Inventor · disambiguated record
Kenichi Kawai
Also filed as: KAWAI KENICHI
13 granted patents·9 pending applications·195 citations·filing 1988–2021
92Inventor score
Top patents by PatentIndex Score
22 records- 0197US8490732B2Electric wheeled apparatus powered by battery packsSUGIMOTO MANABU·Filed 2011·Granted Jul 23, 2013·54 cites·6 claims
- 0291US7252156B2Vibration isolation handleMAKITA CORP·Filed 2006·Granted Aug 7, 2007·40 cites·14 claims
- 0390US11658106B2Electronic device, electronic apparatus, and method for supporting design of electronic deviceFUJITSU LTD·Filed 2021·Granted May 23, 2023·2 cites·10 claims
- 0481US6447383B2Sanding apparatus with an improved vibration insulating mechanismMAKITA CORP·Filed 2000·Granted Sep 10, 2002·24 cites·7 claims
- 0580US9699887B2Circuit board and electronic deviceFUJITSU LTD·Filed 2014·Granted Jul 4, 2017·6 cites·16 claims
- 0676US9559401B2Printed board and wiring arrangement methodFUJITSU LTD·Filed 2014·Granted Jan 31, 2017·3 cites·7 claims
- 0774USD323834SPlanerMAKITA ELECTRIC WORKS LTD·Filed 1988·Granted Feb 11, 1992·14 cites·1 claims
- 0871US6778356B2Thin film magnetic head and method of manufacturing the sameFUJITSU LTD·Filed 2002·Granted Aug 17, 2004·8 cites·3 claims
- 0962US6499007B1Parameter editing method and semiconductor exposure systemCANON KK·Filed 1999·Granted Dec 24, 2002·22 cites·20 claims
- 1052US2009161267A1Ferromagnetic tunnel junction device, magnetic head, and magnetic storage deviceFUJITSU LTD·Filed 2008·Application pending·0 cites
- 1150US8052214B2Seat structureDELTA TOOLING CO LTD·Filed 2006·Granted Nov 8, 2011·2 cites·11 claims
- 1249US2010167176A1Manufacturing apparatus and method for fuel cell electrode material assembly, and fuel cellKAWAI KENICHI·Filed 2008·Application pending·0 cites
- 1347US5804495AMethod of making SOI structureMITSUBISHI MATERIALS CORP·Filed 1995·Granted Sep 8, 1998·15 cites·5 claims
- 1446US2008174322A1Thin film resistance measurement method and tunnel magnetoresistive element fabrication methodFUJITSU LTD·Filed 2007·Application pending·0 cites
- 1543US2014197899A1Printed circuit board and manufacturing method of printed circuit boardFUJITSU LTD·Filed 2013·Application pending·0 cites
- 1641US10057977B2Wiring board and electronic deviceFUJITSU LTD·Filed 2017·Granted Aug 21, 2018·0 cites·20 claims
- 1741US2013214397A1Multilayer wiring board and electronic deviceFUJITSU LTD·Filed 2012·Application pending·0 cites
- 1841US2009128167A1Method for measuring area resistance of magneto-resistance effect elementFUJITSU LTD·Filed 2008·Application pending·0 cites
- 1941US2013215588A1Multilayered wiring substrate and electronic apparatusFUJITSU LTD·Filed 2013·Application pending·0 cites
- 2041US2013215587A1Multilayer wiring board and electronic deviceFUJITSU LTD·Filed 2012·Application pending·0 cites
- 2137US4869871APb-Sn-Sb-In solder alloyTOYOTA MOTOR CORP·Filed 1989·Granted Sep 26, 1989·5 cites·7 claims
- 2236US2005231854A1Magnetoresistance effect film and method of manufacturing the sameFUJITSU LTD·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →