Inventor · disambiguated record
Bernardo Donoso
Also filed as: DONOSO BERNARDO
8 granted patents·8 pending applications·217 citations·filing 2000–2017
88Inventor score
Top patents by PatentIndex Score
16 records- 0193US6517130B1Self positioning vacuum chuckAPPLIED MATERIALS INC·Filed 2000·Granted Feb 11, 2003·84 cites·10 claims
- 0287US7223323B2Multi-chemistry plating systemAPPLIED MATERIALS INC·Filed 2003·Granted May 29, 2007·44 cites·1 claims
- 0385US6736408B2Rotary vacuum-chuck with venturi formed at base of rotating shaftAPPLIED MATERIALS INC·Filed 2002·Granted May 18, 2004·33 cites·38 claims
- 0480US7837851B2In-situ profile measurement in an electroplating processAPPLIED MATERIALS INC·Filed 2005·Granted Nov 23, 2010·6 cites·31 claims
- 0578US6612014B1Dual post centrifugal wafer clip for spin rinse dry unitAPPLIED MATERIALS INC·Filed 2000·Granted Sep 2, 2003·22 cites·12 claims
- 0675US7319920B2Method and apparatus for self-calibration of a substrate handling robotAPPLIED MATERIALS INC·Filed 2003·Granted Jan 15, 2008·22 cites·27 claims
- 0758US6691719B2Adjustable nozzle for wafer bevel cleaningAPPLIED MATERIALS INC·Filed 2001·Granted Feb 17, 2004·6 cites·20 claims
- 0849US10364497B2Vapor based site-isolated processing systems and methodsINTERMOLECULAR INC·Filed 2017·Granted Jul 30, 2019·0 cites·11 claims
- 0945US2011031112A1In-situ profile measurement in an electroplating processBIRANG MANOOCHER·Filed 2010·Application pending·0 cites
- 1042US2016111302A1Systems and Methods for Wet Processing Substrates with Rotating Splash ShieldINTERMOLECULAR INC·Filed 2014·Application pending·0 cites
- 1140US2009182454A1Method and apparatus for self-calibration of a substrate handling robotDONOSO BERNARDO·Filed 2008·Application pending·0 cites
- 1236US2003034617A1Wafer chuck with plungerAPPLIED MATERIALS INC·Filed 2002·Application pending·0 cites
- 1335US2004206373A1Spin rinse dry cellAPPLIED MATERIALS INC·Filed 2003·Application pending·0 cites
- 1435US2003036273A1Shield for capturing fluid displaced from a substrateAPPLIED MATERIALS INC·Filed 2002·Application pending·0 cites
- 1535US2003051364A1Method and apparatus for positioning a wafer chuckFiled 2002·Application pending·0 cites
- 1635US2003213772A9Integrated semiconductor substrate bevel cleaning apparatus and methodFiled 2001·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →