Inventor · disambiguated record
Daniela Morin
Also filed as: MORIN DANIELA
1 granted patent·1 pending application·1 citations·filing 2002–2007
17Inventor score
Technology areasH10W
Files withST MICROELECTRONICS SRL2
Top patents by PatentIndex Score
2 records- 0154US7595223B2Process for bonding and electrically connecting microsystems integrated in several distinct substratesST MICROELECTRONICS SRL·Filed 2007·Granted Sep 29, 2009·1 cites·24 claims
- 0234US2003109183A1Process for bonding and electrically connecting microsystems integrated in several distinct substratesST MICROELECTRONICS SRL·Filed 2002·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →