Inventor · disambiguated record
Kelvin Dao
Also filed as: DAO KELVIN
1 granted patent·1 pending application·22 citations·filing 2013–2014
41Inventor score
Technology areasH10W
Top patents by PatentIndex Score
2 records- 0192US9330994B2Semiconductor device and method of forming RDL and vertical interconnect by laser direct structuringSTATS CHIPPAC LTD·Filed 2014·Granted May 3, 2016·22 cites·21 claims
- 0240US2015179602A1Integrated circuit packaging system with conductive ink and method of manufacture thereofCAMACHO ZIGMUND RAMIREZ·Filed 2013·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →