Inventor · disambiguated record
Thomas Wagner
Also filed as: WAGNER THOMAS · WAGNER THOMAS G
1 granted patent·8 pending applications·55 citations·filing 2001–2023
49Inventor score
Top patents by PatentIndex Score
9 records- 0187US6657134B2Stacked ball grid arrayHONEYWELL INT INC·Filed 2001·Granted Dec 2, 2003·55 cites·24 claims
- 0255US2025112202A1Thermal interface material on a surface of a die in a cavityINTEL CORP·Filed 2023·Application pending·0 cites
- 0355US2025112139A1Vias through a die that are electrically isolated from active circuitry in the dieINTEL CORP·Filed 2023·Application pending·0 cites
- 0455US2025112191A1Direct die-two-die connection through an interposer without viasINTEL CORP·Filed 2023·Application pending·0 cites
- 0555US2025201605A1Assembly and method for preventing warpage in a semiconductor packageINTEL CORP·Filed 2023·Application pending·0 cites
- 0655US2025201622A1Support structures for semiconductor substratesINTEL CORP·Filed 2023·Application pending·0 cites
- 0752US2023317536A1Grooved packageINTEL CORP·Filed 2022·Application pending·0 cites
- 0848US2023317681A1Three-dimensional stack cooling wingsINTEL CORP·Filed 2022·Application pending·0 cites
- 0948US2023317551A1Heterogeneous packages having thermal towersINTEL CORP·Filed 2022·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →