Inventor · disambiguated record
Bruce J. Freyman
Also filed as: FREYMAN BRUCE J · FREYMAN BRUCE JOSEPH
18 granted patents·1 pending application·2,544 citations·filing 1986–2021
97Inventor score
Top patents by PatentIndex Score
19 records- 0197US5438224AIntegrated circuit package having a face-to-face IC chip arrangementMOTOROLA INC·Filed 1993·Granted Aug 1, 1995·364 cites·3 claims
- 0297US5241133ALeadless pad array chip carrierMOTOROLA INC·Filed 1992·Granted Aug 31, 1993·298 cites·11 claims
- 0395US6329606B1Grid array assembly of circuit boards with singulation groovesAMKOR TECHNOLOGY INC·Filed 1998·Granted Dec 11, 2001·269 cites·11 claims
- 0495US5859475ACarrier strip and molded flex circuit ball grid arrayAMKOR TECHNOLOGY INC·Filed 1996·Granted Jan 12, 1999·166 cites·4 claims
- 0595US5166772ATransfer molded semiconductor device package with integral shieldMOTOROLA INC·Filed 1991·Granted Nov 24, 1992·281 cites·10 claims
- 0694US5985695AMethod of making a molded flex circuit ball grid arrayAMKOR TECHNOLOGY INC·Filed 1998·Granted Nov 16, 1999·134 cites·26 claims
- 0794US5006673AFabrication of pad array carriers from a universal interconnect structureMOTOROLA INC·Filed 1989·Granted Apr 9, 1991·130 cites·20 claims
- 0894US4700473AMethod of making an ultra high density pad array chip carrierMOTOROLA INC·Filed 1986·Granted Oct 20, 1987·140 cites·7 claims
- 0992US6124637ACarrier strip and molded flex circuit ball grid array and method of makingAMKOR TECHNOLOGY INC·Filed 1998·Granted Sep 26, 2000·107 cites·23 claims
- 1091US5218759AMethod of making a transfer molded semiconductor deviceMOTOROLA INC·Filed 1991·Granted Jun 15, 1993·140 cites·19 claims
- 1191US4700276AUltra high density pad array chip carrierMOTOROLA INC·Filed 1986·Granted Oct 13, 1987·104 cites·8 claims
- 1289US5635671AMold runner removal from a substrate-based packaged electronic deviceAMKOR TECHNOLOGY INC·Filed 1994·Granted Jun 3, 1997·109 cites·17 claims
- 1386US11201066B2Control of under-fill using a dam on a packaging substrate for a dual-sided ball grid array packageSKYWORKS SOLUTIONS INC·Filed 2018·Granted Dec 14, 2021·2 cites·6 claims
- 1484US5136366AOvermolded semiconductor package with anchoring meansMOTOROLA INC·Filed 1990·Granted Aug 4, 1992·124 cites·15 claims
- 1579US5296738AMoisture relief for chip carrierMOTOROLA INC·Filed 1992·Granted Mar 22, 1994·61 cites·12 claims
- 1678US2022130686A1Control of under-fill using an encapsulant and a trench or dam for a dual-sided ball grid array packageSKYWORKS SOLUTIONS INC·Filed 2021·Application pending·0 cites
- 1777US5852870AMethod of making grid array assemblyAMKOR TECHNOLOGY INC·Filed 1996·Granted Dec 29, 1998·51 cites·12 claims
- 1875US5077633AGrounding an ultra high density pad array chip carrierMOTOROLA INC·Filed 1989·Granted Dec 31, 1991·42 cites·11 claims
- 1954US5134462AFlexible film chip carrier having a flexible film substrate and means for maintaining planarity of the substrateMOTOROLA INC·Filed 1991·Granted Jul 28, 1992·22 cites·24 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →