Inventor · disambiguated record

Walter De Munnik

Also filed as: DE MUNNIK WALTER

2 granted patents·22 citations·filing 2004–2012

55Inventor score

Technology areasH10W

Files withLIN GERALDINE TSUI YEE2

Top patents by PatentIndex Score

2 records

0174US8330270B1Integrated circuit package having a plurality of spaced apart pad portionsLIN GERALDINE TSUI YEE·Filed 2004·Granted Dec 11, 2012·22 cites·15 claims
0247US9520306B2Method of fabricating an integrated circuit (IC) package having a plurality of spaced apart pad portionLIN GERALDINE TSUI YEE·Filed 2012·Granted Dec 13, 2016·0 cites·12 claims

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →