Inventor · disambiguated record
Hosadurga Shobha
Also filed as: SHOBHA HOSADURGA · SHOBHA HOSADURGA K
110 granted patents·36 pending applications·614 citations·filing 1999–2024
99Inventor score
Top patents by PatentIndex Score
146 records- 0198US10020254B1Integration of super via structure in BEOLIBM·Filed 2017·Granted Jul 10, 2018·39 cites·8 claims
- 0298US10020255B1Integration of super via structure in BEOLIBM·Filed 2017·Granted Jul 10, 2018·36 cites·12 claims
- 0398US9947579B2Copper interconnect structure with manganese oxide barrier layerIBM·Filed 2017·Granted Apr 17, 2018·15 cites·8 claims
- 0498US9685406B1Selective and non-selective barrier layer wet removalIBM·Filed 2016·Granted Jun 20, 2017·34 cites·14 claims
- 0598US9601371B2Interconnect structure with barrier layerIBM·Filed 2015·Granted Mar 21, 2017·16 cites·15 claims
- 0697US12218003B2Selective ILD deposition for fully aligned via with airgapADEIA SEMICONDUCTOR SOLUTIONS LLC·Filed 2023·Granted Feb 4, 2025·2 cites·20 claims
- 0797US11756887B2Backside floating metal for increased capacitanceIBM·Filed 2021·Granted Sep 12, 2023·5 cites·22 claims
- 0897US11152257B2Barrier-less prefilled via formationIBM·Filed 2020·Granted Oct 19, 2021·5 cites·18 claims
- 0997US10529622B1Void-free metallic interconnect structures with self-formed diffusion barrier layersIBM·Filed 2018·Granted Jan 7, 2020·16 cites·20 claims
- 1097US10224241B2Copper interconnect structure with manganese oxide barrier layerIBM·Filed 2017·Granted Mar 5, 2019·9 cites·20 claims
- 1197US9966337B1Fully aligned via with integrated air gapsIBM·Filed 2017·Granted May 8, 2018·22 cites·12 claims
- 1297US9947581B2Method of forming a copper based interconnect structureIBM·Filed 2016·Granted Apr 17, 2018·10 cites·17 claims
- 1397US9455182B2Interconnect structure with capping layer and barrier layerIBM·Filed 2014·Granted Sep 27, 2016·18 cites·20 claims
- 1496US10325806B2Copper interconnect structure with manganese oxide barrier layerIBM·Filed 2017·Granted Jun 18, 2019·9 cites·11 claims
- 1595US8927442B1SiCOH hardmask with graded transition layersIBM·Filed 2013·Granted Jan 6, 2015·33 cites·10 claims
- 1694US10157789B2Via formation using sidewall image transfer process to define lateral dimensionIBM·Filed 2016·Granted Dec 18, 2018·12 cites·11 claims
- 1794US6288210B1High refractive index thermoplastic polyphosphonatesVIRGINIA TECH INTELL PROP·Filed 1999·Granted Sep 11, 2001·58 cites·12 claims
- 1893US10593591B2Interconnect structureTESSERA INC·Filed 2018·Granted Mar 17, 2020·4 cites·16 claims
- 1993US10002831B2Selective and non-selective barrier layer wet removalIBM·Filed 2017·Granted Jun 19, 2018·7 cites·15 claims
- 2093US9806023B1Selective and non-selective barrier layer wet removalIBM·Filed 2017·Granted Oct 31, 2017·8 cites·20 claims
- 2193US9490168B1Via formation using sidewall image transfer process to define lateral dimensionIBM·Filed 2015·Granted Nov 8, 2016·10 cites·9 claims
- 2292US8981466B2Multilayer dielectric structures for semiconductor nano-devicesIBM·Filed 2013·Granted Mar 17, 2015·13 cites·15 claims
- 2392US7737052B2Advanced multilayer dielectric cap with improved mechanical and electrical propertiesIBM·Filed 2008·Granted Jun 15, 2010·21 cites·10 claims
- 2491US10964588B2Selective ILD deposition for fully aligned via with airgapTESSERA INC·Filed 2020·Granted Mar 30, 2021·2 cites·17 claims
- 2591US9899317B1Nitridization for semiconductor structuresIBM·Filed 2016·Granted Feb 20, 2018·8 cites·18 claims
- 2691US7067083B2High refractive index thermoplastic polyphosphonatesVIRGINIA TECH INTELL PROP·Filed 2005·Granted Jun 27, 2006·8 cites·1 claims
- 2790US8120179B2Air gap interconnect structures and methods for forming the sameCHANDA KAUSHIK·Filed 2009·Granted Feb 21, 2012·19 cites·18 claims
- 2889US12424549B2Skip-level TSV with hybrid dielectric scheme for backside power deliveryIBM·Filed 2022·Granted Sep 23, 2025·1 cites·15 claims
- 2989US11056426B2Metallization interconnect structure formationIBM·Filed 2019·Granted Jul 6, 2021·6 cites·20 claims
- 3089US8299365B2Self-aligned composite M-MOx/dielectric cap for Cu interconnect structuresNGUYEN SON VAN·Filed 2010·Granted Oct 30, 2012·10 cites·19 claims
- 3189US7375178B2High refractive index thermoplastic polyphosphonatesESSILOR INT·Filed 2006·Granted May 20, 2008·6 cites·5 claims
- 3289US2025140606A1Selective ild deposition for fully aligned via with airgapADEIA SEMICONDUCTOR SOLUTIONS LLC·Filed 2024·Application pending·0 cites
- 3388US9312224B1Interconnect structure containing a porous low k interconnect dielectric/dielectric capIBM·Filed 2014·Granted Apr 12, 2016·9 cites·21 claims
- 3488US8980715B2Multilayer dielectric structures for semiconductor nano-devicesIBM·Filed 2013·Granted Mar 17, 2015·8 cites·19 claims
- 3588US8383507B2Method for fabricating air gap interconnect structuresIBM·Filed 2012·Granted Feb 26, 2013·8 cites·19 claims
- 3687US10763160B1Semiconductor device with selective insulator for improved capacitanceIBM·Filed 2019·Granted Sep 1, 2020·5 cites·17 claims
- 3787US10529662B2Method and structure to construct cylindrical interconnects to reduce resistanceIBM·Filed 2018·Granted Jan 7, 2020·3 cites·10 claims
- 3887US9558934B2Hydrogen-free silicon-based deposited dielectric films for nano device fabricationIBM·Filed 2015·Granted Jan 31, 2017·3 cites·7 claims
- 3987US8492289B2Barrier layer formation for metal interconnects through enhanced impurity diffusionEDELSTEIN DANIEL C·Filed 2010·Granted Jul 23, 2013·9 cites·4 claims
- 4087US7750479B2Treatment of plasma damaged layer for critical dimension retention, pore sealing and repairIBM·Filed 2007·Granted Jul 6, 2010·11 cites·19 claims
- 4186US9209017B2Advanced ultra low k SiCOH dielectrics prepared by built-in engineered pore size and bonding structured with cyclic organosilicon precursorsIBM·Filed 2014·Granted Dec 8, 2015·5 cites·20 claims
- 4286US8822137B2Self-aligned fine pitch permanent on-chip interconnect structures and method of fabricationLIN QINGHUANG·Filed 2011·Granted Sep 2, 2014·7 cites·17 claims
- 4386US2024006237A1Method of forming copper interconnect structure with manganese barrier layerADEIA SEMICONDUCTOR SOLUTIONS LLC·Filed 2023·Application pending·0 cites
- 4485US7781332B2Methods to mitigate plasma damage in organosilicate dielectrics using a protective sidewall spacerIBM·Filed 2007·Granted Aug 24, 2010·11 cites·14 claims
- 4583US10643890B2Ultrathin multilayer metal alloy liner for nano Cu interconnectsIBM·Filed 2016·Granted May 5, 2020·3 cites·9 claims
- 4682US9735005B1Robust high performance low hydrogen silicon carbon nitride (SiCNH) dielectrics for nano electronic devicesIBM·Filed 2016·Granted Aug 15, 2017·2 cites·9 claims
- 4782US9502288B2Method of forming an interconnect structureNGUYEN SON VAN·Filed 2012·Granted Nov 22, 2016·5 cites·10 claims
- 4881US9040411B2Advanced low k cap film formation process for nano electronic devicesIBM·Filed 2014·Granted May 26, 2015·4 cites·19 claims
- 4981US8129843B2Methods to mitigate plasma damage in organosilicate dielectrics using a protective sidewall spacerARNOLD JOHN C·Filed 2010·Granted Mar 6, 2012·5 cites·5 claims
- 5080US11804405B2Method of forming copper interconnect structure with manganese barrier layerTESSERA LLC·Filed 2021·Granted Oct 31, 2023·0 cites·20 claims
Showing the top 50 of 146 patent records by PatentIndex Score.
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