Inventor · disambiguated record
Motohiko Yoshigai
Also filed as: YOSHIGAI MOTOHIKO
42 granted patents·23 pending applications·578 citations·filing 1992–2011
98Inventor score
Top patents by PatentIndex Score
65 records- 0194US6815228B2Film thickness measuring method of member to be processed using emission spectroscopy and processing method of the member using the measuring methodHITACHI LTD·Filed 2001·Granted Nov 9, 2004·60 cites·7 claims
- 0291US6664738B2Plasma processing apparatusHITACHI LTD·Filed 2002·Granted Dec 16, 2003·52 cites·16 claims
- 0391US5432315APlasma process apparatus including ground electrode with protection filmHITACHI LTD·Filed 1994·Granted Jul 11, 1995·68 cites·17 claims
- 0489US7396771B2Plasma etching apparatus and plasma etching methodHITACHI HIGH TECH CORP·Filed 2006·Granted Jul 8, 2008·15 cites·4 claims
- 0588US6903826B2Method and apparatus for determining endpoint of semiconductor element fabricating processHITACHI LTD·Filed 2001·Granted Jun 7, 2005·33 cites·20 claims
- 0686US7259866B2Semiconductor fabricating apparatus with function of determining etching processing stateHITACHI HIGH TECH CORP·Filed 2005·Granted Aug 21, 2007·9 cites·4 claims
- 0786US7224568B2Plasma processing method and plasma processing apparatusHITACHI HIGH TECH CORP·Filed 2005·Granted May 29, 2007·12 cites·12 claims
- 0886US6961131B2Film thickness measuring method of member to be processed using emission spectroscopy and processing method of the member using the measuring methodHITACHI LTD·Filed 2004·Granted Nov 1, 2005·24 cites·6 claims
- 0985US7931776B2Plasma processing apparatusHITACHI HIGH TECH CORP·Filed 2006·Granted Apr 26, 2011·8 cites·7 claims
- 1081US7411684B2Film thickness measuring method of member to be processed using emission spectroscopy and processing method of the member using the measuring methodHITACHI LTD·Filed 2007·Granted Aug 12, 2008·5 cites·13 claims
- 1180US7126697B2Method and apparatus for determining endpoint of semiconductor element fabricating processHITACHI LTD·Filed 2006·Granted Oct 24, 2006·5 cites·8 claims
- 1280US6677244B2Specimen surface processing methodHITACHI LTD·Filed 2002·Granted Jan 13, 2004·18 cites·4 claims
- 1375US7230720B2Film thickness measuring method of member to be processed using emission spectroscopy and processing method of the member using the measuring methodHITACHI LTD·Filed 2005·Granted Jun 12, 2007·3 cites·14 claims
- 1474US7601241B2Plasma processing apparatus and plasma processing methodHITACHI LTD·Filed 2004·Granted Oct 13, 2009·9 cites·11 claims
- 1574US7194821B2Vacuum processing apparatus and vacuum processing methodHITACHI HIGH TECH CORP·Filed 2005·Granted Mar 27, 2007·12 cites·11 claims
- 1674US5681424APlasma processing methodHITACHI LTD·Filed 1994·Granted Oct 28, 1997·54 cites·21 claims
- 1773US8282767B2Plasma processing apparatusITABASHI NAOSHI·Filed 2011·Granted Oct 9, 2012·3 cites·2 claims
- 1872US9039865B2Plasma processing apparatusYOSHIOKA KEN·Filed 2010·Granted May 26, 2015·3 cites·7 claims
- 1971US5290993AMicrowave plasma processing deviceHITACHI LTD·Filed 1992·Granted Mar 1, 1994·42 cites·27 claims
- 2070US6620737B2Plasma etching methodHITACHI LTD·Filed 2001·Granted Sep 16, 2003·13 cites·9 claims
- 2169US6972848B2Semiconductor fabricating apparatus with function of determining etching processing stateHITACH HIGH TECHNOLOGIES CORP·Filed 2003·Granted Dec 6, 2005·11 cites·5 claims
- 2269US6838833B2Plasma processing apparatusHITACHI LTD·Filed 2003·Granted Jan 4, 2005·10 cites·6 claims
- 2367US6660647B1Method for processing surface of sampleHITACHI LTD·Filed 1999·Granted Dec 9, 2003·28 cites·14 claims
- 2465US7771607B2Plasma processing apparatus and plasma processing methodHITACHI LTD·Filed 2007·Granted Aug 10, 2010·1 cites·1 claims
- 2565US7009715B2Method and apparatus for determining endpoint of semiconductor element fabricating process and method and apparatus for processing member to be processedHITACHI LTD·Filed 2004·Granted Mar 7, 2006·7 cites·21 claims
- 2664US6617255B2Plasma processing method for working the surface of semiconductor devicesHITACHI LTD·Filed 2001·Granted Sep 9, 2003·7 cites·3 claims
- 2760US7442651B2Plasma etching methodHITACHI HIGH TECH CORP·Filed 2006·Granted Oct 28, 2008·2 cites·8 claims
- 2858US6235146B1Vacuum treatment system and its stageHITACHI LTD·Filed 1999·Granted May 22, 2001·22 cites·14 claims
- 2956US6916396B2Etching system and etching methodHITACHI HIGH TECH CORP·Filed 2002·Granted Jul 12, 2005·4 cites·12 claims
- 3056US6743733B2Process for producing a semiconductor device including etching using a multi-step etching treatment having different gas compositions in each stepHITACHI LTD·Filed 2001·Granted Jun 1, 2004·4 cites·20 claims
- 3154US8071397B2Semiconductor fabricating apparatus with function of determining etching processing stateUSUI TATEHITO·Filed 2007·Granted Dec 6, 2011·0 cites·7 claims
- 3254US2008121344A1Plasma processing apparatusARAMAKI TOORU·Filed 2008·Application pending·0 cites
- 3353US2008053958A1Plasma processing apparatusKADOTANI MASANORI·Filed 2007·Application pending·0 cites
- 3452US6897403B2Plasma processing method and plasma processing apparatusHITACHI HIGH TECH CORP·Filed 2003·Granted May 24, 2005·3 cites·3 claims
- 3552US6046425APlasma processing apparatus having insulator disposed on inner surface of plasma generating chamberHITACHI LTD·Filed 1995·Granted Apr 4, 2000·10 cites·21 claims
- 3652US2008257863A1Plasma processing apparatus and method for stabilizing inner wall of processing chamberKITSUNAI HIROYUKI·Filed 2007·Application pending·0 cites
- 3751US7303998B2Plasma processing methodHITACHI HIGH TECH CORP·Filed 2004·Granted Dec 4, 2007·2 cites·10 claims
- 3850US7259104B2Sample surface processing methodHITACHI LTD·Filed 2003·Granted Aug 21, 2007·2 cites·7 claims
- 3950US7098138B2Plasma processing method for working the surface of semiconductor devicesHITACHI LTD·Filed 2003·Granted Aug 29, 2006·2 cites·2 claims
- 4050US2006073619A1Semiconductor fabricating apparatus and method and apparatus for determining state of semiconductor fabricating processUSUI TATEHITO·Filed 2005·Application pending·0 cites
- 4150US2005202575A1Semiconductor fabricating apparatus and method and apparatus for determining state of semiconductor fabricating processFiled 2005·Application pending·0 cites
- 4250US2007178610A1Semiconductor Production ApparatusUSUI TATEHITO·Filed 2007·Application pending·0 cites
- 4349US8707899B2Plasma processing apparatusKITANI RYOUTA·Filed 2009·Granted Apr 29, 2014·1 cites·8 claims
- 4449US2010282414A1Plasma processing apparatusHITACHI HIGH TECH CORP·Filed 2010·Application pending·0 cites
- 4549US2006048892A1Plasma processing method for working the surface of semiconductor devicesARASE TAKAO·Filed 2005·Application pending·0 cites
- 4648US2006043064A1Plasma processing system and methodTANAKA JUNICHI·Filed 2004·Application pending·0 cites
- 4747US7955514B2Plasma processing apparatus and plasma processing methodHITACHI HIGH TECH CORP·Filed 2007·Granted Jun 7, 2011·0 cites·8 claims
- 4847US6837937B2Plasma processing apparatusHITACHI HIGH TECH CORP·Filed 2002·Granted Jan 4, 2005·0 cites·10 claims
- 4946US2005189320A1Plasma processing methodFiled 2005·Application pending·0 cites
- 5046US2005087297A1Plasma processing apparatus and method for stabilizing inner wall of processing chamberFiled 2004·Application pending·0 cites
Showing the top 50 of 65 patent records by PatentIndex Score.
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