Inventor · disambiguated record
Teong Guan Yew
Also filed as: YEW TEONG GUAN · YEW TEONG GUAN T G
9 granted patents·3 pending applications·27 citations·filing 2002–2022
82Inventor score
Files withINTEL CORP12
Top patents by PatentIndex Score
12 records- 0192US10014710B2Foldable fabric-based packaging solutionINTEL CORP·Filed 2015·Granted Jul 3, 2018·5 cites·17 claims
- 0283US9606955B2Embedded universal serial bus solutionsINTEL CORP·Filed 2014·Granted Mar 28, 2017·9 cites·25 claims
- 0382US10084698B2Selectively enabling first and second communication paths using a repeaterINTEL CORP·Filed 2015·Granted Sep 25, 2018·5 cites·20 claims
- 0459US7109569B2Dual referenced microstripINTEL CORP·Filed 2003·Granted Sep 19, 2006·8 cites·14 claims
- 0555US11805602B2Chip assembliesINTEL CORP·Filed 2020·Granted Oct 31, 2023·0 cites·20 claims
- 0653US12412784B2Recessed vertical interconnects for device miniaturizationINTEL CORP·Filed 2021·Granted Sep 9, 2025·0 cites·16 claims
- 0752US2024063148A1Deep trench capacitor bridge for multi-chip packageINTEL CORP·Filed 2022·Application pending·0 cites
- 0851US11527481B2Stacked semiconductor package with flyover bridgeINTEL CORP·Filed 2020·Granted Dec 13, 2022·0 cites·17 claims
- 0949US2023119525A1Package substrate with power delivery networkINTEL CORP·Filed 2021·Application pending·0 cites
- 1048US11562959B2Embedded dual-sided interconnect bridges for integrated-circuit packagesINTEL CORP·Filed 2020·Granted Jan 24, 2023·0 cites·17 claims
- 1138US6686819B2Dual referenced microstripINTEL CORP·Filed 2002·Granted Feb 3, 2004·0 cites·17 claims
- 1234US2017003717A1Memory card connector for electronic devicesINTEL CORP·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →