Inventor · disambiguated record
Brian Hoden
Also filed as: HODEN BRIAN · HODEN BRIAN P · HODEN BRIAN PATRICK
9 granted patents·5 pending applications·141 citations·filing 1998–2022
86Inventor score
Files withGEN ELECTRIC5ABACO SYSTEMS INC3AMETEK INC3DECADE PRODUCTS INC2GE INTELLIGENT PLATFORMS INC1
Top patents by PatentIndex Score
14 records- 0193US6352873B1Method for modular laser diode assemblyDECADE PRODUCTS INC·Filed 2000·Granted Mar 5, 2002·68 cites·11 claims
- 0289US9333599B2Electronics chassis and method of fabricating the sameGEN ELECTRIC·Filed 2013·Granted May 10, 2016·10 cites·20 claims
- 0385US9750127B2Circuit card assembly including heat transfer assembly and method of manufacturing suchGEN ELECTRIC·Filed 2015·Granted Aug 29, 2017·6 cites·22 claims
- 0481US9370090B2Circuit card assembly and method of manufacturing thereofGEN ELECTRIC·Filed 2014·Granted Jun 14, 2016·5 cites·20 claims
- 0577US6295307B1Laser diode assemblyDECADE PRODUCTS INC·Filed 1998·Granted Sep 25, 2001·52 cites·23 claims
- 0655US12328847B2Circuit card assembliesAMETEK INC·Filed 2022·Granted Jun 10, 2025·0 cites·30 claims
- 0754US12213285B2Conduction cooled chassisAMETEK INC·Filed 2022·Granted Jan 28, 2025·0 cites·31 claims
- 0850US2023062660A1Temperature dependent electronic component heating systemAMETEK INC·Filed 2022·Application pending·0 cites
- 0949US12356585B2Cooling module for providing enhanced localized cooling of a heatsinkABACO SYSTEMS INC·Filed 2020·Granted Jul 8, 2025·0 cites·15 claims
- 1047US11112840B2Electronics chassis with oscillating heat pipe (OHP)ABACO SYSTEMS INC·Filed 2019·Granted Sep 7, 2021·0 cites·21 claims
- 1142US2016169594A1Heatspreader with extended surface for heat transfer through a sealed chassis wallGE INTELLIGENT PLATFORMS INC·Filed 2013·Application pending·0 cites
- 1241US2024107714A1Impingement cooling providing enhanced localized cooling of a heatsinkABACO SYSTEMS INC·Filed 2020·Application pending·0 cites
- 1335US2016021788A1Electronic device assemblyGEN ELECTRIC·Filed 2015·Application pending·0 cites
- 1434US2017147044A1Mezzanine filler module apparatuses and methods for computing devicesGEN ELECTRIC·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →