Inventor · disambiguated record
Lei Shi
Also filed as: SHI LEI · SHI LEI SHIRLEY
312 granted patents·188 pending applications·856 citations·filing 1995–2025
99Inventor score
Files withHUAWEI DIGITAL POWER TECH CO LTD50SHI LEI30CALICO LIFE SCIENCES LLC26HUAWEI TECH CO LTD22TONGFU MICROELECTRONICS CO LTD21
Top patents by PatentIndex Score
500 records- 0198US11782062B2Kits for analysis using nucleic acid encoding and/or labelENCODIA INC·Filed 2023·Granted Oct 10, 2023·9 cites·24 claims
- 0297US11716032B2Multi-level inverter clamping modulation method and apparatus, and inverterHUAWEI DIGITAL POWER TECH CO LTD·Filed 2022·Granted Aug 1, 2023·4 cites·18 claims
- 0397US11513126B2Kits for analysis using nucleic acid encoding and/or labelENCODIA INC·Filed 2018·Granted Nov 29, 2022·15 cites·23 claims
- 0497US10903758B2Hybrid multilevel inverters with reduced voltage stressHUAWEI TECH CO LTD·Filed 2019·Granted Jan 26, 2021·15 cites·20 claims
- 0596US12130291B2Kits for analysis using nucleic acid encoding and/or labelENCODIA INC·Filed 2022·Granted Oct 29, 2024·2 cites·17 claims
- 0695US11427814B2Modified cleavases, uses thereof and related kitsENCODIA INC·Filed 2021·Granted Aug 30, 2022·8 cites·27 claims
- 0795US10177683B2Multi-level inverterHUAWEI TECH CO LTD·Filed 2018·Granted Jan 8, 2019·15 cites·16 claims
- 0895US8513784B2Multi-layer lead frame package and method of fabricationLU JUN·Filed 2010·Granted Aug 20, 2013·24 cites·17 claims
- 0994US12129463B2Methods and kits using nucleic acid encoding and/or labelENCODIA INC·Filed 2023·Granted Oct 29, 2024·1 cites·15 claims
- 1094US8354740B2Top-side cooled semiconductor package with stacked interconnection plates and methodALPHA & OMEGA SEMICONDUCTOR·Filed 2008·Granted Jan 15, 2013·27 cites·15 claims
- 1194US8154108B2Dual-leadframe multi-chip package and method of manufactureLIU KAI·Filed 2010·Granted Apr 10, 2012·15 cites·5 claims
- 1294US7622796B2Semiconductor package having a bridged plate interconnectionALPHA & OMEGA SEMICONDUCTOR·Filed 2007·Granted Nov 24, 2009·31 cites·23 claims
- 1393US8314119B2Azaadamantane derivatives and methods of useSCHRIMPF MICHAEL R·Filed 2007·Granted Nov 20, 2012·22 cites·20 claims
- 1492US11641201B2Hybrid power devicesHUAWEI DIGITAL POWER TECH CO LTD·Filed 2021·Granted May 2, 2023·2 cites·16 claims
- 1592US11149043B2Prodrug modulators of the integrated stress pathwayCALICO LIFE SCIENCES LLC·Filed 2021·Granted Oct 19, 2021·2 cites·2 claims
- 1692US10023874B2Herbicide tolerance genes and methods of use thereofMONSANTO TECHNOLOGY LLC·Filed 2015·Granted Jul 17, 2018·6 cites·98 claims
- 1792US8913215B2Bistable switchable liquid crystal windowYANG DENG-KE·Filed 2009·Granted Dec 16, 2014·29 cites·41 claims
- 1892US8778735B1Packaging method of molded wafer level chip scale package (WLCSP)XUE YAN XUN·Filed 2013·Granted Jul 15, 2014·14 cites·10 claims
- 1992US7683464B2Semiconductor package having dimpled plate interconnectionsALPHA & OMEGA SEMICONDUCTOR·Filed 2007·Granted Mar 23, 2010·25 cites·12 claims
- 2091US12292446B2Kits for analysis using nucleic acid encoding and/or labelENCODIA INC·Filed 2024·Granted May 6, 2025·0 cites·20 claims
- 2191US9544671B2Speaker-boxSHI LEI·Filed 2013·Granted Jan 10, 2017·20 cites·8 claims
- 2291US8648084B2Selective substituted pyrazine ligands for neuronal nicotinic receptorsBUNNELLE WILLIAM H·Filed 2012·Granted Feb 11, 2014·18 cites·9 claims
- 2391US8436429B2Stacked power semiconductor device using dual lead frame and manufacturing methodXUE YAN XUN·Filed 2011·Granted May 7, 2013·13 cites·10 claims
- 2490US12166045B2Display substrate and display apparatusBEIJING BOE OPTOELECTRONICS TECH CO LTD·Filed 2021·Granted Dec 10, 2024·2 cites·16 claims
- 2590US12107541B2Optimizer, photovoltaic power generation system, and IV curve scanning method for photovoltaic moduleHUAWEI DIGITAL POWER TECH CO LTD·Filed 2021·Granted Oct 1, 2024·2 cites·18 claims
- 2690US11804341B2Keycap and manufacturing method thereof and keyswitchLITE ON TECH CHANG ZHOU CO LTD·Filed 2020·Granted Oct 31, 2023·3 cites·19 claims
- 2790US11705815B1Holdup time extension for LLC circuitAES GLOBAL HOLDINGS PTE LTD·Filed 2022·Granted Jul 18, 2023·6 cites·20 claims
- 2890US11452710B1Micronutrient and plant extract composition and method of improving bone healthRATH MATTHIAS W·Filed 2022·Granted Sep 27, 2022·1 cites·11 claims
- 2990US11356034B2Multi-level inverter clamping modulation method and apparatus, and inverterHUAWEI DIGITAL POWER TECH CO LTD·Filed 2020·Granted Jun 7, 2022·2 cites·14 claims
- 3090US9899157B1Key device and multi-legged supporting balance bar structure thereofLITE ON ELECTRONICS GUANGZHOU·Filed 2016·Granted Feb 20, 2018·5 cites·12 claims
- 3190US9787217B2Power conversion circuit and power conversion systemHUAWEI TECH CO LTD·Filed 2014·Granted Oct 10, 2017·12 cites·13 claims
- 3290US8564110B2Power device with bottom source electrodeXUE YAN XUN·Filed 2012·Granted Oct 22, 2013·12 cites·16 claims
- 3390US2025060371A1Kits for analysis using nucleic acid encoding and/or labelENCODIA INC·Filed 2024·Application pending·0 cites
- 3489US12377055B2Dissolvable gel-forming film for delivery of active agentsSMITH & NEPHEW INC·Filed 2024·Granted Aug 5, 2025·0 cites·20 claims
- 3589US11957698B2Synergistic combination of thermolysin and an antibacterial agent to reduce or eliminate bacterial biofilms from surfacesSMITH & NEPHEW INC·Filed 2022·Granted Apr 16, 2024·1 cites·14 claims
- 3689US10951131B2Converter and method for driving converterHUAWEI TECH CO LTD·Filed 2019·Granted Mar 16, 2021·6 cites·13 claims
- 3788US12043862B2High-throughput serotyping and antibody profiling assaysENCODIA INC·Filed 2022·Granted Jul 23, 2024·1 cites·22 claims
- 3888US11756629B2Memory device and asynchronous multi-plane independent read operation thereofYANGTZE MEMORY TECH CO LTD·Filed 2021·Granted Sep 12, 2023·2 cites·20 claims
- 3988US10072218B2Pyrolysis tar conversionEXXONMOBIL CHEMICAL PATENTS INC·Filed 2017·Granted Sep 11, 2018·6 cites·25 claims
- 4088US9650442B2Bispecific anti-EGFR/anti IGF-1R antibodiesROCHE GLYCART AG·Filed 2014·Granted May 16, 2017·14 cites·6 claims
- 4188US9218987B2Method for top-side cooled semiconductor package with stacked interconnection platesALPHA & OMEGA SEMICONDUCTOR·Filed 2014·Granted Dec 22, 2015·7 cites·3 claims
- 4288US2024409952A1Herbicide tolerance genes and methods of use thereofMONSANTO TECHNOLOGY LLC·Filed 2024·Application pending·0 cites
- 4387US12467049B2Methods and kits using nucleic acid encoding and/or labelENCODIA INC·Filed 2024·Granted Nov 11, 2025·0 cites·29 claims
- 4487US12368317B2Energy storage apparatus, energy storage apparatus control method, and photovoltaic systemHUAWEI DIGITAL POWER TECH CO LTD·Filed 2023·Granted Jul 22, 2025·1 cites·12 claims
- 4587US9548282B2Metal contact for semiconductor deviceNANTONG FUJITSU MICROELECT CO·Filed 2013·Granted Jan 17, 2017·10 cites·6 claims
- 4687US9280020B2Tunable electrode-optic liquid crystal lenses having resistive bridges and methods for forming the lensesBOS PHILIP·Filed 2010·Granted Mar 8, 2016·9 cites·29 claims
- 4787US8630441B2Multi-magnetic speakerSHI LEI·Filed 2011·Granted Jan 14, 2014·13 cites·6 claims
- 4886US12049636B2Herbicide tolerance genes and methods of use thereofMONSANTO TECHNOLOGY LLC·Filed 2023·Granted Jul 30, 2024·0 cites·23 claims
- 4986US10836725B2Modulators of the integrated stress pathwayCALICO LIFE SCIENCES LLC·Filed 2017·Granted Nov 17, 2020·2 cites·13 claims
- 5086US10320076B2Antenna transmission device and antennaTONGYU COMMUNICATION INC·Filed 2016·Granted Jun 11, 2019·9 cites·18 claims
Showing the top 50 of 500 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →