Inventor · disambiguated record
Wilmer R. Bottoms
Also filed as: BOTTOMS WILMER R
2 granted patents·1 pending application·77 citations·filing 2002–2009
63Inventor score
Technology areasG01R
Top patents by PatentIndex Score
3 records- 0196US7579848B2High density interconnect system for IC packages and interconnect assembliesNANONEXUS INC·Filed 2006·Granted Aug 25, 2009·72 cites·50 claims
- 0267US7812626B2High density interconnect system for IC packages and interconnect assembliesVERIGY PTE LTD SINGAPORE·Filed 2009·Granted Oct 12, 2010·5 cites·12 claims
- 0325US2004066207A1Flexible DUT interface assemblyFiled 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →