Inventor · disambiguated record
Elsie Agdon Cabahug
Also filed as: CABAHUG ELSIE · CABAHUG ELSIE A · CABAHUG ELSIE AGDON
15 granted patents·2 pending applications·337 citations·filing 2000–2025
92Inventor score
Technology areasH10W
Top patents by PatentIndex Score
17 records- 0197US7285849B2Semiconductor die package using leadframe and clip and method of manufacturingFAIRCHILD SEMICONDUCTOR·Filed 2005·Granted Oct 23, 2007·114 cites·20 claims
- 0293US11791247B2Concealed gate terminal semiconductor packages and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2021·Granted Oct 17, 2023·2 cites·20 claims
- 0393US7122884B2Robust leaded molded packages and methods for forming the sameFAIRCHILD SEMICONDUCTOR·Filed 2003·Granted Oct 17, 2006·106 cites·12 claims
- 0492US7906837B2Robust leaded molded packages and methods for forming the sameFAIRCHILD SEMICONDUCTOR·Filed 2009·Granted Mar 15, 2011·28 cites·20 claims
- 0590US6391687B1Column ball grid array packageFAIRCHILD SEMICONDUCTOR·Filed 2000·Granted May 21, 2002·68 cites·12 claims
- 0688US2025372467A1Sic mosfet semiconductor packages and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2025·Application pending·0 cites
- 0785US11088046B2Semiconductor device package with clip interconnect and dual side coolingSEMICONDUCTOR COMPONENTS IND LLC·Filed 2018·Granted Aug 10, 2021·3 cites·11 claims
- 0881US11621203B2SiC MOSFET semiconductor packages and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2019·Granted Apr 4, 2023·2 cites·20 claims
- 0979US2024363471A1Semiconductor device package with clip interconnect and dual side coolingSEMICONDUCTOR COMPONENTS IND LLC·Filed 2024·Application pending·0 cites
- 1078US12463103B2SiC MOSFET semiconductor packages and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2023·Granted Nov 4, 2025·0 cites·20 claims
- 1178US8058107B2Semiconductor die package using leadframe and clip and method of manufacturingCRUZ ERWIN VICTOR R·Filed 2007·Granted Nov 15, 2011·10 cites·22 claims
- 1276US12300583B2Concealed gate terminal semiconductor packages and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2023·Granted May 13, 2025·0 cites·20 claims
- 1370US12051635B2Semiconductor device package with clip interconnect and dual side coolingSEMICONDUCTOR COMPONENTS IND LLC·Filed 2021·Granted Jul 30, 2024·0 cites·17 claims
- 1470US7560311B2Robust leaded molded packages and methods for forming the sameFAIRCHILD SEMICONDUCTOR·Filed 2006·Granted Jul 14, 2009·4 cites·25 claims
- 1558US11296069B2Substrate interposer on a leaderframeFAIRCHILD SEMICONDUCTOR·Filed 2020·Granted Apr 5, 2022·0 cites·16 claims
- 1652US11616006B2Semiconductor package with heatsinkSEMICONDUCTOR COMPONENTS IND LLC·Filed 2019·Granted Mar 28, 2023·0 cites·18 claims
- 1746US10546847B2Substrate interposer on a leadframeFAIRCHILD SEMICONDUCTOR·Filed 2016·Granted Jan 28, 2020·0 cites·22 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →