Assignee
REBER DOUGLAS M
US·16 granted patents·1 pending application·26 citations·filing 2011–2014
Top patents by PatentIndex Score
17 records- 0191US9082824B2Method for forming an electrical connection between metal layersREBER DOUGLAS M·Filed 2013·Granted Jul 14, 2015·13 cites·9 claims
- 0277US8694926B2Techniques for checking computer-aided design layers of a device to reduce the occurrence of missing deck rulesREBER DOUGLAS M·Filed 2012·Granted Apr 8, 2014·4 cites·20 claims
- 0372US8707231B2Method and system for derived layer checking for semiconductor device designREBER DOUGLAS M·Filed 2012·Granted Apr 22, 2014·3 cites·18 claims
- 0466US9601354B2Semiconductor manufacturing for forming bond pads and seal ringsREBER DOUGLAS M·Filed 2014·Granted Mar 21, 2017·2 cites·12 claims
- 0566US8972922B2Method for forming an electrical connection between metal layersREBER DOUGLAS M·Filed 2013·Granted Mar 3, 2015·1 cites·6 claims
- 0666US8640072B1Method for forming an electrical connection between metal layersREBER DOUGLAS M·Filed 2012·Granted Jan 28, 2014·1 cites·8 claims
- 0762US9318409B1Integrated circuit heater for reducing stress in the integrated circuit material and chip leads of the integrated circuit, and for optimizing performance of devices of the integrated circuitREBER DOUGLAS M·Filed 2014·Granted Apr 19, 2016·1 cites·20 claims
- 0861US10553508B2Semiconductor manufacturing using disposable test circuitry within scribe lanesREBER DOUGLAS M·Filed 2014·Granted Feb 4, 2020·1 cites·5 claims
- 0957US9236344B2Thin beam deposited fuseREBER DOUGLAS M·Filed 2014·Granted Jan 12, 2016·0 cites·20 claims
- 1050US8883639B2Semiconductor device having a nanotube layer and method for formingREBER DOUGLAS M·Filed 2012·Granted Nov 11, 2014·0 cites·12 claims
- 1150US8736071B2Semiconductor device with vias on a bridge connecting two busesREBER DOUGLAS M·Filed 2011·Granted May 27, 2014·0 cites·12 claims
- 1247US9122829B2Stress migration mitigationREBER DOUGLAS M·Filed 2013·Granted Sep 1, 2015·0 cites·20 claims
- 1346US8703507B1Method and apparatus to improve reliability of viasREBER DOUGLAS M·Filed 2012·Granted Apr 22, 2014·0 cites·13 claims
- 1446US8486839B2Methods and apparatus to improve reliability of isolated viasREBER DOUGLAS M·Filed 2011·Granted Jul 16, 2013·0 cites·15 claims
- 1545US8987916B2Methods and apparatus to improve reliability of isolated viasREBER DOUGLAS M·Filed 2011·Granted Mar 24, 2015·0 cites·16 claims
- 1643US9041209B2Method and apparatus to improve reliability of viasREBER DOUGLAS M·Filed 2011·Granted May 26, 2015·0 cites·14 claims
- 1738US2012178189A1Method for forming an over pad metalization (opm) on a bond padREBER DOUGLAS M·Filed 2011·Application pending·0 cites
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →