Inventor · disambiguated record
Taro Shimoda
Also filed as: SHIMODA TARO
1 granted patent·2 pending applications·0 citations·filing 2007–2016
12Inventor score
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3 records- 0140US2008070054A1Set of resin compositions for preparing system-in-package type semiconductor deviceSHINETSU CHEMICAL CO·Filed 2007·Application pending·0 cites
- 0238US9018281B2Set of resin compositions for preparing system-in-package type semiconductor deviceSUMITA KAZUAKI·Filed 2011·Granted Apr 28, 2015·0 cites·5 claims
- 0327US2017088710A1Heat-curable silicone resin composition, optical semiconductor device and semiconductor package using molded product of sameSHINETSU CHEMICAL CO·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →