Inventor · disambiguated record
Edward O. Travis
Also filed as: TRAVIS EDWARD · TRAVIS EDWARD C · TRAVIS EDWARD O · TRAVIS JR EDWARD OUTLAW
59 granted patents·3 pending applications·667 citations·filing 1990–2016
98Inventor score
Files withFREESCALE SEMICONDUCTOR INC23MOTOROLA INC12REBER DOUGLAS M9SHROFF MEHUL D8TRAVIS EDWARD O4
Top patents by PatentIndex Score
62 records- 0192US6611045B2Method of forming an integrated circuit device using dummy features and structure thereofMOTOROLA INC·Filed 2001·Granted Aug 26, 2003·80 cites·16 claims
- 0291US9082824B2Method for forming an electrical connection between metal layersREBER DOUGLAS M·Filed 2013·Granted Jul 14, 2015·13 cites·9 claims
- 0391US8601430B1Device matching tool and methods thereofSHROFF MEHUL D·Filed 2012·Granted Dec 3, 2013·13 cites·20 claims
- 0491US7276435B1Die level metal density gradient for improved flip chip package reliabilityFREESCALE SEMICONDUCTOR INC·Filed 2006·Granted Oct 2, 2007·27 cites·20 claims
- 0589US9455220B2Apparatus and method for placing stressors on interconnects within an integrated circuit device to manage electromigration failuresSHROFF MEHUL D·Filed 2014·Granted Sep 27, 2016·8 cites·9 claims
- 0688US8946000B2Method for forming an integrated circuit having a programmable fuseFREESCALE SEMICONDUCTOR INC·Filed 2013·Granted Feb 3, 2015·8 cites·19 claims
- 0788US6764919B2Method for providing a dummy feature and structure thereofMOTOROLA INC·Filed 2002·Granted Jul 20, 2004·50 cites·11 claims
- 0887US8595667B1Via placement and electronic circuit design processing method and electronic circuit design utilizing sameSHROFF MEHUL D·Filed 2012·Granted Nov 26, 2013·10 cites·6 claims
- 0986US9445050B2Teleconferencing environment having auditory and visual cuesFREESCALE SEMICONDUCTOR INC·Filed 2014·Granted Sep 13, 2016·9 cites·9 claims
- 1086US6396158B1Semiconductor device and a process for designing a maskMOTOROLA INC·Filed 1999·Granted May 28, 2002·81 cites·23 claims
- 1186US5225372AMethod of making a semiconductor device having an improved metallization structureMOTOROLA INC·Filed 1990·Granted Jul 6, 1993·69 cites·3 claims
- 1284US6905967B1Method for improving planarity of shallow trench isolation using multiple simultaneous tiling systemsMOTOROLA INC·Filed 2003·Granted Jun 14, 2005·41 cites·32 claims
- 1384US6593226B2Method for adding features to a design layout and process for designing a maskMOTOROLA INC·Filed 2001·Granted Jul 15, 2003·34 cites·35 claims
- 1483US7247552B2Integrated circuit having structural support for a flip-chip interconnect pad and method thereforFREESCALE SEMICONDUCTOR INC·Filed 2005·Granted Jul 24, 2007·12 cites·20 claims
- 1583US6613688B1Semiconductor device and process for generating an etch patternMOTOROLA INC·Filed 2002·Granted Sep 2, 2003·31 cites·23 claims
- 1681US9515006B23D device packaging using through-substrate postsFREESCALE SEMICONDUCTOR INC·Filed 2014·Granted Dec 6, 2016·5 cites·20 claims
- 1781US6956281B2Semiconductor device for reducing photovolatic currentFREESCALE SEMICONDUCTOR INC·Filed 2002·Granted Oct 18, 2005·27 cites·8 claims
- 1877US8832624B1Multi-layer process-induced damage tracking and remediationSHROFF MEHUL D·Filed 2013·Granted Sep 9, 2014·4 cites·20 claims
- 1977US8694926B2Techniques for checking computer-aided design layers of a device to reduce the occurrence of missing deck rulesREBER DOUGLAS M·Filed 2012·Granted Apr 8, 2014·4 cites·20 claims
- 2076US7322014B2Method of implementing polishing uniformity and modifying layout dataFREESCALE SEMICONDUCTOR INC·Filed 2006·Granted Jan 22, 2008·5 cites·12 claims
- 2174US7470624B2Integrated assist features for epitaxial growth bulk/SOI hybrid tiles with compensationFREESCALE SEMICONDUCTOR INC·Filed 2007·Granted Dec 30, 2008·4 cites·20 claims
- 2273US9443804B2Capping layer interface interruption for stress migration mitigationSHROFF MEHUL D·Filed 2013·Granted Sep 13, 2016·3 cites·17 claims
- 2372US9652577B2Integrated circuit design using pre-marked circuit element object libraryTRAVIS EDWARD O·Filed 2014·Granted May 16, 2017·3 cites·11 claims
- 2472US8707231B2Method and system for derived layer checking for semiconductor device designREBER DOUGLAS M·Filed 2012·Granted Apr 22, 2014·3 cites·18 claims
- 2570US7386821B2Primitive cell method for front end physical designFREESCALE SEMICONDUCTOR INC·Filed 2006·Granted Jun 10, 2008·5 cites·5 claims
- 2669US7510922B2Spacer T-gate structure for CoSi2 extendibilityFREESCALE SEMICONDUCTOR INC·Filed 2006·Granted Mar 31, 2009·4 cites·20 claims
- 2768US8796841B2Semiconductor device with embedded heat spreadingTRAVIS EDWARD O·Filed 2012·Granted Aug 5, 2014·2 cites·17 claims
- 2866US8972922B2Method for forming an electrical connection between metal layersREBER DOUGLAS M·Filed 2013·Granted Mar 3, 2015·1 cites·6 claims
- 2966US8640072B1Method for forming an electrical connection between metal layersREBER DOUGLAS M·Filed 2012·Granted Jan 28, 2014·1 cites·8 claims
- 3066US7146593B2Method of implementing polishing uniformity and modifying layout dataFREESCALE SEMICONDUCTOR INC·Filed 2003·Granted Dec 5, 2006·10 cites·20 claims
- 3165US9508701B23D device packaging using through-substrate pillarsFREESCALE SEMICONDUCTOR INC·Filed 2013·Granted Nov 29, 2016·1 cites·20 claims
- 3264US7635920B2Method and apparatus for indicating directionality in integrated circuit manufacturingFREESCALE SEMICONDUCTOR INC·Filed 2006·Granted Dec 22, 2009·2 cites·20 claims
- 3364US5661082AProcess for forming a semiconductor device having a bond padMOTOROLA INC·Filed 1995·Granted Aug 26, 1997·30 cites·16 claims
- 3463US9508702B23D device packaging using through-substrate postsFREESCALE SEMICONDUCTOR INC·Filed 2014·Granted Nov 29, 2016·1 cites·20 claims
- 3563US9142507B1Stress migration mitigation utilizing induced stress effects in metal trace of integrated circuit deviceFREESCALE SEMICONDUCTOR INC·Filed 2014·Granted Sep 22, 2015·1 cites·20 claims
- 3663US8003539B2Integrated assist features for epitaxial growthFREESCALE SEMICONDUCTOR INC·Filed 2007·Granted Aug 23, 2011·1 cites·22 claims
- 3763US6614062B2Semiconductor tiling structure and method of formationMOTOROLA INC·Filed 2001·Granted Sep 2, 2003·12 cites·20 claims
- 3862US9318409B1Integrated circuit heater for reducing stress in the integrated circuit material and chip leads of the integrated circuit, and for optimizing performance of devices of the integrated circuitREBER DOUGLAS M·Filed 2014·Granted Apr 19, 2016·1 cites·20 claims
- 3962US8856705B2Mismatch verification device and methods thereofSHROFF MEHUL D·Filed 2012·Granted Oct 7, 2014·1 cites·20 claims
- 4061US7622339B2EPI T-gate structure for CoSi2 extendibilityFREESCALE SEMICONDUCTOR INC·Filed 2006·Granted Nov 24, 2009·2 cites·20 claims
- 4161US6489083B1Selective sizing of features to compensate for resist thickness variations in semiconductor devicesMOTOROLA INC·Filed 2000·Granted Dec 3, 2002·8 cites·21 claims
- 4260US8581390B2Semiconductor device with heat dissipationTRAVIS EDWARD O·Filed 2012·Granted Nov 12, 2013·1 cites·20 claims
- 4357US9236344B2Thin beam deposited fuseREBER DOUGLAS M·Filed 2014·Granted Jan 12, 2016·0 cites·20 claims
- 4457US6459156B1Semiconductor device, a process for a semiconductor device, and a process for making a masking databaseMOTOROLA INC·Filed 1999·Granted Oct 1, 2002·21 cites·45 claims
- 4555US9245817B2Semiconductor device with embedded heat spreadingFREESCALE SEMICONDUCTOR INC·Filed 2014·Granted Jan 26, 2016·0 cites·14 claims
- 4655US9122812B2Semiconductor device with vias on a bridge connecting two busesFREESCALE SEMICONDUCTOR INC·Filed 2014·Granted Sep 1, 2015·0 cites·20 claims
- 4754US7858487B2Method and apparatus for indicating directionality in integrated circuit manufacturingFREESCALE SEMICONDUCTOR INC·Filed 2009·Granted Dec 28, 2010·0 cites·8 claims
- 4852US10014257B2Apparatus and method for placing stressors within an integrated circuit device to manage electromigration failuresFREESCALE SEMICONDUCTOR INC·Filed 2016·Granted Jul 3, 2018·0 cites·19 claims
- 4950US8736071B2Semiconductor device with vias on a bridge connecting two busesREBER DOUGLAS M·Filed 2011·Granted May 27, 2014·0 cites·12 claims
- 5050US5814893ASemiconductor device having a bond padMOTOROLA INC·Filed 1997·Granted Sep 29, 1998·16 cites·15 claims
Showing the top 50 of 62 patent records by PatentIndex Score.
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