Inventor · disambiguated record
Ching-Lun Lai
Also filed as: LAI CHING-LUN
15 granted patents·5 pending applications·15 citations·filing 2002–2025
88Inventor score
Top patents by PatentIndex Score
20 records- 0189US9873943B2Apparatus and method for spatial atomic layer depositionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jan 23, 2018·4 cites·20 claims
- 0287US10161039B2Apparatus and method for spatial atomic layer depositionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 25, 2018·3 cites·20 claims
- 0377US9478617B2Method for forming semiconductor device structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Oct 25, 2016·2 cites·17 claims
- 0477US2025349539A1Deposition Equipment with Adjustable Temperature SourceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0574US2024371867A1Integrated circuit with anti-punch through controlTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0672US2024379398A1Semiconductor processing tool and method of operationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0769US12068317B2Integrated circuit with anti-punch through controlTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Aug 20, 2024·0 cites·20 claims
- 0867US12009208B2Deposition equipment with adjustable temperature sourceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jun 11, 2024·0 cites·20 claims
- 0967US11008654B2Apparatus and method for spatial atomic layer depositionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted May 18, 2021·0 cites·20 claims
- 1064US10494716B2Apparatus and method for spatial atomic layer depositionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 3, 2019·0 cites·20 claims
- 1164US9202916B2Semiconductor device structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Dec 1, 2015·1 cites·21 claims
- 1261US11315921B2Integrated circuit with anti-punch through controlTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Apr 26, 2022·0 cites·19 claims
- 1361US2023143537A1Semiconductor processing tool and method of operationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 1454US9871137B2Method for forming semiconductor device structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jan 16, 2018·0 cites·20 claims
- 1552US6828255B2Crack inhibited composite dielectric layerTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Dec 7, 2004·5 cites·18 claims
- 1649US11183405B2Semiconductor manufacturing apparatusTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Nov 23, 2021·0 cites·20 claims
- 1747US10269599B2Semiconductor manufacturing apparatusTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Apr 23, 2019·0 cites·20 claims
- 1841US11715639B2Semiconductor device and fabrication method thereforTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Aug 1, 2023·0 cites·20 claims
- 1940US10043892B2Method for manufacturing a semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Aug 7, 2018·0 cites·20 claims
- 2040US2016035563A1Apparatus and method for processing semiconductor wafersTAIWAN SEMICONDUCTOR MFG·Filed 2014·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →