAWA KAZUYA·Filed 2009·Application pending·0 cites
- 2239US2003137815A1Printed wiring board and method of manufacturing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2003·Application pending·0 cites
- 2338US2009301771A1Conductive bump, method for forming the same, and electronic component mounting structure using the sameOCHI SHOZO·Filed 2009·Application pending·0 cites
- 2434US8745859B2Component built-in module, and manufacturing method for component built-in moduleOCHI SHOZO·Filed 2012·Granted Jun 10, 2014·0 cites·9 claims
- 2530US9041221B2Electronic component implementing structure intermediate body, electronic component implementing structure body and manufacturing method of electronic component implementing structure bodyOCHI SHOZO·Filed 2011·Granted May 26, 2015·0 cites·8 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →