Inventor · disambiguated record
John Michael Parsey, Jr.
Also filed as: PARSEY JOHN M · PARSEY JR JOHN M · PARSEY JR JOHN MICHAEL
29 granted patents·2 pending applications·1,005 citations·filing 1996–2017
97Inventor score
Files withSEMICONDUCTOR COMPONENTS IND16MOTOROLA INC5SEMICONDUCTOR COMPONENTS IND LLC5GRIVNA GORDON M3MARREIRO DAVID D1
Top patents by PatentIndex Score
31 records- 0199US6307169B1Micro-electromechanical switchMOTOROLA INC·Filed 2000·Granted Oct 23, 2001·237 cites·18 claims
- 0298US6384353B1Micro-electromechanical system deviceMOTOROLA INC·Filed 2000·Granted May 7, 2002·358 cites·20 claims
- 0396US7579632B2Multi-channel ESD device and method thereforSEMICONDUCTOR COMPONENTS IND·Filed 2007·Granted Aug 25, 2009·62 cites·20 claims
- 0496US7482220B2Semiconductor device having deep trench charge compensation regions and methodSEMICONDUCTOR COMPONENTS IND·Filed 2006·Granted Jan 27, 2009·37 cites·11 claims
- 0595US6441449B1MEMS variable capacitor with stabilized electrostatic drive and method thereforMOTOROLA INC·Filed 2001·Granted Aug 27, 2002·82 cites·18 claims
- 0693US8859396B2Semiconductor die singulation methodGRIVNA GORDON M·Filed 2011·Granted Oct 14, 2014·12 cites·15 claims
- 0793US8492260B2Processes of forming an electronic device including a feature in a trenchPARSEY JR JOHN MICHAEL·Filed 2010·Granted Jul 23, 2013·26 cites·21 claims
- 0893US7538395B2Method of forming low capacitance ESD device and structure thereforSEMICONDUCTOR COMPONENTS IND·Filed 2007·Granted May 26, 2009·31 cites·7 claims
- 0990US9117802B2Electronic device including a feature in an openingSEMICONDUCTOR COMPONENTS IND·Filed 2013·Granted Aug 25, 2015·9 cites·19 claims
- 1090US8106436B2Semiconductor trench structure having a sealing plugGRIVNA GORDON M·Filed 2011·Granted Jan 31, 2012·10 cites·20 claims
- 1190US7902601B2Semiconductor device having deep trench charge compensation regions and methodSEMICONDUCTOR COMPONENTS IND·Filed 2008·Granted Mar 8, 2011·13 cites·19 claims
- 1289US9502550B2High electron mobility semiconductor device and method thereforSEMICONDUCTOR COMPONENTS IND LLC·Filed 2015·Granted Nov 22, 2016·5 cites·20 claims
- 1389US7842969B2Low clamp voltage ESD device and method thereforSEMICONDUCTOR COMPONENTS IND·Filed 2008·Granted Nov 30, 2010·16 cites·11 claims
- 1486US10068791B2Wafer susceptor for forming a semiconductor device and method thereforSEMICONDUCTOR COMPONENTS IND LLC·Filed 2013·Granted Sep 4, 2018·8 cites·16 claims
- 1586US6362018B1Method for fabricating MEMS variable capacitor with stabilized electrostatic driveMOTOROLA INC·Filed 2000·Granted Mar 26, 2002·28 cites·6 claims
- 1685US9129889B2High electron mobility semiconductor device and method thereforSEMICONDUCTOR COMPONENTS IND·Filed 2014·Granted Sep 8, 2015·6 cites·20 claims
- 1783US7902075B2Semiconductor trench structure having a sealing plug and methodSEMICONDUCTOR COMPONENTS IND·Filed 2008·Granted Mar 8, 2011·9 cites·7 claims
- 1882US7799640B2Method of forming a semiconductor device having trench charge compensation regionsSEMICONDUCTOR COMPONENTS IND·Filed 2006·Granted Sep 21, 2010·9 cites·21 claims
- 1980US8039359B2Method of forming low capacitance ESD device and structure thereforSEMICONDUCTOR COMPONENTS IND·Filed 2009·Granted Oct 18, 2011·8 cites·12 claims
- 2075USRE45365ESemiconductor device having a vertically-oriented conductive region that electrically connects a transistor structure to a substrateSEMICONDUCTOR COMPONENTS IND·Filed 2013·Granted Feb 10, 2015·2 cites·39 claims
- 2173US10340160B2Method of forming a semiconductor die cutting toolSEMICONDUCTOR COMPONENTS IND LLC·Filed 2015·Granted Jul 2, 2019·1 cites·5 claims
- 2270US9355965B2Semiconductor devices and methods of making the sameSEMICONDUCTOR COMPONENTS IND·Filed 2015·Granted May 31, 2016·2 cites·20 claims
- 2363US6140703ASemiconductor metallization structureMOTOROLA INC·Filed 1996·Granted Oct 31, 2000·33 cites·27 claims
- 2459US9099481B2Methods of laser marking semiconductor substratesSEMICONDUCTOR COMPONENTS IND·Filed 2014·Granted Aug 4, 2015·1 cites·20 claims
- 2555USRE44547ESemiconductor device having deep trench charge compensation regions and methodSEMICONDUCTOR COMPONENTS IND·Filed 2012·Granted Oct 22, 2013·0 cites·40 claims
- 2654US9012304B2Semiconductor die singulation methodGRIVNA GORDON M·Filed 2012·Granted Apr 21, 2015·0 cites·18 claims
- 2752US10505000B2Electronic device including a transistor structure having different semiconductor base materialsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2017·Granted Dec 10, 2019·0 cites·20 claims
- 2846US9515179B2Electronic devices including a III-V transistor having a homostructure and a process of forming the sameSEMICONDUCTOR COMPONENTS IND LLC·Filed 2015·Granted Dec 6, 2016·0 cites·19 claims
- 2946US8309422B2Low clamp voltage ESD methodMARREIRO DAVID D·Filed 2010·Granted Nov 13, 2012·0 cites·9 claims
- 3045US2014264456A1Method of forming a high electron mobility semiconductor deviceSEMICONDUCTOR COMPONENTS IND·Filed 2014·Application pending·0 cites
- 3144US2014264449A1Method of forming hemt semiconductor devices and structure thereforSEMICONDUCTOR COMPONENTS IND·Filed 2014·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →